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公开(公告)号:US20130242650A1
公开(公告)日:2013-09-19
申请号:US13886564
申请日:2013-05-03
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Aswin Thiruvengadam , William Melton , Rich Fackenthal , Andrew Oen
IPC: G11C13/00
CPC classification number: G11C13/0009 , G11C13/0004 , G11C13/0069
Abstract: A memory device and method for programming the memory device, including a method for a melting phase change memory cell by applying an electronic signal at a first value and subsequently decreasing the signal value. The phase change memory cell can be substantially crystallized after the decrease in signal value.
Abstract translation: 一种用于对存储器件进行编程的存储器件和方法,包括通过以第一值施加电子信号并随后减小信号值来解耦相变存储器单元的方法。 在信号值下降之后,相变存储单元可以基本上结晶。
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公开(公告)号:US12032833B2
公开(公告)日:2024-07-09
申请号:US17943082
申请日:2022-09-12
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Aswin Thiruvengadam , Vamsi Pavan Rayaprolu
IPC: G06F3/06
CPC classification number: G06F3/0619 , G06F3/0655 , G06F3/0679
Abstract: Systems and methods are disclosed including a memory device and a processing device operatively coupled to the memory device. The processing device can perform operations including running sample data through each of a set of error-handling operations performed on data residing in a segment of the memory device in an existing order associated with a workload; obtaining error recovery data as a result of running the sample data; and determining an optimized order of the set of error-handling operations based on probability of error recovery and latency data, wherein the probability of error recovery is based on the error recovery data, and wherein the optimized order comprises an adjustment to an order of one or more error-handling operations of the set of error-handling operations in the existing order.
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公开(公告)号:US20240055046A1
公开(公告)日:2024-02-15
申请号:US17819567
申请日:2022-08-12
Applicant: Micron Technology, Inc.
Inventor: Vamsi Pavan Rayaprolu , Aswin Thiruvengadam
IPC: G11C11/4096 , G11C11/4076 , G11C7/24
CPC classification number: G11C11/4096 , G11C11/4076 , G11C7/24
Abstract: Methods, systems, and devices for a model for predicting memory system performance are described. A memory system may generate a set of read commands and perform a first set of read operations at a memory device according to the generated read commands. The memory system may generate information indicating a performance of the memory device based on the first set of read operations and may update one or more coefficients of a model that correlates the information with a change in a read window. In some cases, the memory system may model the change in a read window based on the information and update one or more parameters associated with read operations based on the modelled change in the read window. The memory system may perform a second set of read operations at the memory device using the one or more updated parameters.
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公开(公告)号:US11854634B2
公开(公告)日:2023-12-26
申请号:US17007499
申请日:2020-08-31
Applicant: Micron Technology, Inc.
Inventor: Aswin Thiruvengadam , Daniel L Lowrance , Peter Feeley
IPC: G11C29/02 , G11C16/10 , G11C16/32 , G11C16/34 , G06F12/02 , G06F3/06 , G11C7/10 , G06F16/18 , G11C7/04 , G11C29/44
CPC classification number: G11C29/028 , G06F3/0652 , G06F12/0246 , G06F12/0292 , G06F16/1847 , G11C7/1072 , G11C16/10 , G11C16/32 , G11C16/3495 , G06F2212/7209 , G11C7/04 , G11C2029/4402
Abstract: The present disclosure includes apparatuses and methods related to selectable trim settings on a memory device. An example apparatus can store a number of sets of trim settings and select a particular set of trims settings of the number of sets of trim settings based on desired operational characteristics for the array of memory cells.
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公开(公告)号:US11853207B2
公开(公告)日:2023-12-26
申请号:US17336492
申请日:2021-06-02
Applicant: Micron Technology, Inc.
Inventor: Aswin Thiruvengadam , Daniel L. Lowrance , Peter Feeley
IPC: G11C16/20 , G11C16/32 , G11C16/34 , G06F12/02 , G06F13/16 , G11C11/406 , G06F16/18 , G11C7/20 , G11C29/26 , G11C29/02 , G11C29/04
CPC classification number: G06F12/0292 , G06F12/0246 , G06F13/1694 , G06F16/1847 , G11C7/20 , G11C11/40607 , G11C16/20 , G11C16/32 , G11C16/3459 , G11C29/028 , G11C29/26 , G06F2212/7208 , G06F2212/7209 , G11C2029/0409 , G11C2211/5641
Abstract: The present disclosure includes apparatuses and methods related to configurable trim settings on a memory device. An example apparatus can include configuring a set of trim settings for an array of memory cells such that the array of memory cells have desired operational characteristics in response to being operated with the set of trim settings.
