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    LIGHT EMITTING DEVICE
    21.
    发明申请
    LIGHT EMITTING DEVICE 有权
    发光装置

    公开(公告)号：US20090095967A1

    公开(公告)日：2009-04-16

    申请号：US12094136

    申请日：2005-12-28

    Applicant: Mikio Masui ,  Youji Urano

    Inventor： Mikio Masui ,  Youji Urano

    IPC: H01L33/00 ,  H01L21/50

    CPC classification number: H01L33/52 ,  H01L33/58 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012

    Abstract: The lighting device (1) includes an LED chip (10), a mounting substrate (20) mounting thereto the LED chip, an encapsulation member (50) made of an encapsulating resin material for encapsulation of the LED chip, and a lens (60) made of a transparent resin material. The lens (60) is provided in its bottom with a recess (40) and is secured to the mounting substrate (20) with the encapsulation member (50) disposed within the recess (40). The encapsulation member (50) is confined within the recess of the lens of the transparent resin material, which minimizes a difference in the coefficient of linear expansion between the encapsulation member and the surroundings for restraining occurrence of voids in the encapsulation member at a low temperature.

    Abstract translation: 照明装置（1）包括LED芯片（10），安装于其上的安装基板（20），由用于封装LED芯片的封装树脂材料制成的封装构件（50）和透镜（60 ）由透明树脂材料制成。 透镜（60）在其底部设置有凹部（40），并且其中密封构件（50）设置在凹部（40）内并固定到安装基板（20）。 密封构件（50）被限制在透明树脂材料的透镜的凹部内，这使封装构件和周围环境之间的线膨胀系数的差异最小化，以限制在低温下密封构件中空隙的发生 。

    Light emitting diode device preventing short circuiting between adjacent light emitting diode chips
    25.
    发明授权
    Light emitting diode device preventing short circuiting between adjacent light emitting diode chips 有权
    发光二极管器件防止相邻发光二极管芯片之间的短路

    公开(公告)号：US08664674B2

    公开(公告)日：2014-03-04

    申请号：US12733402

    申请日：2008-08-28

    Applicant: Takanori Aketa ,  Youji Urano ,  Tomonori Suzuki

    Inventor： Takanori Aketa ,  Youji Urano ,  Tomonori Suzuki

    IPC: H01L33/08

    CPC classification number: H01L25/0753 ,  F21K9/00 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A light emitting device free from void-generation at a bonding between an LED chip and a metal layer provided on a dielectric substrate. This light emitting device is also free from short-circuit between the closely arranged LED chips. This light emitting device includes a plurality of the LED chips, one dielectric substrate (sub-mount member) which is made of a dielectric substrate for holding the LED chips. The dielectric substrate is formed with a plurality of supporting platforms which respectively holds the LED chips. Each supporting platform is provided with a metal layer which is soldered to the LED chip. The supporting platforms are configured to leave a groove between the adjacent ones of the supporting platforms. Each supporting platform is provided at its side surface with a solder-leading portion made of a material having a solder-wettablity higher than that of the supporting platform.

    Abstract translation: 在LED芯片和设置在电介质基板上的金属层之间的接合处不发生空隙的发光器件。 该发光器件在紧密排列的LED芯片之间也没有短路。 该发光装置包括多个LED芯片，由用于保持LED芯片的电介质基板制成的一个电介质基板（副安装构件）。 电介质基板形成有分别保持LED芯片的多个支撑平台。 每个支撑平台设有焊接到LED芯片的金属层。 支撑平台被配置为在相邻的支撑平台之间留下凹槽。 每个支撑平台在其侧表面上设置有由焊料可润湿性高于支撑平台的材料制成的焊料引导部分。

    Light emitting device
    26.
    发明授权
    Light emitting device 有权
    发光装置

    公开(公告)号：US08278678B2

    公开(公告)日：2012-10-02

    申请号：US12094136

    申请日：2005-12-28

    Applicant: Mikio Masui ,  Youji Urano

    Inventor： Mikio Masui ,  Youji Urano

    IPC: H01L23/28 ,  H01L23/373

    CPC classification number: H01L33/52 ,  H01L33/58 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012

    Abstract: The lighting device (1) includes an LED chip (10), a mounting substrate (20) mounting thereto the LED chip, an encapsulation member (50) made of an encapsulating resin material for encapsulation of the LED chip, and a lens (60) made of a transparent resin material. The lens (60) is provided in its bottom with a recess (40) and is secured to the mounting substrate (20) with the encapsulation member (50) disposed within the recess (40). The encapsulation member (50) is confined within the recess of the lens of the transparent resin material, which minimizes a difference in the coefficient of linear expansion between the encapsulation member and the surroundings for restraining occurrence of voids in the encapsulation member at a low temperature.

