公开(公告)号：US20080170226A1

公开(公告)日：2008-07-17

申请号：US11969501

申请日：2008-01-04

Applicant: Tsuyoshi MORIYA

Inventor： Tsuyoshi MORIYA

IPC: G01N15/14 ,  G01N21/47 ,  H01L21/203 ,  H01L21/306 ,  C23C16/00

CPC classification number: C23C16/4412 ,  G01N15/1404 ,  G01N21/53 ,  G01N2015/1415 ,  H01J37/32834

Abstract: A particle monitor system capable of accurately detecting the number of or the size of particles flowing through an exhaust pipe. In a bypass line through which a chamber is communicated with a dry pump, there is disposed the particle monitor system that includes a laser oscillator for irradiating laser light, a photo multiplier tube having a focal point thereof located at a location where the center axis of the bypass line crosses the laser light, and a particle converging member formed by a circular disk-like member and formed with a through hole facing the focal point FP. A gap is defined between the bypass line and an outer periphery of the particle converging member.

Abstract translation: 一种能够准确地检测流过排气管的颗粒的数量或尺寸的粒子监测系统。 在室内与干泵连通的旁通管路中，设置有包括用于照射激光的激光振荡器的光电倍增管，其焦点位于中心轴的位置， 旁路管穿过激光，以及由圆盘状部件形成并形成有面向焦点FP的通孔的颗粒会聚部件。 在旁路管线和颗粒会聚部件的外周之间限定间隙。

公开(公告)号：US20120285623A1

公开(公告)日：2012-11-15

申请号：US13559373

申请日：2012-07-26

Applicant: Tsuyoshi MORIYA ,  Hiroyuki Nakayama

Inventor： Tsuyoshi MORIYA ,  Hiroyuki Nakayama

IPC: H01L21/3065 ,  B05C11/00

CPC classification number: H01J37/32431 ,  H01J2237/022

Abstract: There is provided a plasma processing apparatus including a plasma generating unit for generating a plasma in a processing chamber in which a set processing is performed on a substrate serving as an object to be processed. The plasma processing apparatus further includes a particle moving unit for electrostatically driving particles in a region above the substrate to be removed out of the region above the substrate in the processing chamber while the processing on the substrate is performed by using the plasma. In addition, there is provided a plasma processing method of a plasma processing apparatus including the steps of generating plasma in a processing chamber in which a set processing is performed on a substrate serving as an object to be processed; and performing the processing on the substrate by the plasma.

Abstract translation: 提供了一种等离子体处理装置，其包括等离子体产生单元，用于在处理室中产生等离子体，其中对作为待处理对象的基板进行设定处理。 等离子体处理装置还包括一个粒子移动单元，用于在通过使用等离子体进行基板上的处理的同时，在处理室中的基板上方的区域中，将基板上方的区域中的颗粒静电驱动。 此外，提供了一种等离子体处理装置的等离子体处理方法，其包括以下步骤：在对作为被处理对象的基板进行设定处理的处理室中产生等离子体; 并通过等离子体对衬底进行处理。

公开(公告)号：US20120037182A1

公开(公告)日：2012-02-16

申请号：US13277025

申请日：2011-10-19

Applicant: Tsuyoshi MORIYA ,  Hiroshi Nagaike

Inventor： Tsuyoshi MORIYA ,  Hiroshi Nagaike

IPC: B08B7/00

CPC classification number: H01J37/32431 ,  C23C16/4401 ,  H01J2237/022

Abstract: A particle removal apparatus for removing particles from a chamber of a plasma processing apparatus, wherein the chamber is connected to a gas exhaust port and a plasma of a processing gas is generated in the chamber to plasma process a substrate to be processed, includes a particle charging control member for positively charging particles generated within the chamber by positive ions of an ion sheath region formed in a region other than the vicinity of the substrate to be processed, wherein positively charged particles are discharged from the chamber via the gas exhaust port. Therefore, there is no plasma disturbance or metal contamination, and thus can be applied to a practical use.

