公开(公告)号：US11127779B2

公开(公告)日：2021-09-21

申请号：US16633826

申请日：2018-07-31

Applicant: OSRAM OLED GmbH

Inventor： Peter Brick ,  Hubert Halbritter ,  Mikko Perälä ,  Frank Singer

IPC: H01L27/15 ,  H01L25/16 ,  H01L33/50

Abstract: A light-emitting semiconductor chip and a display device are disclosed. In an embodiment a light-emitting semiconductor chip includes an emission surface formed with a plurality of first emission regions and second emission regions, wherein the first emission regions and the second emission regions are configured to emit light of a predeterminable color location, wherein the first and second emission regions are separately controllable from each other, wherein the first emission regions and second emission regions are arranged next to one another in a first plane, wherein all second emission regions form at least a part of an outer edge of the emission surface, and wherein the first emission regions have a smaller extent than the second emission regions along at least one direction lying in the first plane.

公开(公告)号：US11038083B2

公开(公告)日：2021-06-15

申请号：US16323370

申请日：2017-08-04

Applicant: OSRAM OLED GmbH

Inventor： Frank Singer ,  Siegfried Herrmann

IPC: H01L33/24 ,  H01L33/08 ,  H01L33/38 ,  H01L33/40 ,  H01L33/44

Abstract: An optoelectronic semiconductor chip includes a plurality of core-shell rods that generate electromagnetic radiation spaced apart from each other; a first electrically conductive contact structure for n-side electrical contacting of the core-shell rods; and a second electrically conductive contact structure for p-side electrical contacting of the core-shell rods, wherein the first electrically conductive contact structure and the second electrically conductive contact structure overlap at least in sections in a vertical direction, the optoelectronic semiconductor chip is surface mountable on a mounting side, and at least a partial region of the two electrically conductive contact structures extends through a breakthrough through at least one layer of the optoelectronic semiconductor chip.

公开(公告)号：US20200286873A1

公开(公告)日：2020-09-10

申请号：US16753809

申请日：2018-09-25

Applicant: OSRAM OLED GmbH

Inventor： Thomas Schwarz ,  Frank Singer

IPC: H01L25/16 ,  H01L25/075 ,  H01L33/62 ,  H01L21/66 ,  H01L21/683

Abstract: A light-emitting component may include an IC chip and an LED chip arranged on a top surface of the IC chip and electrically coupled thereto. The LED chip may be electrically controllable by means of the IC chip. The IC chip may have at least two electrical connecting surface on a bottom surface remote from the LED chip. The light-emitting component is electrically contactable and operable by means of the connecting surfaces.

公开(公告)号：US11892651B2

公开(公告)日：2024-02-06

申请号：US17219943

申请日：2021-04-01

Applicant: OSRAM OLED GmbH

Inventor： Roland Enzmann ,  Hubert Halbritter ,  Markus Arzberger ,  Andreas Ploessl ,  Roland Schulz ,  Georg Rossbach ,  Bernd Boehm ,  Frank Singer ,  Matthias Sabathil

IPC: G02B27/09 ,  G02B5/18 ,  G02B3/00

CPC classification number: G02B27/0916 ,  G02B3/0075 ,  G02B5/1814 ,  G02B5/1857 ,  G02B5/1866 ,  G02B27/0944 ,  G02B27/0961

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip configured to emit electromagnetic radiation; an optically effective element arranged such that electromagnetic radiation emitted by the optoelectronic semiconductor chip passes through the optically effective element; and a housing, wherein the optoelectronic semiconductor chip is arranged in a cavity of the housing, the optically effective element includes a carrier, a first optically effective structure arranged on a top side of the carrier, and a cover arranged above the first optically effective structure.

