公开(公告)号：US20150282312A1

公开(公告)日：2015-10-01

申请号：US13834948

申请日：2013-03-15

Applicant: FLEXcon Company, Inc.

Inventor： Kenneth Burnham ,  Richard Skov ,  Stephen Tomas ,  Jimmy Nguyen ,  Stephen M. Pizzo ,  Lisa Crislip

IPC: H05K1/09 ,  C23C28/00

CPC classification number: C09J9/02 ,  C08K3/04 ,  C08K3/08 ,  C08K2003/0806 ,  C08K2201/001 ,  C09J7/28 ,  C09J2201/602 ,  C09J2205/102 ,  H01R43/007

Abstract: An electrically conductive composite is disclosed that includes a dielectric material having a first side and a second side, conductive particles within the dielectric material layer, and a discontinuous layer of a conductive material on a first side of the dielectric layer. The conductive particles are aligned to form a plurality of conductive paths from the first side to the second side of the dielectric material, and each of the conductive paths is formed of at least a plurality of conductive particles. The discontinuous layer includes a plurality of non-mutually connected portions that cover portions of, but not all of, the first side of the dielectric material such that exposed portions of the underlying first side of the dielectric material remain exposed through the discontinuous layer, yet the discontinuous layer facilitates the electronic coupling together of a plurality of the conductive paths from the first side to the second side of the dielectric material.

Abstract translation: 公开了一种导电复合材料，其包括具有第一侧和第二侧的介电材料，介电材料层内的导电颗粒，以及介电层第一侧上的导电材料的不连续层。 导电颗粒被对准以形成从电介质材料的第一侧到第二侧的多个导电路径，并且每个导电路径由至少多个导电颗粒形成。 不连续层包括多个非相互连接的部分，其覆盖电介质材料的第一侧的部分但不全部，使得介电材料的下面的第一侧的暴露部分保持通过不连续的层露出，但是 不连续层有助于从电介质材料的第一侧到第二侧的多个导电路径的电子耦合。

公开(公告)号：US20150231803A1

公开(公告)日：2015-08-20

申请号：US14422470

申请日：2013-08-23

Applicant: DEXERIALS CORPORATION

Inventor： Seiichiro Shinohara ,  Yasushi Akutsu

IPC: B29C43/20 ,  H01L23/00 ,  B29D7/01 ,  B29C43/00 ,  B29C35/08

CPC classification number: B29C43/203 ,  B29C35/0805 ,  B29C43/003 ,  B29C2035/0827 ,  B29D7/01 ,  B29K2063/00 ,  B29K2505/00 ,  B29K2995/0005 ,  C09J5/06 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/602 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29076 ,  H01L2224/29083 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29499 ,  H01R4/04 ,  H05K3/323 ,  Y10T428/24612

Abstract: Anisotropic conductive film produced that a light-transmitting transfer die having openings with conductive particles disposed therein is prepared, and photopolymerizable insulating resin squeezed into openings to transfer conductive particles onto the surface of the photopolymerizable insulating resin layer, first connection layer is formed which has a structure in which conductive particles are arranged in a single layer in a plane direction of photopolymerizable insulating resin layer and the thickness of photopolymerizable insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than thickness of photopolymerizable insulating resin layer in regions in proximity to conductive particles; first connection layer is irradiated with ultraviolet rays through light-transmitting transfer die; release film is removed from first connection layer; second connection layer is formed on the surface of first connection layer opposite to light-transmitting transfer die; and third connection layer is formed on the surface of first connection layer.

Abstract translation: 制备各向异性导电膜，其中制备具有设置在其中的具有导电颗粒的开口的透光转印模头，并将可光聚合绝缘树脂挤压入开口以将导电颗粒转印到可光聚合绝缘树脂层的表面上，形成第一连接层，其具有 导电粒子在光聚合性绝缘树脂层的平面方向上排列成单层的结构，相邻的导电粒子之间的中央区域的光聚合性绝缘树脂层的厚度小于光聚合性绝缘树脂层的厚度 接近导电颗粒; 第一连接层通过透光转印模具用紫外线照射; 从第一连接层去除脱模膜; 第二连接层形成在与透光转移模具相对的第一连接层的表面上; 并且第三连接层形成在第一连接层的表面上。

公开(公告)号：US20150129290A1

公开(公告)日：2015-05-14

申请号：US14383812

申请日：2013-04-22

Applicant: LG CHEM, LTD.