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公开(公告)号:US11808803B2
公开(公告)日:2023-11-07
申请号:US17976607
申请日:2022-10-28
Applicant: Micron Technology, Inc.
Inventor: Daniel G. Scobee , Aleksandr Semenuk , Aswin Thiruvengadam
CPC classification number: G01R31/2817 , H05K1/181 , H05K7/20 , H05K2201/10219
Abstract: A thermal chamber multiple sides that form an enclosed chamber. The thermal chamber includes a first side of the multiple sides, the first side configured to adjustably mount an electronic circuit board within the enclosed chamber. The thermal chamber includes a second side of the multiple sides, the second side located opposite the first side and including one or more ports that expose the enclosed chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy locally to and from a plurality of electronic devices of an electronic system that is coupled to and positioned above the electronic circuit board.
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公开(公告)号:US20220138100A1
公开(公告)日:2022-05-05
申请号:US17575998
申请日:2022-01-14
Applicant: Micron Technology, Inc.
Inventor: Aswin Thiruvengadam , Daniel L. Lowrance , Peter Feeley
IPC: G06F12/02 , G11C11/406 , G11C16/20 , G11C16/34 , G06F13/16 , G11C16/32 , G06F16/18 , G11C7/20 , G11C29/02
Abstract: The present disclosure includes apparatuses and methods related to determining trim settings on a memory device. An example apparatus can determine a set of trim settings for the array of memory cells based on the operational characteristics of the array of memory cells, wherein the set of trim settings are associated with desired operational characteristics for the array of memory cells.
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公开(公告)号:US11295209B2
公开(公告)日:2022-04-05
申请号:US16722507
申请日:2019-12-20
Applicant: Micron Technology, Inc.
Inventor: Aswin Thiruvengadam , Daniel L. Lowrance , Joshua Phelps , Peter B. Harrington
Abstract: Disclosed is a system comprising a memory component having a plurality of memory cells capable of being in a plurality of states, each state of the plurality of states corresponding to a value stored by the memory cell, and a processing device, operatively coupled with the memory component, to perform operations comprising: obtaining, for the plurality of memory cells, a plurality of distributions of threshold voltages, wherein each of the plurality of distributions corresponds to one of the plurality of states, classifying each of the plurality of distributions among one of a plurality of classes, generating a vector comprising a plurality of components, wherein each of the plurality of components represents the class of a respective one of the plurality of distributions, and processing, using a classifier, the generated vector to determine a likelihood that the memory component will fail within a target period of time.
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公开(公告)号:US11264112B2
公开(公告)日:2022-03-01
申请号:US17111755
申请日:2020-12-04
Applicant: Micron Technology, Inc.
Inventor: Aswin Thiruvengadam , Daniel L. Lowrance , Peter Feeley
Abstract: Apparatuses and methods related to a memory system including a controller and an array of memory cells are provided. An example apparatus can include a controller configured to receive operational characteristics of an array of memory cells based on prior operations performed by the array of memory cells, determine a set of trim settings for the array of memory cells based on the operational characteristics of the array of memory cells, wherein the set of trim settings are associated with desired operational characteristics for the array of memory cells, and send the set of trim settings to the array of memory cells.
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公开(公告)号:US11257565B2
公开(公告)日:2022-02-22
申请号:US17147072
申请日:2021-01-12
Applicant: Micron Technology, Inc.
Inventor: Aswin Thiruvengadam , Sivagnanam Parthasarathy , Daniel Scobee , Frederick Jensen
Abstract: Filter information including a first temperature level and a second temperature level associated with a test process to be executed on one or more memory components is determined. Information associated with the test process is distributed to a first test component including a first set of memory components and a first temperature control component and a second test component including a second set of memory components and a second temperature control component. First feedback information associated with execution of the test process by the first test component at the first temperature level established by the first temperature control component is received. Second feedback information associated with execution of the test process by the second test component at the second temperature level established by the second temperature control component is received. Based on at least one of the first feedback information or the second feedback information, a failure of the test process executed using at least one of the first temperature level or the second temperature level is determined.
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