公开(公告)号：US20140320765A1

公开(公告)日：2014-10-30

申请号：US14256996

申请日：2014-04-21

Applicant: TPK Touch Solutions (Xiamen) Inc.

Inventor： Yau-Chen Jiang ,  Jianbin Yan ,  Ho-Hsun Chi ,  Defa Wu

IPC: G06F3/041

CPC classification number: G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04111

Abstract: A touch panel having a display region and a periphery region is disclosed, wherein the touch panel comprises a cover substrate, a patterned mask layer formed on the cover substrate and the patterned mask layer includes a pattern region. The periphery region is defined by the patterned mask layer. A first electrode pattern having a plurality of first jumpers is disposed on the cover substrate and correspondingly to the display region, and a second electrode pattern having a plurality of second jumpers is disposed on the patterned mask layer and correspondingly to the pattern region, wherein the first jumpers and the second jumpers comprise different materials.

Abstract translation: 公开了具有显示区域和外围区域的触摸面板，其中触摸面板包括盖基板，形成在盖基板上的图案化掩模层，并且图案化掩模层包括图案区域。 外围区域由图案化掩模层限定。 具有多个第一跳线的第一电极图案设置在盖基板上并且对应于显示区域，并且具有多个第二跳线的第二电极图案设置在图案化掩模层上并且对应于图案区域，其中， 第一跳线和第二跳线包括不同的材料。

公开(公告)号：US20140063371A1

公开(公告)日：2014-03-06

申请号：US14016137

申请日：2013-09-02

Applicant: TPK TOUCH SOLUTIONS (XIAMEN) INC.

Inventor： Yau-Chen Jiang ,  Jianbin Yan ,  Defa Wu ,  Feng Chen

IPC: G06F1/16

CPC classification number: G06F1/1692 ,  G06F3/03547 ,  G06F3/044 ,  Y10T156/1044 ,  Y10T428/24802

Abstract: Provided is a cover structure used for a touch panel, including: a substrate and a masking layer buried in the substrate. The region where the masking layer is located defines a non-visible region of the touch panel. In addition, a method for fabricating the cover structure and a touch panel including the cover structure are also provided.

Abstract translation: 提供了一种用于触摸面板的覆盖结构，包括：衬底和掩埋在衬底中的掩模层。 掩模层所在的区域定义了触摸面板的不可见区域。 此外，还提供了一种用于制造盖结构的方法和包括盖结构的触摸面板。

公开(公告)号：US20140062501A1

公开(公告)日：2014-03-06

申请号：US14019475

申请日：2013-09-05

Applicant: TPK Touch Solutions (Xiamen) Inc.

Inventor： Yau-Chen Jiang ,  Defa Wu ,  Jianbin Yan ,  Shaoting Lin ,  Tsai-Kuei Wei ,  Xiaoxin Bai ,  Caijin Ye

IPC: G01R31/04

CPC classification number: G01R31/04 ,  G01R1/07342 ,  G01R31/026 ,  G01R31/2818 ,  G01R31/2889

Abstract: An electrical connection assembly is disclosed. The electrical connection assembly comprises a first circuit board and a second circuit board. The first circuit board has a plurality of first signal electrodes and at least one first test electrode, wherein the first signal electrodes and the first test electrode are arranged in a spaced manner on the same side of the first circuit board. The second circuit board has a plurality of second signal electrodes and at least one second test electrode, wherein the second signal electrodes and the second test electrode are arranged in a spaced manner on the same side of the second circuit board, wherein the first signal electrodes are electrically connected to the second signal electrodes and the first test electrode is electrically connected to the second test electrode to form a testing loop.

Abstract translation: 公开了电连接组件。 电连接组件包括第一电路板和第二电路板。 第一电路板具有多个第一信号电极和至少一个第一测试电极，其中第一信号电极和第一测试电极间隔布置在第一电路板的同一侧上。 第二电路板具有多个第二信号电极和至少一个第二测试电极，其中第二信号电极和第二测试电极间隔布置在第二电路板的相同侧上，其中第一信号电极 电连接到第二信号电极，并且第一测试电极电连接到第二测试电极以形成测试回路。

公开(公告)号：US20130264103A1

公开(公告)日：2013-10-10

申请号：US13858955

申请日：2013-04-09

Applicant: TPK TOUCH SOLUTIONS (XIAMEN) INC.

Inventor： Huilin Ye ,  Jing Yu ,  Hua Luo ,  Zongke Chiu ,  Yau-Chen Jiang ,  Jianbin Yan ,  Defa Wu

IPC: H05K1/02 ,  H05K3/38

CPC classification number: H05K1/0213 ,  H05K1/0277 ,  H05K3/28 ,  H05K3/323 ,  H05K3/361 ,  H05K3/38 ,  H05K2201/09172 ,  H05K2201/09381 ,  H05K2201/09445 ,  H05K2201/099

Abstract: The present disclosure discloses a bonding structure, wherein a plurality of first bonding pads is located on a first substrate. A second substrate is disposed to partially face first substrate. A plurality of second bonding pads is located on second substrate with one side, and partially overlapped with the first bonding pads with the other side to form a bonding region and a peripheral region located in the periphery of the bonding region. An anisotropic conductive film is disposed between first bonding pads and second bonding pads. The anisotropic conductive film includes a plurality of conductive particles. At least one move structure is disposed in the periphery region. When the conductive particles of the anisotropic conductive film are moving during the bonding process, the groove structure can accommodate the conductive particles moved hereto. Accordingly, short circuit caused by accumulation of the conductive particles in the bonding process can be avoided.

Abstract translation: 本公开公开了一种接合结构，其中多个第一接合焊盘位于第一基板上。 第二基板设置成部分地面对第一基板。 多个第二接合焊盘位于具有一侧的第二基板上，并且与第一接合焊盘与另一侧部分地重叠以形成接合区域和位于接合区域周边的周边区域。 各向异性导电膜设置在第一接合焊盘和第二接合焊盘之间。 各向异性导电膜包括多个导电颗粒。 至少一个移动结构设置在周边区域中。 当各向异性导电膜的导电颗粒在接合过程中移动时，沟槽结构可以容纳移动到其上的导电颗粒。 因此，可以避免在接合过程中由导电性粒子的积聚引起的短路。