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公开(公告)号：US20240377247A1
公开(公告)日：2024-11-14
申请号：US18780495
申请日：2024-07-23
Applicant: LITE-ON TECHNOLOGY CORPORATION
Inventor： BO-JHIH CHEN , CHUNG-CHAN WU , MENG-SUNG CHOU
IPC: G01J1/08 , F21K9/90 , F21V5/00 , F21V17/10 , F21Y105/16 , F21Y113/10 , G01J1/04 , G01J1/42 , G03B21/14 , G03B21/20 , G03B21/26 , H05B35/00
Abstract: An optoelectronic device includes a substrate, a light emitting/receiving unit, a mask, a light shielding layer, and a first light-transmissive component. The light emitting/receiving unit is disposed on the substrate and includes an emitting/receiving side and a metal pattern disposed on the emitting/receiving side. The emitting/receiving side has an active area, and the metal pattern surrounds the active area. The mask covers the metal pattern. The light shielding layer is disposed on the substrate and surrounds the light emitting/receiving unit. The first light-transmissive component covers the light emitting/receiving unit, the mask, and the light shielding layer.
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公开(公告)号：US20250155281A1
公开(公告)日：2025-05-15
申请号：US19019483
申请日：2025-01-14
Applicant: LITE-ON TECHNOLOGY CORPORATION
Inventor： CHEN-HSIU LIN , BO-JHIH CHEN
Abstract: A photoelectric sensor includes a housing, a light-emitting module, a light-receiving module, and two adhesive members. The housing including a first upright portion, a second upright portion, and a base portion. The first upright portion has a first concave structure and a first opening. The first concave structure includes a first side wall and a first outer wall. The second upright portion has a second concave structure and a second opening. The second concave structure includes a second side wall and a second outer wall. The light-emitting module is embedded in the first concave structure. The light-emitting module and the light-receiving module are embedded in the second concave structure through the two adhesive members, respectively. The light-emitting module includes a light-emitting element, and the light-receiving module includes a light-receiving element. The light-emitting element corresponds to the first opening, and the light-receiving element corresponds to the second opening.
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公开(公告)号：US20220367773A1
公开(公告)日：2022-11-17
申请号：US17742479
申请日：2022-05-12
Applicant: LITE-ON TECHNOLOGY CORPORATION
Inventor： CHEN-HSIU LIN , BO-JHIH CHEN , CHIEN-SHUN HUANG
Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a carrier, a metal member, an insulating layer, an optoelectronic element, and an adhesive. The metal member is disposed on the carrier. The insulating layer is disposed on the metal member. The insulating layer has a plurality of grooves, and a carrying region is defined by the grooves. The optoelectronic element is disposed on the insulating layer. The adhesive is filled into the grooves and bonds the optoelectronic element onto the carrying region of the insulating layer.
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公开(公告)号：US20210148753A1
公开(公告)日：2021-05-20
申请号：US17095078
申请日：2020-11-11
Inventor： BO-JHIH CHEN , ZI-JUN LIN , KUO-MING CHIU , YUNG-CHANG JEN , MENG-SUNG CHOU , CHANG-HUNG HSIEH
Abstract: A light sensing module and an electronic device using the same are provided. The light sensing module includes a substrate, a light sensing unit, a first light-transmissive component and a blocking wall. The light sensing unit is disposed on the substrate to sense an intensity of a working light beam. The first light-transmissive component covers the light sensing unit, and has a first refractive index that is between a refractive index of the light sensing unit and a refractive index of air. The blocking wall is disposed on the substrate, and surrounds the light sensing unit and the first light-transmissive component.
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Patent Agency Ranking
公开(公告)号：US20240345284A1
公开(公告)日：2024-10-17
申请号：US18601969
申请日：2024-03-11
Applicant: LITE-ON TECHNOLOGY CORPORATION
Inventor： SHENG-YUN WANG , CHEN-HSIU LIN , BO-JHIH CHEN
IPC: G01V8/12
CPC classification number: G01V8/12
Abstract: The photoelectric sensor includes a housing, a light-emitting module, a light-receiving module, and two adhesive members. The housing includes a first upright portion, a second upright portion, and a base. The first upright portion and the second upright portion are connected to the base, the first upright portion has a first concave structure and a first opening, and the second upright portion has a second concave structure and a second opening. The light-emitting module includes a first circuit board and a light-emitting element and is embedded in the first concave structure. The light-emitting element corresponds to the first opening. The light-receiving module includes a second circuit board and a light-receiving element and is embedded in the second concave structure. The light-receiving element corresponds to the second opening. The two adhesive members are respectively provided on side walls of the first concave structure and the second concave structure.
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公开(公告)号：US20230228620A1
公开(公告)日：2023-07-20
申请号：US18187545
申请日：2023-03-21
Inventor： BO-JHIH CHEN , ZI-JUN LIN , KUO-MING CHIU , YUNG-CHANG JEN , MENG-SUNG CHOU , CHANG-HUNG HSIEH
CPC classification number: G01J1/4257 , G01J1/0474
Abstract: A light sensing module includes a substrate, a light sensing unit, a first light-transmissive component, and a light shielding layer. The light sensing unit is disposed on the substrate to sense an intensity of a working light beam, and has an upper light receiving surface and a lateral surface perpendicular to the upper light receiving surface. The first light-transmissive component covers the light sensing unit, and has a first refractive index between a refractive index of the light sensing unit and a refractive index of air. The light shielding layer surrounds the lateral surface and is covered by the first light-transmissive component.
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公开(公告)号：US20210367086A1
公开(公告)日：2021-11-25
申请号：US17326356
申请日：2021-05-21
Inventor： CHIEN-HSIU HUANG , BO-JHIH CHEN , KUO-MING CHIU , MENG-SUNG CHOU , Wei-Te Cheng , Kai-Chieh Liang , YUN-TA CHEN , YU-HAN WANG
IPC: H01L31/0203 , H01L31/02 , H01L31/18
Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.
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公开(公告)号：US20210367085A1
公开(公告)日：2021-11-25
申请号：US17324267
申请日：2021-05-19
Inventor： Wei-Te Cheng , Kai-Chieh Liang , Jie-Ting Tsai , BO-JHIH CHEN , ZI-JUN LIN , KUO-MING CHIU
IPC: H01L31/0203 , H01L25/16 , H01L31/0232 , H01L31/09 , H01L31/108
Abstract: An optical sensor structure is provided. The optical sensor structure includes a substrate, a light sensing unit, a peripheral wall, and a reflective layer. The substrate includes a plurality of metal pads. The light sensing unit is disposed on the substrate and electrically connected to the plurality of metal pads. The peripheral wall is disposed on the substrate, and the peripheral wall and the substrate define an accommodating space. The metal pads and the light sensing unit are positioned in the accommodating space. The reflective layer is disposed in the accommodating space and surrounds the light sensing unit.
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公开(公告)号：US20200235255A1
公开(公告)日：2020-07-23
申请号：US16738796
申请日：2020-01-09
Inventor： CHEN-HSIU LIN , SHIH-CHUNG HUANG , BO-JHIH CHEN
IPC: H01L31/101 , H01L31/02
Abstract: An optical sensor module includes a first frame set, a second frame set and a housing which partially covers the first frame set and the second frame set. The first frame set has a first chip-mounting frame and a first wiring frame. The first chip-mounting frame has a first chip-mounting section, and a first conductive lead. At least one first indentation is formed on the first chip-mounting section. The second frame set has a second chip-mounting frame and a second wiring frame. The second chip-mounting frame has a second chip-mounting section and a second conductive lead. At least one second indentation is formed on the second chip-mounting section.
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