Inventor： Jiehyun Seong ,  Seung Heon Lee ,  Young Chang Byun ,  Jung Hyun Seo ,  Jooyeon Kim ,  In-Seok Hwang ,  Yong Goo Son ,  Beom Mo Koo

IPC: H05K1/09 ,  H05K3/10

CPC classification number: H05K1/092 ,  C09J7/10 ,  C09J2201/28 ,  C09J2201/602 ,  C09J2203/326 ,  G06F3/044 ,  G06F2203/04103 ,  H05K1/09 ,  H05K3/046 ,  H05K3/105 ,  H05K2201/0302 ,  H05K2201/0326 ,  H05K2203/0522 ,  Y10T156/10

Abstract: The present invention relates to an adhesive substrate for forming a conductive pattern, which includes an adhesive substrate, and a precursor pattern of a conductive pattern, or a conductive pattern, provided on one side of the adhesive substrate, a method for preparing a conductive pattern using the adhesive substrate, a conductive pattern prepared using the adhesive substrate, and an electronic device including the conductive pattern.

Abstract translation: 本发明涉及一种用于形成导电图案的粘合剂基底，其包括粘合剂基底和设置在粘合剂基底的一侧上的导电图案或导电图案的前体图案，制备导电图案的方法 使用粘合剂基材，使用粘合剂基材制备的导电图案和包括导电图案的电子装置。

公开(公告)号：US08968867B2

公开(公告)日：2015-03-03

申请号：US14065198

申请日：2013-10-28

Applicant: Solueta

Inventor： Eui Hong Min

IPC: B32B7/12 ,  B32B27/08 ,  G11B5/708 ,  G11B5/735 ,  G11B5/738 ,  H05K7/20 ,  H05K9/00 ,  C08K3/32 ,  C08K3/00 ,  C08K3/04 ,  C09J7/02 ,  C08K3/22

CPC classification number: H05K7/20481 ,  C08K3/016 ,  C08K3/04 ,  C08K2003/2224 ,  C08K2003/2227 ,  C08K2003/321 ,  C09J7/22 ,  C09J7/29 ,  C09J7/38 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2400/163 ,  C09J2467/006 ,  H01L23/3737 ,  H01L23/38 ,  H01L23/552 ,  H01L2924/0002 ,  H05K9/0084 ,  Y10T156/10 ,  Y10T428/25 ,  Y10T428/266 ,  Y10T428/28 ,  Y10T428/2891 ,  H01L2924/00

Abstract: The present invention relates to a horizontal thermoelectric tape and a method for manufacturing same, and more particularly, to a horizontal thermoelectric tape for an effective blocking of an electromagnetic wave and an excellent heat dissipation effect. The horizontal thermoelectric tape of the present invention unifies the double layer structure of an adhesion layer and a heat dissipation layer, more effectively achieving the heat dissipation effect, and simplifying the manufacturing process thereof, and by using a non-evaporated metal foil as a conductive base material, enables a horizontal thermoelectric tape having an excellent heat conductivity, and using a conductive base material not containing impurities.

Abstract translation: 水平热电带及其制造方法技术领域本发明涉及一种水平热电带及其制造方法，更具体地说，涉及一种用于有效阻塞电磁波的水平热电带，并且具有优异的散热效果。 本发明的水平热电带将粘合层和散热层的双层结构统一起来，更有效地实现散热效果，简化其制造工艺，并且通过使用非蒸发金属箔作为导电 能够实现具有优异导热性的水平热电带，并且使用不含杂质的导电性基材。

公开(公告)号：US20140290843A1

公开(公告)日：2014-10-02

申请号：US14303008

申请日：2014-06-12

Applicant: HENKEL IP & HOLDING GMBH

Inventor： YounSang Kim ,  Jeffrey Grey ,  Kevin Becker

IPC: H01L21/673

CPC classification number: H01L21/673 ,  C09J5/00 ,  C09J7/20 ,  C09J2201/122 ,  C09J2201/28 ,  C09J2201/602 ,  C09J2203/326 ,  H01L21/67132 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L2221/68327 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2711 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2924/12042 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for removing the trimmed scrap of conductive die attach adhesive film from a carrier support tape is provided. An adhesive film is disposed between a support carrier and a release liner; the release liner and adhesive film are cut into a shape conforming to the shape of a semiconductor wafer. After scrap release liner is removed, a temporary adhesive sheet is mounted over and adhered to the exposed conductive die attach film surrounding the cut shape, and mounted over and adhered to the scrap release liner on the cut shape; the temporary adhesive sheet is removed, and due to its adhesion properties to the adhesive film and release liner, the scrap adhesive film and scrap release liner are removed along with the temporary adhesive sheet.

