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公开(公告)号：US20160211407A1
公开(公告)日：2016-07-21
申请号：US15083637
申请日：2016-03-29
Inventor： CHEN-HSIU LIN
IPC: H01L33/00
CPC classification number: H01L33/005 , H01L25/0753 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0058 , H01L2933/0066 , H01L2924/00
Abstract: An LED carrier includes a substrate, a metallic layer, an insulating layer, and a reflecting layer. The metallic layer is disposed on the substrate and has a die bonding region and a ring-shaped wiring region separated from the die bonding region. A region arranged between the die bonding region and the ring-shaped wiring region is defined as an insulating region. The insulating layer at least partially covers the insulating region. The reflecting layer is arranged above the die bonding region and at least partially covers the top surface of the insulating layer. Moreover, the instant disclosure also provides a manufacturing method of an LED carrier.
Abstract translation: LED载体包括基板，金属层，绝缘层和反射层。 金属层设置在基板上，并且具有与芯片接合区域分离的芯片接合区域和环形布线区域。 布置在管芯接合区域和环形布线区域之间的区域被定义为绝缘区域。 绝缘层至少部分地覆盖绝缘区域。 反射层设置在芯片接合区域上方，并且至少部分地覆盖绝缘层的顶表面。 此外，本公开还提供了LED载体的制造方法。
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公开(公告)号：US20150311414A1
公开(公告)日：2015-10-29
申请号：US14642400
申请日：2015-03-09
Inventor： CHEN-HSIU LIN
CPC classification number: H01L33/005 , H01L25/0753 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0058 , H01L2933/0066 , H01L2924/00
Abstract: An LED carrier includes a substrate, a metallic layer, an insulating layer, and a reflecting layer. The metallic layer is disposed on the substrate and has a die bonding region and a ring-shaped wiring region separated from the die bonding region. A region arranged between the die bonding region and the ring-shaped wiring region is defined as an insulating region. The insulating layer at least partially covers the insulating region. The reflecting layer is arranged above the die bonding region and at least partially covers the top surface of the insulating layer. Moreover, the instant disclosure also provides a manufacturing method of an LED carrier.
Abstract translation: LED载体包括基板，金属层，绝缘层和反射层。 金属层设置在基板上，并且具有与芯片接合区域分离的芯片接合区域和环形布线区域。 布置在管芯接合区域和环形布线区域之间的区域被定义为绝缘区域。 绝缘层至少部分地覆盖绝缘区域。 反射层设置在芯片接合区域上方，并且至少部分地覆盖绝缘层的顶表面。 此外，本公开还提供了LED载体的制造方法。
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公开(公告)号：US20250155281A1
公开(公告)日：2025-05-15
申请号：US19019483
申请日：2025-01-14
Applicant: LITE-ON TECHNOLOGY CORPORATION
Inventor： CHEN-HSIU LIN , BO-JHIH CHEN
Abstract: A photoelectric sensor includes a housing, a light-emitting module, a light-receiving module, and two adhesive members. The housing including a first upright portion, a second upright portion, and a base portion. The first upright portion has a first concave structure and a first opening. The first concave structure includes a first side wall and a first outer wall. The second upright portion has a second concave structure and a second opening. The second concave structure includes a second side wall and a second outer wall. The light-emitting module is embedded in the first concave structure. The light-emitting module and the light-receiving module are embedded in the second concave structure through the two adhesive members, respectively. The light-emitting module includes a light-emitting element, and the light-receiving module includes a light-receiving element. The light-emitting element corresponds to the first opening, and the light-receiving element corresponds to the second opening.
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公开(公告)号：US20240247773A1
公开(公告)日：2024-07-25
申请号：US18628912
申请日：2024-04-08
Inventor： CHEN-HSIU LIN , CHENG-YING LEE , MING-SUNG TSAI
IPC: F21S41/19 , F21V23/00 , F21W107/00 , H01L25/16 , H01L33/62
CPC classification number: F21S41/192 , F21V23/005 , H01L25/167 , H01L33/62 , F21W2107/00
Abstract: A package structure includes a carrier, a frame, and at least one photonic device. The carrier includes a substrate and a plurality of first metal pads and second metal pads. The substrate includes a first surface and a second surface that are opposite to each other. The first metal pads are disposed on the first surface. The second metal pads are disposed on the second surface. A thickness of each of the second metal pads is greater than that of each of the first metal pads. The frame is disposed on the carrier, and an accommodating space is formed between the frame and the carrier. The at least one photonic device is disposed in the accommodating space.