    Abstract translation: 照明装置（1）包括LED芯片（10），安装于其上的安装基板（20），由用于封装LED芯片的封装树脂材料制成的封装构件（50）和透镜（60 ）由透明树脂材料制成。 透镜（60）在其底部设置有凹部（40），并且其中密封构件（50）设置在凹部（40）内并固定到安装基板（20）。 密封构件（50）被限制在透明树脂材料的透镜的凹部内，这使封装构件和周围环境之间的线膨胀系数的差异最小化，以限制在低温下密封构件中空隙的发生 。

    Lighting apparatus with LEDs
    27.
    发明授权
    Lighting apparatus with LEDs 有权
    带LED灯具

    公开(公告)号：US08070316B2

    公开(公告)日：2011-12-06

    申请号：US12086389

    申请日：2006-12-21

    Applicant: Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka ,  Yoshiro Goto

    Inventor： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka ,  Yoshiro Goto

    IPC: F21S4/00 ,  F21V21/00 ,  F21V1/00 ,  F21V11/00 ,  F21V5/00

    CPC classification number: F21V29/70 ,  F21K9/00 ,  F21S4/20 ,  F21V23/002 ,  F21Y2115/10 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/19041 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/182 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A lighting apparatus with LED includes a metal-made main body 90; a plurality of LED chip units 1 each including an LED chip and a pair of lead terminals 42, 43 electrically connected to electrodes of the LED chip; and a dielectric layer 80 disposed between the main body 90 and each LED chip unit 1 for making electrical insulation therebetween as well as bond the same. The circuit board 20 is formed with a plurality of windows 23 through which the individual LED chip units 1 extend respectively with the lead terminals held in electrical contact with the circuit pattern of the circuit board at the circumference of the window, each of the LED chip units being thermally coupled at its bottom face with the main body 90 through the dielectric layer 80, and the heat generated in the LED chip is conducted to the main body through the dielectric layer without passing through the circuit board.

    Abstract translation: 具有LED的照明装置包括金属制主体90; 多个LED芯片单元1，其各自包括LED芯片和与LED芯片的电极电连接的一对引线端子42,43; 以及设置在主体90和每个LED芯片单元1之间以在其间进行电绝缘以及将其粘合的电介质层80。 电路板20形成有多个窗口23，各个LED芯片单元1分别延伸，引线端子在窗口的圆周处保持与电路板的电路图案电接触，每个LED芯片 单元在其底面与主体90通过电介质层80热耦合，并且在LED芯片中产生的热量通过电介质层传导到主体而不通过电路板。

    LIGHT-EMITTING DEVICE
    28.
    发明申请
    LIGHT-EMITTING DEVICE 有权
    发光装置

    公开(公告)号：US20100301373A1

    公开(公告)日：2010-12-02

    申请号：US12856775

    申请日：2010-08-16

    Applicant: Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka

    Inventor： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka

    IPC: H01L33/50 ,  H01L33/58

    CPC classification number: H01L33/483 ,  F21K9/00 ,  F21V21/30 ,  F21Y2105/00 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

    Abstract: A light-emitting device of the present invention includes: a LED chip 10; a chip mounting member 70 having a conductive plate (heat transfer plate) 71 one surface side of which the LED chip 10 is mounted on and a conductor patterns 73, 73 which is formed on the one surface side of the conductive plate 71 through an insulating part 72 and electrically connected to the LED chip 10; and a sheet-shaped connecting member 80 disposed on the other surface side of the conductive plate 71 to connect the conductive plate 71 to a body of the luminaire 90 which is a metal member for holding the chip mounting member 70. The connecting member 80 is made of a resin sheet which includes a filler and whose viscosity is reduced by heating, and the connecting member 80 has an electrical insulating property and thermally connects the conductive plate 71 and the body 90 of the luminaire to each other.

    Abstract translation: 本发明的发光装置包括：LED芯片10; 具有其一个表面侧安装有LED芯片10的导电板（传热板）71的芯片安装构件70和通过绝缘体形成在导电板71的一个表面侧上的导体图案73,73 部分72并且电连接到LED芯片10; 以及布置在导电板71的另一个表面侧上的片状连接件80，以将导电板71连接到作为用于保持芯片安装部件70的金属部件的照明器90的主体。连接部件80是 由包含填料的树脂片制成，其粘度通过加热而降低，并且连接构件80具有电绝缘性能，并且将导电板71和照明器的主体90彼此热连接。

    LIGHT EMITTING DEVICE
    30.
    发明申请
    LIGHT EMITTING DEVICE 有权
    发光装置

    公开(公告)号：US20100163914A1

    公开(公告)日：2010-07-01

    申请号：US12733400

    申请日：2008-08-28

    Applicant: Youji Urano

    Inventor： Youji Urano

    IPC: H01L33/00

    CPC classification number: H01L33/507 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/486 ,  H01L33/505 ,  H01L33/52 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/141 ,  H05K1/184 ,  H05K3/0061 ,  H05K2201/0311 ,  H05K2201/048 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10962 ,  Y10S385/901 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A light emitting device, in which an encapsulation resin is disposed at a space confined between an optical member and a mounting substrate. This encapsulation resin is possibly made free from a void-generation therein. In this light emitting device, the optical member can be precisely positioned. An electrode disposed outside a color conversion member is possibly free from an improper solder connection. A ring gate is formed on the top surface of the mounting substrate outside of the optical member, and acts to position the color conversion member. The ring gate acts to prevent an overflowing liquid encapsulation resin from flowing to the electrode provided. The ring gate is provided with a plurality of centering projections which are spaced circumferentially along its inner circumference to position the color conversion member.

    Abstract translation: 一种发光器件，其中密封树脂设置在限制在光学构件和安装衬底之间的空间。 这种封装树脂可能没有其中的空隙产生。 在该发光装置中，可以精确地定位光学构件。 设置在颜色转换构件外侧的电极可能没有不正确的焊接连接。 环形门形成在安装基板的顶面上，在光学构件的外部，并且用于定位颜色转换构件。 环形栅极用于防止溢出的液体封装树脂流到所提供的电极。 环形门设置有多个定心突起，沿着其内圆周沿圆周间隔定位，以定位颜色转换构件。

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