公开(公告)号：US5949618A

公开(公告)日：1999-09-07

申请号：US949986

申请日：1997-10-14

Applicant: Satya Prakash Arya ,  Surya Pattanaik

Inventor： Satya Prakash Arya ,  Surya Pattanaik

IPC: B23K1/00 ,  G11B5/48 ,  G11B21/00 ,  G11B21/16 ,  H05K3/34 ,  H05K3/36 ,  B23K26/00

CPC classification number: G11B5/486 ,  B23K1/0008 ,  G11B21/00 ,  G11B21/16 ,  H05K3/363 ,  B23K2201/40 ,  H05K2203/0465 ,  H05K3/3405 ,  H05K3/3457 ,  H05K3/366

Abstract: A method is disclosed for fabricating an electrical connection between first and second electrical pads. A solder bump is formed on the first electrical pad covering only a portion of the pad, the portion located at a side of the first electrical pad, leaving a vacant portion of the first electrical pad at the opposite side of the first electrical pad from the solder bump. The first and second electrical pads are positioned at an intersecting angle, the second pad extending towards the first electrical pad to intersect the first electrical pad at the vacant portion of the first electrical pad and at a distance less than the height of the solder bump. The solder bump is reflowed, the surface tension thereof causing the solder bump to flow into the vacant portion of the first electrical pad to contact the second electrical pad. The movement of the solder bump towards the vacant end of the first pad allows a connection to be made despite some misalignment between the first pad and the second pad. This movement therefore allows connections to be made between termination pads of an integrated lead suspension and the conductors of a multiconductor flex cable.

Abstract translation: 公开了用于制造第一和第二电焊盘之间的电连接的方法。 焊料凸块形成在第一电焊盘上，仅覆盖焊盘的一部分，位于第一电焊盘一侧的部分，在第一电焊垫的相对侧留下第一电焊盘的空位部分， 焊锡凸块 第一和第二电焊盘以相交角度定位，第二焊盘朝向第一电焊盘延伸，以在第一电焊盘的空缺部分处与第一电焊盘相交并且小于焊料凸块的高度。 焊料凸块被回流，其表面张力导致焊料凸块流入第一电焊盘的空缺部分以接触第二电焊盘。 尽管第一焊盘和第二焊盘之间存在一些不对准，但是焊料凸块朝向第一焊盘的空端的移动允许进行连接。 因此，此移动允许在集成引线悬架的端接焊盘与多导体挠性电缆的导体之间进行连接。

公开(公告)号：US5900738A

公开(公告)日：1999-05-04

申请号：US735811

申请日：1996-10-21

Applicant: Igor Y. Khandros ,  Gaetar L. Mathieu

Inventor： Igor Y. Khandros ,  Gaetar L. Mathieu

IPC: H01L23/12 ,  C23C18/16 ,  C25D7/12 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/66 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R4/02 ,  H01R9/00 ,  H01R12/52 ,  H01R33/76 ,  H05K1/14 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  G01R31/02

CPC classification number: H05K7/1069 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R31/2884 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/67138 ,  H01L21/6715 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3426 ,  H05K3/4015 ,  B23K2201/40 ,  G01R1/06761 ,  G01R3/00 ,  G01R31/2886 ,  H01L21/76897 ,  H01L2224/0401 ,  H01L2224/06153 ,  H01L2224/1134 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L24/45 ,  H01L24/49 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4092 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/49217 ,  Y10T29/49224

Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

Abstract translation: 一种互连接触结构组件，包括具有表面的电子部件和由电子部件承载并可在表面处接触的导电接触。 接触结构包括具有第一端和第二端的内部柔性细长构件，并且第一端在不使用单独的接合材料的情况下形成与所述导电接触端子的表面的第一紧密结合。 提供导电外壳，并且由至少一层导电材料形成，该导电材料层包围细长构件，并与紧邻第一紧密接合的导电接触端子的至少一部分形成第二紧密接合。

公开(公告)号：US5890644A

公开(公告)日：1999-04-06

申请号：US709639

申请日：1996-09-09

Applicant: Michael B. Ball

Inventor： Michael B. Ball

IPC: B23K20/00 ,  H01L21/00 ,  H01L21/48 ,  H01L21/603 ,  H01L23/495 ,  B23K37/04

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K37/04 ,  H01L21/4825 ,  H01L23/4951 ,  H01L24/78 ,  B23K2201/40 ,  H01L21/67138 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/73215 ,  H01L2224/78301 ,  H01L2224/78703 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181

Abstract: An apparatus and method of supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die are available. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.