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公开(公告)号：US20220367773A1
公开(公告)日：2022-11-17
申请号：US17742479
申请日：2022-05-12
Applicant: LITE-ON TECHNOLOGY CORPORATION
Inventor： CHEN-HSIU LIN , BO-JHIH CHEN , CHIEN-SHUN HUANG
Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a carrier, a metal member, an insulating layer, an optoelectronic element, and an adhesive. The metal member is disposed on the carrier. The insulating layer is disposed on the metal member. The insulating layer has a plurality of grooves, and a carrying region is defined by the grooves. The optoelectronic element is disposed on the insulating layer. The adhesive is filled into the grooves and bonds the optoelectronic element onto the carrying region of the insulating layer.
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Patent Agency Ranking
公开(公告)号：US20210398865A1
公开(公告)日：2021-12-23
申请号：US17467315
申请日：2021-09-06
Inventor： CHEN-HSIU LIN , WEN-HSIANG LIN , CHUNG-HSIEN YU
Abstract: A light emitting device includes a circuit substrate, a plurality of light emitting elements, a control element, and a sealing structure. The circuit substrate has a plurality of upper electrical connecting pads at the top thereof and a plurality of testing pads and a plurality of lower electrical connecting pads at the bottom thereof. The light emitting elements are arranged on the circuit substrate. The control element is arranged on the circuit substrate and electrically connected to the light emitting elements. The sealing structure is configured to cover the light emitting elements and the control element, and the testing pads of the circuit substrate are exposed from the sealing structure for testing respective characteristic parameter values of the light emitting elements.
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公开(公告)号：US20210272945A1
公开(公告)日：2021-09-02
申请号：US17323012
申请日：2021-05-18
Inventor： CHEN-HSIU LIN , TSUNG-KANG YING , ERH-CHAN HSU
IPC: H01L25/16 , H01L21/56 , H01L23/498 , H01L23/00 , H01L23/13
Abstract: A multiple pixel package structure with a buried chip and an electronic device using the same are provided. The multiple pixel package structure includes a multi-layered circuit board, a plurality of pixels, a protective layer, and a control chip. The pixels are arranged on the multi-layered circuit board and into an array. Each of the pixels includes a plurality of light emitting elements of different colors. The protective layer is formed on the multi-layered circuit board and covers the pixels. The control chip is buried in the multi-layered circuit board and electrically connected to the light emitting elements of each of the pixels, so as to allow each of the pixels to produce a target luminous characteristic.
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公开(公告)号：US20210050333A1
公开(公告)日：2021-02-18
申请号：US16991157
申请日：2020-08-12
Inventor： CHEN-HSIU LIN , YU-YU CHANG , CHIEN-SHUN HUANG
IPC: H01L25/075 , H01L33/62
Abstract: A light emitting device is provided. The light emitting device includes a package structure, a first light emitting chip, a second light emitting chip, a third light emitting chip, a first encapsulant, a second encapsulant, and a third encapsulant. The first light emitting chip, the second light emitting chip, and the third light emitting chip are disposed in a first cavity, a second cavity, and a third cavity of a body of the package structure, and electrically connected with a first electrode pair, a second electrode pair, and a third electrode pair that are covered by the body. The first encapsulant, the second encapsulant, and the third encapsulant are filled in the first cavity, the second cavity, and the third cavity. A first opening of the first cavity is larger in size than a second opening of the second cavity and a third opening of the third cavity.
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29.发明申请公开(公告)号：US20190189880A1
公开(公告)日：2019-06-20
申请号：US16127357
申请日：2018-09-11
Applicant: LITE-ON TECHNOLOGY CORPORATION
Inventor： CHEN-HSIU LIN
Abstract: The present disclosure discloses a light emitting diode (LED) package structure, a heat-dissipating substrate, and a method for manufacturing a heat-dissipating substrate. The heat-dissipating substrate includes a first heat-dissipating block, a heat-dissipating plate and a second heat-dissipating block, spaced apart each other, and a lateral insulating member connected to thereof so as to electrically isolate the first heat-dissipating block, the second heat-dissipating block, and the heat-dissipating plate from each other. The first heat-dissipating block, the second heat-dissipating block, and the heat-dissipating plate each has two protrusions respectively formed on two opposite surfaces thereof. A height of each of the protrusions is at a micro level.
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公开(公告)号：US20190088842A1
公开(公告)日：2019-03-21
申请号：US16192111
申请日：2018-11-15
Inventor： CHEN-HSIU LIN , TSUNG-KANG YING , PIN-FENG HUNG
Abstract: An LED package structure includes a multilayer circuit board, an LED chip, and a cover. The multilayer circuit board has a conductive layer, a first resin layer disposed on the conductive layer, and a first circuit layer disposed on the first resin layer. The first resin layer has a first opening, and a portion of the conductive layer is partially exposed from the first resin layer via the first opening such that a mounting region is exposed. The first circuit layer has a second opening, and the second opening exposes the mounting region. The LED chip is fixed on the mounting region by passing it through the first and second openings, and the LED chip is connected to the first circuit layer by wires. The cover is disposed on the first resin layer and covers the LED chip and the first circuit layer.
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