Abstract translation: 提供了一种从载体支撑带上去除导电芯片的修剪废料的方法，从而附着粘合剂膜。 粘合膜设置在支撑载体和剥离衬垫之间; 剥离衬垫和粘合剂膜被切割成符合半导体晶片形状的形状。 拆除废料剥离衬垫后，将临时粘合片安装在围绕切割形状的暴露的导电裸片附着膜上并粘附到切割形状上并粘附到废料剥离衬垫上; 临时粘合片被去除，并且由于其对粘合剂膜和剥离衬垫的粘合性能，与临时粘合片一起去除废胶粘剂膜和废料剥离衬垫。

公开(公告)号：US20140242362A1

公开(公告)日：2014-08-28

申请号：US14236343

申请日：2012-07-30

Applicant: Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Takaaki Noudou ,  Maki Inada ,  Kyoko Kuroda

Inventor： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Takaaki Noudou ,  Maki Inada ,  Kyoko Kuroda

IPC: C09J9/02 ,  H01B13/00 ,  C09J11/04

CPC classification number: C09J9/02 ,  B05D5/12 ,  C08K3/08 ,  C08K3/22 ,  C08K7/18 ,  C09J7/28 ,  C09J11/04 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  H01B1/22 ,  H01B13/00 ,  H05K1/0306 ,  H05K1/095 ,  H05K1/097 ,  H05K3/105 ,  H05K3/1208 ,  H05K3/1283 ,  H05K3/38 ,  H05K2203/1157 ,  Y10T428/24967 ,  Y10T428/25

Abstract: The invention provides a composition set comprising: a conductor layer-forming composition comprising a dispersing medium and inorganic particles comprising a metallic oxide; and a conductive adhesive composition comprising a binder and conductive particles having a number average particle size of from 1 nm to 3000 nm.

Abstract translation: 本发明提供一种组合物组合物，其包含：导体层形成组合物，其包含分散介质和包含金属氧化物的无机颗粒; 以及包含粘合剂和数均粒径为1nm〜3000nm的导电性粒子的导电性粘合剂组合物。

公开(公告)号：US20140216654A1

公开(公告)日：2014-08-07

申请号：US14236249

申请日：2012-07-10

Applicant: Klaus Keite-Telgenbüscher

Inventor： Klaus Keite-Telgenbüscher

IPC: C09J7/02 ,  C09J9/02

CPC classification number: C09J7/0207 ,  C08F220/18 ,  C08K3/04 ,  C08K3/08 ,  C08K7/06 ,  C09J7/00 ,  C09J7/10 ,  C09J7/38 ,  C09J9/02 ,  C09J11/04 ,  C09J133/08 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2421/00 ,  C09J2433/00 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29347 ,  H01L2224/29499 ,  H01L2224/83815 ,  H01L2224/83851 ,  H01L2224/83905 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/2857 ,  H01L2924/00012 ,  C08F2220/1825 ,  C08F2220/1858 ,  C08F220/06 ,  H01L2924/00

Abstract: A pressure-sensitive adhesive composition comprising a) a polymer-metal blend comprising at least one pressure-sensitive adhesive and at least one metal component melting in the temperature range from 50° C. to 400° C., and b) at least one fibrous, electrically conductive filler, the filler being present at least partly in the form of a bound fiber network with the metal component.