Abstract translation: 在引线接合工艺期间支撑引线指的装置和方法以及防止接合装置和夹紧组件对模具施加力的设备和方法是可用的。 本发明包括在引线接合过程中使用具有可定位在引线框架的引线的一部分下方的部分的可动臂，以提供引线指的增加的稳定性并防止接合装置和夹紧组件施加 对死亡的力量 本发明还提供了在引线接合过程期间将热量从热块直接转移到引线指。 本发明包括在引线接合过程中使用用于稳定引线指的夹具。

公开(公告)号：US5878943A

公开(公告)日：1999-03-09

申请号：US753018

申请日：1996-11-19

Applicant: Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

Inventor： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

IPC: B23K1/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34

CPC classification number: H01L24/12 ,  B23K1/0016 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/16 ,  H05K3/3489 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01054 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/3025 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/095 ,  H05K2203/1157

Abstract: In soldering together two members such as electronic circuit devices, after an oxide or contaminated layer has been removed from the surface of a solder material or bonding pad, for example, the members are aligned in an oxidizing atmosphere. Then the solder material is heated in a nonoxidizing atmosphere to melt the solder and bond the members. Cleaning of the solder material or bonding pad is performed by sputter-cleaning, laser cleaning, mechanical polishing, or cutting.

Abstract translation: 在将诸如电子电路器件的两个部件焊接在氧化物或污染层已经从焊料或焊盘的表面除去之后，例如，这些部件在氧化气氛中对准。 然后将焊料材料在非氧化气氛中加热以熔化焊料并结合该构件。 通过溅射清洗，激光清洗，机械抛光或切割来进行焊料或焊盘的清洁。

公开(公告)号：US5878486A

公开(公告)日：1999-03-09

申请号：US839772

申请日：1997-04-15

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: B23K20/00 ,  C25D7/12 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H01K9/00

CPC classification number: H05K3/4015 ,  B23K20/004 ,  C25D7/12 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H05K3/326 ,  B23K2201/40 ,  G01R1/06761 ,  G01R3/00 ,  G01R31/2884 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13582 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L24/45 ,  H01L24/49 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K3/20 ,  H05K3/368 ,  Y02P70/611 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150.degree. C., and can be completed in less than 60 minutes.

Abstract translation: 弹性接触结构直接安装在半导体晶片上的接合焊盘上，在裸片与半导体晶片分离（分离）之前。 这使得半导体管芯能够通过具有设置在其表面上的多个端子的电路板等连接到半导体管芯来进行（例如，测试和/或烧入）。 接下来，半导体管芯可以从半导体晶片分离，因此可以使用相同的弹性接触结构来实现半导体管芯和其他电子部件（例如布线基板，半导体封装等）之间的互连。 使用本发明的全金属复合互连元件作为弹性接触结构，可以在至少150℃的温度下进行老化，并且可以在少于60分钟内完成。

公开(公告)号：US5868304A

公开(公告)日：1999-02-09

申请号：US674559

申请日：1996-07-02

Applicant: Peter Jeffrey Brofman ,  Balaram Ghosal ,  Raymond Alan Jackson ,  Kathleen Ann Lidestri ,  Karl J. Puttlitz, Sr. ,  William Edward Sablinski

Inventor： Peter Jeffrey Brofman ,  Balaram Ghosal ,  Raymond Alan Jackson ,  Kathleen Ann Lidestri ,  Karl J. Puttlitz, Sr. ,  William Edward Sablinski

IPC: H01L23/12 ,  B23K3/06 ,  H01L21/48 ,  H01L23/498 ,  H01L23/50 ,  H05K3/34 ,  B23K31/02

CPC classification number: B23K3/0623 ,  H01L21/4853 ,  H01L23/49816 ,  H05K3/3436 ,  B23K2201/40 ,  H01L2224/11334 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2203/0557 ,  H05K3/3478 ,  Y02P70/613

Abstract: An electronic component having a socketable bump grid array comprising shaped-solder coated metallic spheres is provided by a method which comprises positioning solder coated metal spheres in an aligning device having a plurality of opening corresponding to the array, the openings being tapered preferably in the form of a truncated cone with the base of the cone being at the upper surface of the aligning device and having a diameter larger than the diameter of the solder coated metal sphere. The opening is configured so that a sphere positioned in the opening extends partially above the upper surface of the aligning device. The pads of the substrate are then contacted with the positioned spheres and, when the solder is reflowed, the solder forms a bond between the conductive layer on the substrate in contact with the solder-coated metal sphere and takes the shape of the aligning device and which maintains a solder coating on the whole surface of the metal sphere. An apparatus is also provided for making such a socketable bump grid array.

