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公开(公告)号：US20250143046A1
公开(公告)日：2025-05-01
申请号：US18926327
申请日：2024-10-25
Applicant: LITE-ON TECHNOLOGY CORPORATION
Inventor： HSIN-HUI LIANG , CHENG-HONG SU , CHEN-HSIU LIN , CHIH-LI YU , CHENG-HAN WANG , SHENG-YUN WANG
Abstract: A light emitting diode package structure includes one or more lead frame units, a light emitting element, and an encapsulation unit that completely covers the light emitting element and partially covers the lead frame units. Each lead frame unit includes a chip-mounted portion, a first electrode portion, and a second electrode portion. The first and the second electrode portion extend along a first direction, and are disposed on two sides of the chip-mounted portion. Each lead frame unit further includes multiple first connecting portions extending from the chip-mounted portion along the first direction, and multiple second connecting portions formed by extension of the first and the second electrode portion along a second direction. The light emitting element is fixed to the chip-mounted portion and electrically connected to the electrode portions. A lead frame that includes the at least one lead frame unit is also provided.
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公开(公告)号：US20210125973A1
公开(公告)日：2021-04-29
申请号：US16935424
申请日：2020-07-22
Inventor： CHIEN-FENG KAO , CHEN-HSIU LIN , WEN-HSIANG LIN
Abstract: A light-emitting package structure and a manufacturing method thereof are provided. The light-emitting package structure includes a driving device and at least one light-emitting chip. The driving device includes a driving chip and a redistribution layer structure formed over the driving chip. The driving chip has a first surface and a second surface opposite to the first surface. The redistribution layer structure includes a plurality of first conductive pads disposed on the first surface and a plurality of second conductive pads disposed on the second surface, and one of the first conductive pads is electrically connected to one of the second conductive pads. The at least one light-emitting chip is disposed on the first surface of the driving chip and electrically connected to the driving chip through the first conductive pads.
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公开(公告)号：US20200373471A1
公开(公告)日：2020-11-26
申请号：US16865157
申请日：2020-05-01
Inventor： CHEN-HSIU LIN , WEN-HSIANG LIN , CHUNG-HSIEN YU
IPC: H01L33/62 , H01L23/538 , H01L25/16 , H01L33/60 , H01L33/52 , H01L25/075 , G01R31/26 , G01R31/27
Abstract: An LED package structure includes a multilayered circuit board, a plurality of lighting elements, a control unit, a reflecting unit, a package unit, a plurality of test paths and a plurality of operation paths. The multilayered circuit board includes a plurality of testing pads, a first electrical connecting pad and a plurality of second electrical connecting pads. The lighting elements are disposed on the multilayered circuit board. The control unit is electrically connected to the lighting elements. The reflecting unit is disposed on the multilayered circuit board and surrounds the lighting elements. The package unit covers the lighting elements. The test paths are in electrical connection with the first electrical connecting pad, the lighting elements and one of the testing pads. The operation paths are in electrical connection with the first electrical connecting pad, the control unit, the lighting elements and one of the second electrical connecting pads.
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公开(公告)号：US20200152847A1
公开(公告)日：2020-05-14
申请号：US16747306
申请日：2020-01-20
Applicant: LITE-ON TECHNOLOGY CORPORATION
Inventor： CHEN-HSIU LIN
Abstract: The present disclosure discloses a light emitting diode (LED) package structure, a heat-dissipating substrate, a method for manufacturing an LED package structure, and a method for manufacturing a heat-dissipating substrate. The method for manufacturing the heat-dissipating substrate includes: providing a metal plate having a top surface and a bottom surface; implementing an etching process on the metal plate so as to form a first heat-dissipating block, a second heat-dissipating block, and a heat-dissipating plate spaced apart from each other; and filling an insulating material between the heat-dissipating plate and the first heat-dissipating block and between the heat-dissipating plate and the second heat-dissipating block so as to electrically isolate the heat-dissipating plate, the first heat-dissipating block, and the second heat-dissipating block from each other.