Abstract translation: 一种压敏粘合剂组合物，其包含a）包含至少一种压敏粘合剂和在50℃至400℃的温度范围内熔化的至少一种金属组分的聚合物 - 金属共混物，和b）至少一种 纤维状导电填料，填料至少部分以与金属组分结合的纤维网络的形式存在。

公开(公告)号：US20140050915A1

公开(公告)日：2014-02-20

申请号：US14064746

申请日：2013-10-28

Applicant: SOLUETA

Inventor： Eui Hong Min

IPC: H05K7/20

CPC classification number: H05K7/20481 ,  C08K3/04 ,  C09J7/21 ,  C09J7/29 ,  C09J7/38 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2400/163 ,  C09J2400/263 ,  C09J2433/00 ,  C09J2467/00 ,  C09J2483/00 ,  H01R13/6599 ,  H05K9/009 ,  Y10T428/25 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/2857 ,  Y10T428/2891

Abstract: The present invention relates to a heat dissipating tape using a conductive fiber and a method for manufacturing same. More particularly, the present invention provides a heat dissipating tape, comprising: a conductive substrate which is made of conductive fiber coated with a conductive material; and an heat dissipating adhesion layer which is formed on at least one side of the conductive substrate and is coated with a heat dissipating adhesive including a graphite-containing acrylic adhesive or silicon adhesive. The heat dissipating tape has excellent resistance to external forces on the product, has an excellent outer appearance due to its smooth surface, is less likely to get damaged, and the heat dissipating adhesion layer is not easily separated from the conductive substrate.

Abstract translation: 本发明涉及使用导电纤维的散热带及其制造方法。 更具体地说，本发明提供一种散热带，其特征在于，包括：导电性基材，其由涂覆有导电性材料的导电纤维制成; 以及散热粘合层，其形成在所述导电基材的至少一侧上，并且涂覆有包含含石墨的丙烯酸粘合剂或硅粘合剂的散热粘合剂。 散热带具有优异的耐产品外力，由于表面光滑而具有优异的外观，不太可能受损，并且散热粘合层不容易与导电基板分离。

公开(公告)号：US20130154093A1

公开(公告)日：2013-06-20

申请号：US13710728

申请日：2012-12-11

Applicant: Arum YU ,  Nam Ju KIM ,  Kyoung Soo PARK ,  Young Woo PARK ,  Joon Mo SEO ,  Kyung Il SUL ,  Dong Seon UH ,  Hyun Min CHOI

Inventor： Arum YU ,  Nam Ju KIM ,  Kyoung Soo PARK ,  Young Woo PARK ,  Joon Mo SEO ,  Kyung Il SUL ,  Dong Seon UH ,  Hyun Min CHOI

IPC: H01B1/20 ,  H01L23/532

CPC classification number: H01B1/20 ,  C08K3/08 ,  C08K5/41 ,  C08K9/02 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01B1/22 ,  H01L23/5328 ,  H01L24/29 ,  H01L2224/2929 ,  H01L2224/29316 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/15788 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An anisotropic conductive film composition for bonding an electronic device may include a hydrogenated bisphenol A epoxy monomer represented by Formula 1 or a hydrogenated bisphenol A epoxy oligomer represented by Formula 2: where n may be an integer from 1 to about 50.

Abstract translation: 用于接合电子器件的各向异性导电膜组合物可以包括由式1表示的氢化双酚A环氧单体或由式2表示的氢化双酚A环氧低聚物：其中n可以是1至约50的整数。

公开(公告)号：US20130118773A1

公开(公告)日：2013-05-16

申请号：US13650987

申请日：2012-10-12

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Junkang J. Liu ,  Garry W. Lachmansingh ,  Cecil V. Francis ,  Rachel M. Lucking ,  Stephen H. Larsen ,  Badri Veeraraghavan ,  Ali Berker

IPC: H01B7/08 ,  H01R43/00

CPC classification number: C09D133/08 ,  C08K3/08 ,  C08K7/24 ,  C08K2201/001 ,  C08L2312/00 ,  C09J7/10 ,  C09J9/02 ,  C09J11/02 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/11 ,  C09J2433/00 ,  H01R4/04 ,  Y10T29/49117

Abstract: A Z-axis conductive article includes an adhesive layer having a first major surface and a second major surface opposite the first major surface. The adhesive layer includes a dielectric pressure-sensitive adhesive and conductive magnetic particles aligned in mutually isolated conductive pathways extending from the first major surface to the second major surface of the adhesive layer. A method of making the same is also disclosed.

Abstract translation: Z轴导电制品包括具有第一主表面和与第一主表面相对的第二主表面的粘合剂层。 粘合剂层包括介电压敏粘合剂和导电磁性颗粒，导电磁性颗粒在从粘合剂层的第一主表面延伸到第二主表面的相互隔离的导电通路中排列。 还公开了制备该方法的方法。