公开(公告)号：US11888017B2

公开(公告)日：2024-01-30

申请号：US17463557

申请日：2021-09-01

Applicant: PlayNitride Display Co., Ltd.

Inventor： Yu-Chu Li ,  Kuan-Yung Liao ,  Pei-Hsin Chen ,  Yi-Ching Chen ,  Yi-Chun Shih

IPC: H01L27/15 ,  H01L33/10 ,  H01L33/58

CPC classification number: H01L27/156 ,  H01L33/10 ,  H01L33/58

Abstract: A transparent display panel with a light-transmitting substrate, a plurality of top-emitting micro light emitting diodes, a plurality of bottom-emitting micro light emitting diodes, and a light shielding layer. The light transmissive substrate has a surface. These top-emitting micro light emitting diodes and these bottom-emitting micro light emitting diodes are disposed on the surface of the light transmissive substrate. The bottom-emitting micro light emitting diodes has an epitaxial structure and a light shielding member, the epitaxial structure has a pair of upper and lower surfaces on the opposite sides, the lower surface faces toward the light transmissive substrate, and the light shielding member is disposed on the upper surface to shield the light emitted by the bottom-emitting micro light emitting diodes towards the upper surface.

公开(公告)号：US11862614B2

公开(公告)日：2024-01-02

申请号：US17123140

申请日：2020-12-16

Applicant: PlayNitride Display Co., Ltd.

Inventor： Yu-Hung Lai ,  Yung-Chi Chu ,  Pei-Hsin Chen ,  Yi-Ching Chen ,  Yi-Chun Shih

IPC: H01L25/075 ,  H01L23/00 ,  H01L33/54 ,  H01L33/62 ,  H01L33/56 ,  H01L25/16

CPC classification number: H01L25/0753 ,  H01L24/81 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/81805 ,  H01L2924/12041 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A micro LED display device includes a substrate, micro LED units and a transparent insulation layer. The substrate includes conductive pads and conductive connecting portions. The conductive pads are disposed on the substrate. Each of the micro LED units includes a semiconductor epitaxial structure and electrodes. The electrodes are disposed on the semiconductor epitaxial structure, and each of the electrodes is connected to one of the conductive connecting portions adjacent to each other. The transparent insulation layer is disposed on the substrate and covers the conductive pads, the conductive connecting portions and the micro LED units, and the transparent insulation layer is filled between the electrodes of each of the micro LED units. The transparent insulation layer relative to a surface on each of the semiconductor epitaxial structures is of a first thickness and a second thickness, and the first thickness is different from the second thickness.

公开(公告)号：US11476149B2

公开(公告)日：2022-10-18

申请号：US17016423

申请日：2020-09-10

Applicant: PLAYNITRIDE DISPLAY CO., LTD.

Inventor： Pei-Hsin Chen ,  Yi-Chun Shih ,  Yi-Ching Chen

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/62

Abstract: The present invention discloses a substrate configured to receive a plurality of micro elements on a carrier board. The substrate comprises a body, a first conductive bump, and a second conductive bump. The body has a first surface, a transfer area is defined within the first surface, and a central portion and a peripheral portion is defined within the transfer area. The first conductive bump, disposed on the central portion, has a first volume. The second conductive bump, disposed on the peripheral portion, has a second volume. Wherein the first volume is different from the second volume.

公开(公告)号：US11417800B2

公开(公告)日：2022-08-16

申请号：US17179845

申请日：2021-02-19

Applicant: PlayNitride Display Co., Ltd.

Inventor： Ying-Tsang Liu ,  Pei-Hsin Chen ,  Yi-Chun Shih ,  Yi-Ching Chen ,  Yu-Chu Li ,  Tzu-Yang Lin ,  Yu-Hung Lai

IPC: H01L33/20 ,  H01L27/15 ,  H01L33/62 ,  H01L33/38

Abstract: A micro semiconductor device and a micro semiconductor display are provided. The micro semiconductor device includes an epitaxial structure, a first electrode, a second electrode and a supporting layer. The epitaxial structure has a bottom surface and a top surface, wherein the bottom surface is defined as a central region and a peripheral region. A first electrode and a second electrode are disposed on the central region of the bottom surface of the epitaxial structure, or the first electrode is disposed on the central region of the bottom surface of the epitaxial structure and the second electrode is disposed on the top surface of the epitaxial structure. The supporting layer is disposed on the peripheral region of the bottom surface of the epitaxial structure.

公开(公告)号：US20210399042A1

公开(公告)日：2021-12-23

申请号：US17463557

申请日：2021-09-01

Applicant: PlayNitride Display Co., Ltd.

Inventor： Yu-Chu Li ,  Kuan-Yung Liao ,  Pei-Hsin Chen ,  Yi-Ching Chen ,  Yi-Chun Shih

IPC: H01L27/15 ,  H01L33/58 ,  H01L33/10

Abstract: A transparent display panel with a light-transmitting substrate, a plurality of top-emitting micro light emitting diodes, a plurality of bottom-emitting micro light emitting diodes, and a light shielding layer. The light transmissive substrate has a surface. These top-emitting micro light emitting diodes and these bottom-emitting micro light emitting diodes are disposed on the surface of the light transmissive substrate. The bottom-emitting micro light emitting diodes has an epitaxial structure and a light shielding member, the epitaxial structure has a pair of upper and lower surfaces on the opposite sides, the lower surface faces toward the light transmissive substrate, and the light shielding member is disposed on the upper surface to shield the light emitted by the bottom-emitting micro light emitting diodes towards the upper surface.