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公开(公告)号：US20220320058A1
公开(公告)日：2022-10-06
申请号：US17686472
申请日：2022-03-04
Applicant: LITE-ON TECHNOLOGY CORPORATION
Inventor： CHEN-HSIU LIN , SHIRLEY SIA
IPC: H01L25/16 , H01L31/02 , H01L31/0203 , H01L31/0232 , H01L33/48 , H01L33/60 , H01L33/62
Abstract: An optoelectronic package structure and a photo-interrupting device are provided. The photo-interrupting device includes a casing and two optoelectronic package structures oppositely arranged. The optoelectronic package structure includes a housing, a first lead frame, a second lead frame, an optoelectronic element, and a sealing element. The optoelectronic element is disposed on the first lead frame and is electrically connected to the second lead frame through a conducting wire. The housing encapsulates one part of each of the first lead frame and the second lead frame. Another part of each of the first lead frame and the second lead frame correspondingly protrudes from one end of the housing having an opening arranged on a first surface, and the optoelectronic element is exposed through the opening. The sealing element covers the optoelectronic element, and a surface of the sealing element is not higher than the first surface of the housing.
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Patent Agency Ranking
公开(公告)号：US20210364687A1
公开(公告)日：2021-11-25
申请号：US17323051
申请日：2021-05-18
Inventor： CHENG-HAN WANG , SZU-TSUNG KAO , CHIH-LI YU , CHENG-HONG SU , CHUN-WEI HUANG , CHEN-HSIU LIN
IPC: F21V8/00
Abstract: A light-emitting device and a light emitting module are provided. The light emitting module includes a housing, at least one light guide element, and at least one light emitting element. The housing includes at least one passage passing through its a first surface and a second surface, and a coupling portion formed on an inner surface adjacent to the second surface. The light guide element arranged in the at least one passage has a light emergent surface exposed at one end of the at least one passage and a light incident surface exposed at the other end of the at least one passage. The light emitting element is coupled to the housing by the coupling portion. The light emitting element includes a light emitting surface facing to the light incident surface of the light guide element and a soldering portion exposed from the housing.
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公开(公告)号：US20210301993A1
公开(公告)日：2021-09-30
申请号：US17216827
申请日：2021-03-30
Inventor： CHEN-HSIU LIN , CHENG-YING LEE , MING-SUNG TSAI
Abstract: A package structure including a carrier, a photonic device, a supporting frame, and an encapsulant is provided. The photonic device is disposed on the carrier. The supporting frame is disposed on the carrier and surrounds the photonic device. The encapsulant covers the supporting frame and surrounds the photonic device.
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公开(公告)号：US20200066955A1
公开(公告)日：2020-02-27
申请号：US16547308
申请日：2019-08-21
Inventor： CHEN-HSIU LIN , YU-YU CHANG
Abstract: The present disclosure provides an LED package structure, a carrier, and a method for manufacturing a carrier. The carrier includes a substrate and an electrode layer disposed on the substrate. The electrode layer includes at least one bonding portion that has a plurality of elongated microstructures recessed in a surface thereof.
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公开(公告)号：US20200041111A1
公开(公告)日：2020-02-06
申请号：US16273628
申请日：2019-02-12
Inventor： CHEN-HSIU LIN , MING-KUN WENG
Abstract: An LED package structure includes an LED frame, a driver frame unit, a housing, LED chips, a driver chip, and a light-permeable package body. The LED frame includes a carrying segment and two bent leads connected to the carrying segment. The driver frame unit includes two side frames each having a functional segment and a bent lead. The housing has a cavity exposing the carrying segment and the two functional segments. The bent leads protrude from a lateral surface of the housing, and curvedly extend to a bottom surface of the housing. The LED chips are mounted on the carrying segment. The driver chip is fixed to one of the two functional segments, and is electrically connected to the other functional segment and the LED chips. The light-permeable package body is filled in the cavity so as to embed the LED chips and the driver chip.
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公开(公告)号：US20190264890A1
公开(公告)日：2019-08-29
申请号：US16252468
申请日：2019-01-18
Inventor： YU-YU CHANG , YUNG-CHANG JEN , CHEN-HSIU LIN
IPC: F21V5/00
Abstract: A miniaturized structured light projection module is provided. The miniaturized structured light projection module includes a light source assembly and a projecting lens. The light source assembly has a plurality of light source units, each of which is provided with a default projected pattern on its surface. The projecting lens is disposed above the light source units. The default projected patterns of the light source units are disposed on a front focal plane of the projecting lens.
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