Abstract translation: 具有包括成型焊料涂覆的金属球体的可插座凸块网格阵列的电子部件通过一种方法提供，该方法包括将焊接涂覆的金属球定位在具有对应于阵列的多个开口的对准装置中，所述开口优选地呈锥形 锥体的底部位于对准装置的上表面并且具有大于焊料涂覆的金属球的直径的直径。 开口构造成使得定位在开口中的球体部分地在对准装置的上表面上方延伸。 然后将衬底的焊盘与定位的球体接触，并且当焊料回流时，焊料在与焊料涂覆的金属球接触的衬底上的导电层之间形成结合，并且采取对准装置的形状和 其在金属球体的整个表面上保持焊料涂层。 还提供了一种用于制造这种可插座凸块网格阵列的装置。

公开(公告)号：US5852871A

公开(公告)日：1998-12-29

申请号：US570230

申请日：1995-12-11

Applicant: Igor Y. Khandros

Inventor： Igor Y. Khandros

IPC: B23K1/00 ,  C23C18/16 ,  C25D7/12 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  H01R9/00

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  C23C18/161 ,  C25D7/12 ,  G01R1/0466 ,  G01R31/2884 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6715 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3426 ,  H05K3/4015 ,  B23K2201/40 ,  G01R1/06711 ,  G01R1/06761 ,  G01R1/07307 ,  G01R3/00 ,  G01R31/2886 ,  H01L21/76897 ,  H01L2224/10126 ,  H01L2224/10145 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45116 ,  H01L2224/45117 ,  H01L2224/4512 ,  H01L2224/45123 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45163 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45176 ,  H01L2224/4554 ,  H01L2224/4556 ,  H01L2224/456 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4092 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  Y10T29/49609

Abstract: A method for manufacturing raised contacts on the surface of an electronic component includes bonding one end of a wire to an area, such as a terminal, of the electronic component, and shaping the wire into a wire stem configuration (including straight, bent two-dimensionally, bent three-dimensionally). A coating, having one or more layers, is deposited on the wire stem to (i) impart resilient mechanical characteristics to the shaped wire stem and (ii) more securely attach ("anchor") the wire stem to the terminal. Gold is one of several materials described that may be selected for the wire stem. A variety of materials for the coating, and their mechanical properties, are described. The wire stems may be shaped as loops, for example originating and terminating on the same terminal of the electronic component, and overcoated with solder. The use of a barrier layer to prevent unwanted reactions between the wire stem and its environment (e.g., with a solder overcoat) is described. Bonding a second end of the wire to a sacrificial member, then removing the sacrificial member, is described. A plurality of wire stems may be formed on the surface of the electronic component, from different levels thereon, and may be severed so that their tips are coplanar with one another. Many wire stems can be mounted, for example in an array pattern, to one or to both sides of electronic components including semiconductor dies and wafers, plastic and ceramic semiconductor packages, and the like.

Abstract translation: 一种用于在电子部件的表面上制造凸起接触的方法包括将电线的一端接合到电子部件的诸如端子的区域，并将线成形为线杆构造（包括直的， 三维地弯曲）。 具有一个或多个层的涂层沉积在线杆上，以（i）赋予成形线杆弹性机械特性，和（ii）将线杆更牢固地附接（“锚定”）到终端。 金是描述的几种材料之一，可以选择线棒。 描述了用于涂层的各种材料及其机械性能。 线杆可以形成为环，例如起始和终止在电子部件的相同端子上，并用焊料覆盖。 描述了使用阻挡层来防止线杆与其环境之间的不期望的反应（例如，使用焊料外涂层）。 将导线的第二端接合到牺牲部件上，然后移除牺牲部件。 多个线杆可以从电子部件的表面上形成在其上的不同层面上，并且可以被切断，使得它们的尖端彼此共面。 许多线杆可以例如以阵列图形安装到包括半导体管芯和晶片的电子部件的一侧或两侧，塑料和陶瓷半导体封装等。

公开(公告)号：US5816478A

公开(公告)日：1998-10-06

申请号：US465488

申请日：1995-06-05

Applicant: Kenneth Kaskoun ,  David A. Jandzinski ,  John W. Stafford

Inventor： Kenneth Kaskoun ,  David A. Jandzinski ,  John W. Stafford

IPC: H01L21/60 ,  B23K1/20 ,  H05K3/24 ,  H05K3/34 ,  B23K31/02

CPC classification number: B23K1/20 ,  B23K2201/40 ,  H01L2224/81193 ,  H01L2224/81385 ,  H05K3/244 ,  H05K3/3436

Abstract: A method for flip-chip bonding of two electronic components (27,28) does not use a flux material. A substrate (13) of one electronic component (28) is roughened during processing to provide an improved adhesive surface for a solder ball (12). The roughened pattern is replicated by additional conductive layers formed over the substrate or in an alternate embodiment may be formed on one of the intermediary or top conductive layers. Tacking pressure is applied to the two components so the solder ball (12) will be affixed to the roughened surface and provide a temporary bond. This bond ensures the surfaces of the two electrical components remain in contact with each other during reflow of the solder ball (12) to form a permanent bond.

