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公开(公告)号:US11804569B2
公开(公告)日:2023-10-31
申请号:US17109161
申请日:2020-12-02
Applicant: PlayNitride Display Co., Ltd.
Inventor: Bo-Wei Wu , Shiang-Ning Yang , Yu-Yun Lo , Yi-Chun Shih
CPC classification number: H01L33/0093 , H01L33/44
Abstract: A micro semiconductor structure includes a substrate, a dissociative layer, a protective layer and a micro semiconductor. The dissociative layer is located on one side of the substrate. The protective layer is located on at least one side of the substrate. The micro semiconductor is located on the side of the substrate. The transmittance of the protective layer for a light source with wavelength smaller than 360 nm is less than 20%.
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公开(公告)号:US11705441B2
公开(公告)日:2023-07-18
申请号:US17359679
申请日:2021-06-28
Applicant: PlayNitride Display Co., Ltd.
Inventor: Sheng-Yuan Sun , Ying-Tsang Liu , Yi-Ching Chen , Pei-Hsin Chen , Yi-Chun Shih , Tzu-Yang Lin , Yu-Hung Lai
IPC: H01L25/075 , H01L27/15
CPC classification number: H01L25/0753 , H01L25/075 , H01L27/153 , H01L27/156
Abstract: A micro LED display device including a display substrate, a plurality of conductive pad pairs and a plurality of micro light emitting elements is provided. The display substrate has a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and the second arranging area. The conductive pad pairs are disposed on the display substrate in an array with the same pitch. The micro light emitting elements are disposed on the display substrate and are electrically bonded to the conductive pad pairs. A manufacturing method of the micro LED display device is also provided.
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公开(公告)号:US11626549B2
公开(公告)日:2023-04-11
申请号:US17002790
申请日:2020-08-26
Applicant: PlayNitride Display Co., Ltd.
Inventor: Yi-Ching Chen , Yi-Chun Shih , Pei-Hsin Chen
Abstract: A micro light-emitting device display apparatus includes a circuit substrate, at least one micro light-emitting device, and at least one conductive bump. The circuit substrate includes at least one pad. The micro light-emitting device is disposed on the circuit substrate and includes at least one electrode. At least one of the pad and the electrode has at least one closed opening. The conductive bump is disposed between the circuit substrate and the micro light-emitting device. The conductive bump extends into the closed opening and defines at least one void with the closed opening. The electrode of the micro light-emitting device is electrically connected to the pad of the circuit substrate with the conductive bump.
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公开(公告)号:US11387387B2
公开(公告)日:2022-07-12
申请号:US16862582
申请日:2020-04-30
Applicant: PlayNitride Display Co., Ltd.
Inventor: Chih-Ling Wu , Yen-Yeh Chen , Yi-Min Su , Yi-Chun Shih , Bo-Wei Wu , Yu-Yun Lo , Ying-Ting Lin , Tzu-Yang Lin
IPC: H01L33/38 , H01L25/075 , H01L33/40
Abstract: A micro light emitting device display apparatus including a circuit substrate, a plurality of micro light emitting devices, a first common electrode layer, and a second common electrode layer is provided. The micro light emitting devices are disposed on the circuit substrate and individually include an epitaxial structure and a first-type electrode and a second-type electrode respectively disposed on two side surfaces of the epitaxial structure opposite to each other. The first common electrode layer is disposed on the circuit substrate and directly covers the plurality of first-type electrodes of the micro light emitting devices. The second common electrode layer is disposed between the micro light emitting devices. The first common electrode layer is electrically connected to the second common electrode layer.
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公开(公告)号:US11094677B2
公开(公告)日:2021-08-17
申请号:US16677672
申请日:2019-11-08
Applicant: PlayNitride Display Co., Ltd.
Inventor: Sheng-Yuan Sun , Ying-Tsang Liu , Yi-Ching Chen , Pei-Hsin Chen , Yi-Chun Shih , Tzu-Yang Lin , Yu-Hung Lai
IPC: H01L25/075 , H01L27/15
Abstract: A micro LED display device including a display substrate, a plurality of conductive pad pairs and a plurality of micro light emitting elements is provided. The display substrate has a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and the second arranging area. The conductive pad pairs are disposed on the display substrate in an array with the same pitch. The micro light emitting elements are disposed on the display substrate and are electrically bonded to the conductive pad pairs. A manufacturing method of the micro LED display device is also provided.