公开(公告)号：US11056375B2

公开(公告)日：2021-07-06

申请号：US16720854

申请日：2019-12-19

Applicant: PlayNitride Display Co., Ltd.

Inventor： Pei-Hsin Chen ,  Yi-Ching Chen ,  Yu-Chu Li ,  Yi-Chun Shih ,  Ying-Tsang Liu ,  Yu-Hung Lai ,  Tzu-Yang Lin

IPC: H01L21/683 ,  H01L21/67 ,  H01L25/075 ,  H01L33/62

Abstract: A micro LED carrier board is provided. The micro LED carrier board includes a substrate structure having a first surface and a second surface and having a central region and a peripheral region on the outside of the central region. The micro LED carrier board includes a plurality of micro LED elements forming an array and on the second surface of the substrate structure. The micro LED carrier board includes a patterned structure formed on the first surface and the second surface. The patterned structure has a first pattern density in the central region and a second pattern density in the peripheral region, and the first pattern density is different from the second pattern density.

公开(公告)号：US20200185243A1

公开(公告)日：2020-06-11

申请号：US16581777

申请日：2019-09-25

Applicant: PlayNitride Display Co., Ltd.

Inventor： Pei-Hsin Chen ,  Yi-Chun Shih ,  Yi-Ching Chen ,  Ying-Tsang Liu ,  Yu-Chu Li ,  Huan-Pu Chang ,  Tzu-Yang Lin ,  Yu-Hung Lai

IPC: H01L21/673

Abstract: A carrier structure suitable for transferring or supporting a plurality of micro devices includes a carrier and a plurality of transfer units. The carrier has a carrier surface and a plurality of recesses disposed on the carrier surface. The transfer units are respectively disposed in the recesses and a plurality of transferring surfaces are exposed. Each micro device has a device surface. The transferring surface of each transfer unit is configured to be connected to the device surface of the corresponding micro device. A micro device structure including the carrier structure is also provided.

公开(公告)号：US20230299059A1

公开(公告)日：2023-09-21

申请号：US17851064

申请日：2022-06-28

Applicant: PlayNitride Display Co., Ltd.

Inventor： Chi-Heng Chen ,  Kuang-Yuan Hsu ,  Shen-Jie Wang ,  Jyun-De Wu ,  Yi-Ching Chen ,  Yi-Chun Shih

IPC: H01L25/075 ,  H01L33/10 ,  H01L33/38

CPC classification number: H01L25/0756 ,  H01L33/10 ,  H01L33/382 ,  H01L33/32

Abstract: A micro light-emitting diode includes a first stacked layer, a second stacked layer, a third stacked layer, a bonding layer, at least one etch stop layer, and a plurality of electrodes. The second stacked layer is disposed between the first stacked layer and the third stacked layer. The first stacked layer includes a first active layer. The second stacked layer includes a second active layer. The third stacked layer includes a third active layer. The bonding layer is disposed between the second stacked layer and the third stacked layer. The at least one etch stop layer is at least disposed between the first active layer and the second active layer. The plurality of electrodes are respectively electrically connected with the first stacked layer, the second stacked layer, and the third stacked layer. At least one electrode of the plurality of electrodes contacts the etch stop layer.

公开(公告)号：US11640967B2

公开(公告)日：2023-05-02

申请号：US17128226

申请日：2020-12-21

Applicant: PlayNitride Display Co., Ltd.

Inventor： Yu-Chu Li ,  Yi-Ching Chen

IPC: H01L27/15 ,  H01L33/62 ,  H01L33/24 ,  H01L33/22 ,  H01L33/38 ,  H01L33/60 ,  G09G3/32

Abstract: A micro light-emitting device display apparatus includes a driving substrate and a plurality of micro light-emitting devices. The micro light-emitting devices are disposed on the driving substrate. The micro light-emitting devices include a plurality of first, second and third micro light-emitting devices. Each of the first, the second and the third micro light-emitting devices respectively has a plurality of first, second, and third light-emitting regions independently controlled. A first light-emitting region of a first micro light-emitting device, a second light-emitting region of a second micro light-emitting device, and a third light-emitting region of a third micro light-emitting device are located in a first pixel region. A first light-emitting region of another first micro light-emitting device, a second light-emitting region of another second micro light-emitting device, and another third light-emitting region of the third micro light-emitting device are located in a second pixel region.

公开(公告)号：US11600508B2

公开(公告)日：2023-03-07

申请号：US15931621

申请日：2020-05-14

Applicant: PlayNitride Display Co., Ltd.

Inventor： Yu-Chu Li ,  Pei-Hsin Chen ,  Yi-Chun Shih ,  Yi-Ching Chen

IPC: H01L21/683 ,  H01L23/00

Abstract: Herein disclosed are a micro-component transfer head, a micro-component transfer device, and a micro-component display. Said micro-component transfer head comprises a carrying surface that corresponds to a micro-component extraction area. Said extraction area conforms with a first geometric object, which comprises at least an acute angle. A second geometric object comprises at least a right angle and is constituted of n copies of the first geometric object, n being an integer greater than 1. The shape of the first geometric object differs from that of the second.