公开(公告)号：US20130186680A1

公开(公告)日：2013-07-25

申请号：US13747832

申请日：2013-01-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeong-Kyu Ha ,  Youngshin Kwon ,  KwanJai Lee ,  Jae-Min Jung ,  KyongSoon Cho ,  Sang-UK Han

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H01L21/486 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/78 ,  H01L23/145 ,  H01L23/49524 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/50 ,  H01L2924/12042 ,  H05K1/114 ,  H05K1/115 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/107 ,  H05K3/42 ,  H05K2203/1545 ,  Y10T156/1052 ,  H01L2924/00

Abstract: A tape film package is provided including an insulating pattern; a via contact in a via hole in the insulating pattern; first interconnection patterns extending from the via contact to a cutting surface of the insulating pattern; and second interconnection patterns connected to the via contact below the insulating pattern. The second interconnection patterns are parallel to the first interconnection patterns and spaced apart from the cutting surface of the insulating pattern.

Abstract translation: 提供包括绝缘图案的胶带包装; 绝缘图案中的通孔中的通孔接触; 从所述通孔接触延伸到所述绝缘图案的切割表面的第一互连图案; 以及连接到绝缘图案下方的通孔接点的第二互连图案。 第二互连图案平行于第一互连图案并与绝缘图案的切割表面间隔开。