Abstract translation: 一种用于从等离子体处理装置的室中除去颗粒的颗粒去除装置，其中所述室连接到排气口，并且在所述室中产生处理气体的等离子体，以等离子体处理待处理的基板，包括颗粒 充电控制构件，用于通过形成在除被处理基板附近的区域中的离子鞘区域的正离子正向地对室内产生的颗粒进行充电，其中带正电的颗粒经由排气口从室排出。 因此，没有等离子体干扰或金属污染，因此可以应用于实际应用。

公开(公告)号：US20100071732A1

公开(公告)日：2010-03-25

申请号：US12627685

申请日：2009-11-30

Applicant: Tsuyoshi MORIYA

Inventor： Tsuyoshi MORIYA

IPC: B08B3/00

CPC classification number: H01L21/0209 ,  B08B7/0021 ,  B08B7/0035 ,  B08B7/0042 ,  H01L21/02101 ,  H01L21/67028 ,  H01L21/67034 ,  Y10S134/902

Abstract: In a substrate cleaning method for cleaning a backside of a substrate on a surface of which a predetermined processing is performed, a two phase substance contacts the backside of the substrate, and a flow of the substance is generated near the backside of the substrate under a specified pressure. The two phase substance is a gas containing aerosol or a supercritical substance, and the specified pressure is higher than or equal to 133 Pa (1 Torr). Further, in the substrate cleaning method, a high-energy light may be irradiated on the backside of the substrate.

Abstract translation: 在进行了规定处理的表面上清洗基板的背面的基板清洗方法中，两相物质与基板的背面接触，在基板的背面附近产生物质的流动 指定压力。 两相物质是含有气溶胶或超临界物质的气体，规定的压力高于或等于133Pa（1乇）。 此外，在基板清洗方法中，可以在基板的背面照射高能量光。

公开(公告)号：US20100068395A1

公开(公告)日：2010-03-18

申请号：US12499588

申请日：2009-07-08

Applicant: Tsuyoshi MORIYA ,  Hiroyuki NAKAYAMA ,  Hiroshi NAGAIKE ,  Keigo KOBAYASHI ,  Kaname YASUDA

Inventor： Tsuyoshi MORIYA ,  Hiroyuki NAKAYAMA ,  Hiroshi NAGAIKE ,  Keigo KOBAYASHI ,  Kaname YASUDA

IPC: B05D3/10 ,  B05C11/00

CPC classification number: C23C16/4404

Abstract: A ceramic spray-coated member capable of surely controlling adhesion and detachment of water is produced by spraying a given ceramic onto a surface of a base material, in which an organic matter adsorbed on a surface of the ceramic spray-coated member is removed and the surface of the ceramic spray-coated member is stabilized by chemically bonding to water.

Abstract translation: 通过将给定的陶瓷喷涂到基材的表面上，除去吸附在陶瓷喷涂构件的表面上的有机物质，从而产生能够可靠地控制水的附着和分离的陶瓷喷涂构件， 通过化学键合到水来稳定陶瓷喷涂构件的表面。

公开(公告)号：US20090228215A1

公开(公告)日：2009-09-10

申请号：US12398523

申请日：2009-03-05

Applicant: Tsuyoshi MORIYA

Inventor： Tsuyoshi MORIYA

IPC: G06F19/00

CPC classification number: G01N15/02

Abstract: A system for determining occurrence factors of particles includes a user interface device, and an apparatus for detecting the occurrence factors of particles. The apparatus for detecting the occurrence factors of particles includes a storage unit that stores a program for executing a calculation method for calculating a likelihood of each of the occurrence factors of particles in the form of a score; and a calculation unit for calculating the score for each of the occurrence factors of particles based on particle distributions at least on a surface of a substrate using the stored program. The user interface device displays the calculated score for each of the occurrence factors of particles.

Abstract translation: 用于确定颗粒的发生因子的系统包括用户界面装置和用于检测颗粒的出现因子的装置。 用于检测粒子出现因子的装置包括存储单元，该存储单元存储用于执行计算方法的程序，该计算方法用于计算分数形式的粒子的每个发生因子的可能性; 以及计算单元，用于基于使用所存储的程序的至少在基板的表面上的粒子分布来计算颗粒的每个发生因子的得分。 用户界面设备显示每个颗粒发生因子的计算得分。

公开(公告)号：US20090209108A1

公开(公告)日：2009-08-20

申请号：US12388858

申请日：2009-02-19

Applicant: Tsuyoshi MORIYA ,  Eiichi Nishimura

Inventor： Tsuyoshi MORIYA ,  Eiichi Nishimura

IPC: H01L21/3065 ,  H01L21/306

CPC classification number: H01L21/02068

Abstract: A substrate processing method that can prevent a decrease in the yield of semiconductor devices manufactured from substrates. A gas containing fluorine atoms is supplied into a chamber, and then chlorine gas is supplied into the chamber. Further, a gas containing nitrogen atoms is supplied into the chamber.

