公开(公告)号：US09305990B2

公开(公告)日：2016-04-05

申请号：US14202167

申请日：2014-03-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-Min Jung ,  Kyong-Soon Cho ,  Jeong-Kyu Ha

IPC: G02F1/1343 ,  G02F1/1345 ,  H01L27/32 ,  H01L23/498

CPC classification number: H01L27/3276 ,  G02F1/13452 ,  H01L23/4985 ,  H01L2224/16225 ,  H01L2924/12044 ,  H01L2924/00

Abstract: Provided are a chip-on-film (COF) package and a device assembly including the same. The device assembly includes a COF package including a film substrate on which a plurality of film-through wires are formed. The device assembly includes a panel unit including a panel substrate on which a plurality of panel-through wires are formed. The panel unit is disposed on the COF package. One end of the panel unit is electrically connected to a first end of the COF package. The device assembly includes a control unit disposed below the panel unit. One end of the control unit is electrically connected to a second end of the COF package.

Abstract translation: 提供了片上胶片（COF）包装和包括其的装置组件。 装置组件包括COF封装，其包括其上形成有多个胶片通孔的膜基板。 所述装置组件包括面板单元，所述面板单元包括其上形成有多个通孔导线的面板基板。 面板单元设置在COF包装上。 面板单元的一端电连接到COF封装的第一端。 设备组件包括设置在面板单元下方的控制单元。 控制单元的一端电连接到COF封装的第二端。

公开(公告)号：US09177904B2

公开(公告)日：2015-11-03

申请号：US13769520

申请日：2013-02-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-Min Jung ,  Sang-Uk Han ,  KwanJai Lee ,  KyongSoon Cho ,  Jeong-Kyu Ha

IPC: G02F1/1343 ,  H01L23/498 ,  H01L51/52

CPC classification number: H01L25/167 ,  H01L23/49827 ,  H01L23/4985 ,  H01L27/323 ,  H01L27/3276 ,  H01L27/3288 ,  H01L51/52 ,  H01L51/524 ,  H01L2251/5338 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Chip-on-film packages and device assemblies including the same may be provided. The device assembly includes a film package including a semiconductor chip, a panel substrate connected to one end of the film package, a display panel disposed on the panel substrate, and a controlling part connected to another end of the film package. The film package includes a film substrate, a first wire disposed on a top surface of the film substrate, and a second wire disposed on a bottom surface of the film substrate.

Abstract translation: 可以提供包括其的片上胶片包装和装置组件。 该装置组件包括：薄膜封装，其包括半导体芯片，连接到薄膜封装的一端的面板基板，设置在面板基板上的显示面板，以及连接到薄膜封装的另一端的控制部件。 薄膜封装包括薄膜基板，设置在薄膜基板的顶表面上的第一布线和设置在薄膜基板的底表面上的第二布线。

公开(公告)号：US20140054793A1

公开(公告)日：2014-02-27

申请号：US13933185

申请日：2013-07-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeong-Kyu Ha ,  Kwan-Jai Lee ,  Jae-Min Jung ,  Kyong-Soon Cho ,  Na-Rae Shin ,  Kyoung-Suk Yang ,  Pa-Lan Lee ,  So-Young Lim

IPC: H01L23/498

CPC classification number: H01L23/49838 ,  H01L23/4985 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A COF substrate may include a base film, first upper conductive patterns, at least one second upper conductive pattern and lower conductive patterns. The first upper conductive patterns may be arranged on an upper surface of the base film. Each of the first upper conductive patterns may have an inner pattern and an outer pattern spaced apart from each other. The second upper conductive pattern may be arranged on the upper surface of the base film between the first upper conductive patterns. The lower conductive patterns may be arranged on a lower surface of the base film. The lower conductive patterns may be electrically connected between the inner pattern and the outer pattern. Thus, conductive materials causing a short between the panel patterns may not exist between the inner pattern and the outer pattern on the upper surface of the base film.

Abstract translation: COF基板可以包括基膜，第一上导电图案，至少一个第二上导电图案和下导电图案。 第一上导电图案可以布置在基膜的上表面上。 每个第一上导电图案可以具有彼此间隔开的内图案和外图案。 第二上导电图案可以布置在第一上导电图案之间的基膜的上表面上。 下导电图案可以布置在基膜的下表面上。 下部导电图案可以电连接在内部图案和外部图案之间。 因此，在基片的上表面上的内图案和外图案之间可能不存在在面板图案之间引起短路的导电材料。

公开(公告)号：US20130186680A1

公开(公告)日：2013-07-25

申请号：US13747832

申请日：2013-01-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeong-Kyu Ha ,  Youngshin Kwon ,  KwanJai Lee ,  Jae-Min Jung ,  KyongSoon Cho ,  Sang-UK Han

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H01L21/486 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/78 ,  H01L23/145 ,  H01L23/49524 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/50 ,  H01L2924/12042 ,  H05K1/114 ,  H05K1/115 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/107 ,  H05K3/42 ,  H05K2203/1545 ,  Y10T156/1052 ,  H01L2924/00

Abstract: A tape film package is provided including an insulating pattern; a via contact in a via hole in the insulating pattern; first interconnection patterns extending from the via contact to a cutting surface of the insulating pattern; and second interconnection patterns connected to the via contact below the insulating pattern. The second interconnection patterns are parallel to the first interconnection patterns and spaced apart from the cutting surface of the insulating pattern.

Abstract translation: 提供包括绝缘图案的胶带包装; 绝缘图案中的通孔中的通孔接触; 从所述通孔接触延伸到所述绝缘图案的切割表面的第一互连图案; 以及连接到绝缘图案下方的通孔接点的第二互连图案。 第二互连图案平行于第一互连图案并与绝缘图案的切割表面间隔开。