Abstract translation: 用于两个电子部件（27,28）的倒装芯片接合的方法不使用焊剂材料。 一个电子部件（28）的基板（13）在加工期间被粗糙化，以提供用于焊球（12）的改进的粘合剂表面。 粗糙图案由在衬底上形成的附加导电层复制，或者在替代实施例中可以形成在中间导电层或顶层导电层之一上。 对两个部件施加粘合压力，使得焊球（12）将固定到粗糙表面并提供临时粘合。 该焊接确保两个电气部件的表面在焊球（12）的回流期间保持彼此接触以形成永久接合。

公开(公告)号：US5816472A

公开(公告)日：1998-10-06

申请号：US521196

申请日：1995-08-30

Applicant: Lawrence E. Linn

Inventor： Lawrence E. Linn

IPC: B23K20/00 ,  B23K20/10 ,  H01L21/60 ,  H01L21/607

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K20/10 ,  B23K20/106 ,  H01L24/78 ,  H01L24/79 ,  H01L24/80 ,  H01L24/86 ,  B23K2201/40 ,  H01L2224/05624 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/78302 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L24/45 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14

Abstract: A bonding tool for use in tape automated bonding and wedge bonding of gold and gold plated leads or wires to contact pads of electronic devices is fabricated of Aluminum Oxide ceramic without electrically conductive metallic binders. The bonding tool has a microscopically rough surface that is brought into compressive contact with the gold leads or wires and manipulated ultrasonically or thermosonically in order to form a molecular bond between the gold lead or wire and the contact pad of the electronic device. The Aluminum Oxide ceramic bonding tool is sufficiently hard that it does not readily deform under normal ultrasonic bonding conditions and is not readily abraded by the gold leads.

Abstract translation: 用于胶带自动接合和金和镀金引线或电线与电子器件接触焊盘的接合工具的焊接工具由不带导电金属粘合剂的氧化铝陶瓷制成。 接合工具具有微观粗糙的表面，其与金引线或电线压接，并且超声波或热量操作，以便在金线或导线与电子器件的接触焊盘之间形成分子键。 氧化铝陶瓷接合工具足够坚硬，使其在正常的超声波接合条件下不容易变形，并且不易被金引线磨损。

公开(公告)号：US5753299A

公开(公告)日：1998-05-19

申请号：US702900

申请日：1996-08-26

Applicant: Douglas Garcia ,  Vernon Cooke

Inventor： Douglas Garcia ,  Vernon Cooke

IPC: B23K1/00 ,  B23K3/06 ,  H01G13/00 ,  H05K1/09 ,  H05K3/34 ,  H05K3/40 ,  B05D5/12

CPC classification number: H05K3/403 ,  B23K1/0016 ,  B23K2201/40 ,  H05K1/092 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K3/3442 ,  H05K3/4061

Abstract: A stripe terminator (18) includes a carrier plate (20) for carrying a matrix of chips (12), a carrier plate shuttle (22) for longitudinally transporting the carrier plate (20) along guide rails (24), a paste platen (26), a doctor blade for spreading a paste layer (30) on platen (26) and a paste transfer assembly (32) for transferring paste from the platen (26) to the chips (12). The carrier plate (20) is reciprocated as the paste is applied to the chips (12) to form more uniform termination stripes (14) with wraparound segments (16). A novel ribbed paste tray (72) and contoured doctor blade (74) are also disclosed for bottom side paste application.

Abstract translation: 条形终止器（18）包括用于承载芯片矩阵（12）的承载板（20），用于沿着导轨（24）纵向输送承载板（20）的载板板梭（22） 26），用于在台板（26）上铺展糊料层（30）的刮刀和用于将糊料从压板（26）转移到芯片（12）的糊剂转移组件（32）。 当将糊剂施加到碎片（12）以形成具有环绕段（16）的更均匀的终止条（14）时，载体板（20）往复运动。 还公开了一种新颖的罗纹浆料托盘（72）和轮廓刮刀（74）用于底侧浆料施加。