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公开(公告)号:US20210126170A1
公开(公告)日:2021-04-29
申请号:US16708443
申请日:2019-12-10
Applicant: PlayNitride Display Co., Ltd.
Inventor: Pei-Hsin Chen , Yi-Chun Shih , Chih-Ling Wu
Abstract: A micro light-emitting diode device includes a substrate, a micro light-emitting diode, a first protection layer and a second protection layer. The micro light-emitting diode is disposed on the substrate. The first protection layer is disposed on a first portion of an outer side wall of the micro light-emitting diode and has a gap from the substrate. The second protection layer is at least disposed on a second portion of the outer side wall and is located in the gap between the first protection layer and the substrate. A height of the second protection layer on the substrate is less than or equal to a height of the micro light-emitting diode on the substrate.
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公开(公告)号:US10937826B2
公开(公告)日:2021-03-02
申请号:US16436333
申请日:2019-06-10
Applicant: PlayNitride Display Co., Ltd.
Inventor: Ying-Tsang Liu , Pei-Hsin Chen , Yi-Chun Shih , Yi-Ching Chen , Yu-Chu Li , Huan-Pu Chang , Tzu-Yang Lin , Yu-Hung Lai
Abstract: A micro semiconductor structure is provided. The micro semiconductor structure includes a substrate, at least one supporting layer, and at least one micro semiconductor device. The supporting layer includes at least one upper portion and a bottom portion, wherein the upper portion extends in a first direction. The length L1 of the upper portion in the first direction is greater than the length L2 of the bottom portion in the first direction. Furthermore, the bottom surface of the micro semiconductor device is in direct contact with the upper portion of the supporting layer.
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公开(公告)号:US20200258869A1
公开(公告)日:2020-08-13
申请号:US16862578
申请日:2020-04-30
Applicant: PlayNitride Display Co., Ltd.
Inventor: Chih-Ling Wu , Yen-Yeh Chen , Yi-Min Su , Yi-Chun Shih
Abstract: A micro light emitting device display apparatus including a substrate, a plurality of micro light emitting devices, an isolation layer, and an air gap is provided. The micro light emitting devices are discretely disposed on the substrate. The isolation layer is disposed between the micro light emitting devices. The air gap is disposed between the micro light emitting devices, the isolation layer, and the substrate.
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公开(公告)号:US20200176509A1
公开(公告)日:2020-06-04
申请号:US16436333
申请日:2019-06-10
Applicant: PlayNitride Display Co., Ltd.
Inventor: Ying-Tsang Liu , Pei-Hsin Chen , Yi-Chun Shih , Yi-Ching Chen , Yu-Chu Li , Huan-Pu Chang , Tzu-Yang Lin , Yu-Hung Lai
Abstract: A micro semiconductor structure is provided. The micro semiconductor structure includes a substrate, at least one supporting layer, and at least one micro semiconductor device. The supporting layer includes at least one upper portion and a bottom portion, wherein the upper portion extends in a first direction. The length L1 of the upper portion in the first direction is greater than the length L2 of the bottom portion in the first direction. Furthermore, the bottom surface of the micro semiconductor device is in direct contact with the upper portion of the supporting layer.
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公开(公告)号:US11843024B2
公开(公告)日:2023-12-12
申请号:US17093588
申请日:2020-11-09
Applicant: PlayNitride Display Co., Ltd.
Inventor: Yu-Yun Lo , Bo-Wei Wu , Yi-Chun Shih , Tzu-Yu Ting , Kuan-Yung Liao
CPC classification number: H01L27/156 , H01L33/005 , H01L33/382 , H01L33/486
Abstract: A micro LED display device includes a micro light emitting unit, a conductive structure and a substrate. The micro light emitting unit includes a plurality of micro light emitting elements, and each of the micro light emitting elements includes a semiconductor structure and an electrode structure. The semiconductor structure includes a first type semiconductor layer, a light emitting layer and a second type semiconductor layer. The electrode structure includes a first type electrode and a second type electrode. The conductive structure includes a first type conductive layer and a second type conductive layer. The first type conductive layer is electrically connected to the first type electrode, and the second type conductive layer is electrically connected to the second type electrode. The micro light emitting unit is disposed on the substrate, and the electrode structure is disposed toward the substrate and includes a gap therebetween.
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