公开(公告)号：US20240030677A1

公开(公告)日：2024-01-25

申请号：US18355572

申请日：2023-07-20

Applicant: OSRAM OLED GmbH

Inventor： Jörg Erich Sorg ,  Frank Singer ,  Christoph Koller

IPC: H01S5/02255 ,  H01S5/00 ,  H01S5/02234 ,  H01S5/02216 ,  H01S5/028 ,  H01S5/40 ,  H01S5/185

CPC classification number: H01S5/02255 ,  H01S5/0087 ,  H01S5/02234 ,  H01S5/02216 ,  H01S5/028 ,  H01S5/4012 ,  H01S5/4031 ,  H01S5/4075 ,  H01S5/185

Abstract: The invention relates to a semiconductor laser including a carrier, an edge-emitting laser diode which is arranged on the carrier and which has an active zone for generating laser radiation and a facet with a radiation exit area, an optical element which covers the facet, a connecting material which is arranged between the optical element and the facet, a molded body which covers the laser diode and the optical element at least in places, wherein the optical element is at least partially transparent to the laser radiation emitted by the laser diode during operation, and the optical element is designed to change the main propagation direction of the laser radiation entering the optical element during operation.

公开(公告)号：US11749959B2

公开(公告)日：2023-09-05

申请号：US17261300

申请日：2019-07-15

Applicant: OSRAM OLED GmbH

Inventor： Jörg Erich Sorg ,  Frank Singer ,  Christoph Koller

IPC: H01S5/02255 ,  H01S5/00 ,  H01S5/02234 ,  H01S5/028 ,  H01S5/40 ,  H01S5/02216 ,  H01S5/185

CPC classification number: H01S5/02255 ,  H01S5/0087 ,  H01S5/028 ,  H01S5/02216 ,  H01S5/02234 ,  H01S5/185 ,  H01S5/4012 ,  H01S5/4031 ,  H01S5/4075

Abstract: The invention relates to a semiconductor laser including a carrier, an edge-emitting laser diode which is arranged on the carrier and which has an active zone for generating laser radiation and a facet with a radiation exit area, an optical element which covers the facet, a connecting material which is arranged between the optical element and the facet, a molded body which covers the laser diode and the optical element at least in places, wherein the optical element is at least partially transparent to the laser radiation emitted by the laser diode during operation, and the optical element is designed to change the main propagation direction of the laser radiation entering the optical element during operation.

公开(公告)号：US11508884B2

公开(公告)日：2022-11-22

申请号：US17181458

申请日：2021-02-22

Applicant: OSRAM OLED GmbH

Inventor： Markus Pindl ,  Thomas Schwarz ,  Frank Singer ,  Sandra Sobczyk

IPC: H01L33/54 ,  H01L33/00 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/50 ,  H01L33/48 ,  H01L33/56 ,  H01L21/56

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, including the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.

公开(公告)号：US20220115839A1

公开(公告)日：2022-04-14

申请号：US17645653

申请日：2021-12-22

Applicant: OSRAM OLED GmbH

Inventor： Frank Singer ,  Hubert Halbritter

IPC: H01S5/183 ,  H01S5/42 ,  H01S5/0225

Abstract: In an embodiment a laser diode includes a surface emitting semiconductor laser configured to emit electromagnetic radiation and an optical element arranged downstream of the semiconductor laser in a radiation direction, wherein the optical element includes a diffractive structure or a meta-optical structure or a lens structure, wherein the optical element and the semiconductor laser are cohesively connected to each other, and wherein the semiconductor laser and the optical element are integrated with the laser diode.

公开(公告)号：US11177248B2

公开(公告)日：2021-11-16

申请号：US16753809

申请日：2018-09-25

Applicant: OSRAM OLED GmbH

Inventor： Thomas Schwarz ,  Frank Singer

IPC: H01L25/16 ,  H01L21/683 ,  H01L21/66 ,  H01L25/075 ,  H01L33/62

Abstract: A light-emitting component may include an IC chip and an LED chip arranged on a top surface of the IC chip and electrically coupled thereto. The LED chip may be electrically controllable by means of the IC chip. The IC chip may have at least two electrical connecting surface on a bottom surface remote from the LED chip. The light-emitting component is electrically contactable and operable by means of the connecting surfaces.

公开(公告)号：US10686104B2

公开(公告)日：2020-06-16

申请号：US16240584

申请日：2019-01-04

Applicant: OSRAM OLED GMBH

Inventor： Markus Pindl ,  Thomas Schwarz ,  Frank Singer ,  Sandra Sobczyk

IPC: H01L33/54 ,  H01L33/00 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/50 ,  H01L33/48 ,  H01L33/56 ,  H01L21/56

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.