Abstract translation: 可以防止由基板制造的半导体器件的产量降低的基板处理方法。 将含有氟原子的气体供给到室内，然后向室内供给氯气。 此外，将含有氮原子的气体供给到室中。

公开(公告)号：US20090133717A1

公开(公告)日：2009-05-28

申请号：US12358915

申请日：2009-01-23

Applicant: Tsuyoshi MORIYA ,  Kouji Mitsuhashi

Inventor： Tsuyoshi MORIYA ,  Kouji Mitsuhashi

IPC: C23G1/00 ,  C23G1/02

CPC classification number: B08B1/00 ,  B08B3/08 ,  B08B3/12 ,  B08B5/02 ,  B08B7/00 ,  C23C4/10 ,  C23C4/18 ,  Y10T428/12667 ,  Y10T428/12771

Abstract: A ceramic sprayed member-cleaning method which is capable of reliably suppressing desorption and attachment of water. The surface of a ceramic sprayed member and water are chemically bonded to each other, whereby the water is stabilized. Water physically adsorbed on the surface of the ceramic sprayed member is desorbed.

Abstract translation: 一种陶瓷喷涂构件清洗方法，其能够可靠地抑制水的解吸附着。 陶瓷喷涂构件和水的表面彼此化学键合，由此使水稳定。 物理吸附在陶瓷喷涂构件表面上的水被解吸。

公开(公告)号：US20090064760A1

公开(公告)日：2009-03-12

申请号：US12199960

申请日：2008-08-28

Applicant: Tsuyoshi MORIYA ,  Toshiya Matsuda

Inventor： Tsuyoshi MORIYA ,  Toshiya Matsuda

IPC: G01N1/22 ,  G01N1/00

CPC classification number: G01N1/2202 ,  G01N1/2208 ,  G01N15/0606 ,  G01N15/065 ,  G01N2001/2217 ,  G01N2015/0261 ,  H01L21/67028 ,  H01L21/67253

Abstract: A container cleanliness measurement apparatus capable of preventing particles from being adhered to substrates, while improving the operation efficiency of a container for housing substrates. An FOUP inspection apparatus includes a particle-separation promoting nozzle for promoting separation of particles adhered to an inner wall of an FOUP and to carries for holding peripheral portions of wafers inside the FOUP, a particle collecting nozzle for collecting particles separated from the inner wall of the FOUP, etc., and a particle counter for measuring an amount of collected particles. The particle-separation promoting nozzle and the particle collecting nozzle constitute a probe nozzle which is adapted to enter inside the FOUP.

Abstract translation: 一种能够防止颗粒附着于基板的容器清洁度测量装置，同时提高用于容纳基板的容器的操作效率。 FOUP检查装置包括用于促进分离附着在FOUP的内壁上的颗粒的颗粒分离促进喷嘴，并且用于承载用于保持FOUP内的晶片周边部分的颗粒收集喷嘴，用于收集从内部壁分离的颗粒的颗粒收集喷嘴 FOUP等，以及用于测量收集的颗粒量的颗粒计数器。 颗粒分离促进喷嘴和颗粒收集喷嘴构成适于进入FOUP内部的探针喷嘴。

公开(公告)号：US20080165367A1

公开(公告)日：2008-07-10

申请号：US11971404

申请日：2008-01-09

Applicant: Tsuyoshi MORIYA ,  Machi Moriya

Inventor： Tsuyoshi MORIYA ,  Machi Moriya

IPC: G01B11/30

CPC classification number: G01B11/303 ,  G03F7/70625

Abstract: A roughness evaluation method for evaluating a roughness of lines formed on a substrate includes a measuring step of irradiating light onto a plurality of locations of the substrate and measuring a state of reflected light by a scatterometry; and an analyzing step of evaluating the roughness of the lines based on a variation in value measured in the measuring step. A roughness evaluation system includes an optical device for irradiating light onto the substrate and measuring a state of reflected light by a scatterometry; a moving device for moving the substrate in at least one of an x-direction and a y-directions on a horizontal plane; a controller for controlling the moving device such that the optical device measures a plurality of locations on the substrate; and an analysis unit for evaluating the roughness based on a variation in measured values at the plurality of locations on the substrate.

Abstract translation: 用于评价在基板上形成的线的粗糙度的粗糙度评价方法包括将光照射到基板的多个位置并通过散射测量来测量反射光的状态的测量步骤; 以及基于在测量步骤中测量的值的变化来评估线的粗糙度的分析步骤。 粗糙度评估系统包括用于将光照射到基板上并通过散射测量来测量反射光的状态的光学装置; 用于在水平面上沿x方向和y方向中的至少一个移动衬底的移动装置; 用于控制所述移动装置的控制器，使得所述光学装置测量所述基板上的多个位置; 以及分析单元，用于基于所述基板上的所述多个位置处的测量值的变化来评估所述粗糙度。