公开(公告)号：US20180094004A1

公开(公告)日：2018-04-05

申请号：US15831506

申请日：2017-12-05

Applicant: International Business Machines Corporation

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Robert E. Meyer, III

IPC: C07F7/08 ,  C08K5/5419 ,  H05K1/03 ,  C08K9/06 ,  C08K5/5465 ,  C07F7/18 ,  C07F7/10

CPC classification number: C07F7/0878 ,  C07F7/081 ,  C07F7/0889 ,  C07F7/0896 ,  C07F7/10 ,  C07F7/1804 ,  C08K3/016 ,  C08K5/5419 ,  C08K5/5465 ,  C08K9/06 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209

Abstract: A flame retardant filler having brominated silica particles, for example, imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In this example, brominated silica particles serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a flame retardant filler comprised of brominated silica particles. In an exemplary method of synthesizing the brominated silica particles, a monomer having a brominated aromatic functional group is reacted with functionalized silica particles (e.g., isocyanate, vinyl, amine, or epoxy functionalized silica particles). Alternatively, a monomer having a brominated aromatic functional group may be reacted with a silane to produce a brominated alkoxysilane monomer, which is then reacted with the surface of silica particles.

公开(公告)号：US09914662B2

公开(公告)日：2018-03-13

申请号：US14007817

申请日：2012-03-15

Applicant: Kenj Arii ,  Kentaro Nomizu ,  Masanobu Sogame

Inventor： Kenj Arii ,  Kentaro Nomizu ,  Masanobu Sogame

IPC: C03C25/34 ,  C08G10/04 ,  C08L61/18 ,  C08L61/34 ,  C08L63/00 ,  B32B15/08 ,  C03C25/10 ,  C03C25/36 ,  C03C25/48 ,  C08J5/24 ,  B32B15/14 ,  H05K1/03 ,  H05K3/02 ,  C08K3/00

CPC classification number: C03C25/34 ,  B32B15/08 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/076 ,  B32B2457/08 ,  C03C25/36 ,  C03C25/47 ,  C03C25/48 ,  C08G10/04 ,  C08J5/24 ,  C08J2361/18 ,  C08J2361/34 ,  C08J2463/00 ,  C08K3/013 ,  C08L61/18 ,  C08L61/34 ,  C08L63/00 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/0209 ,  Y10T442/2221 ,  Y10T442/3407 ,  C08K3/0033

Abstract: A prepreg having low water absorption, and having remarkably suppressed deterioration in insulation resistance over time, and further having excellent heat resistance, a metal foil-clad laminate using the prepreg, and a printed wiring board using the metal foil-clad laminate are provided. A prepreg of the present invention is obtained by impregnating or coating a base material (D) with a resin composition comprising: a naphthol-modified dimethylnaphthalene formaldehyde resin (A); an epoxy resin (B) having an epoxy equivalent of 200 to 400 g/eq.; and an inorganic filler (C).

公开(公告)号：US09907182B2

公开(公告)日：2018-02-27

申请号：US15065383

申请日：2016-03-09

Applicant: Samsung Electro-Mechanic Co., Ltd.

Inventor： Ho-Hyung Ham ,  Hwa-Young Lee ,  Jae-Kul Lee ,  Ok-Seon Yoon

IPC: C09J5/00 ,  B29C65/48 ,  B32B37/14 ,  B32B37/16 ,  B32B38/16 ,  C08J5/18 ,  H05K3/10 ,  H05K3/28 ,  B32B38/10 ,  B32B37/15 ,  B32B37/10

CPC classification number: B32B38/10 ,  B32B37/1018 ,  B32B37/15 ,  B32B2307/206 ,  B32B2311/00 ,  B32B2457/08 ,  H05K1/0209 ,  H05K3/281 ,  H05K2201/0195 ,  H05K2201/0209

Abstract: A method of manufacturing an insulation film includes: coating a resin composite on a lower protective film, the resin composite including an inorganic filler dispersed therein; forming an insulating layer by drying the resin composite such that the inorganic filler is precipitated in the coated resin composite; and laminating an upper protective film on the insulating layer.

公开(公告)号：US09829791B2

公开(公告)日：2017-11-28

申请号：US15025655

申请日：2014-09-29

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Kenichi Iwashita ,  Tetsuya Kato ,  Masahiko Ebihara ,  Yasuharu Murakami

IPC: G03F7/038 ,  G03F7/38 ,  G03F7/40 ,  H05K3/28 ,  G03F7/004 ,  H05K3/06 ,  H05K3/12

CPC classification number: G03F7/038 ,  G03F7/0047 ,  G03F7/0382 ,  G03F7/38 ,  G03F7/40 ,  H05K3/064 ,  H05K3/1258 ,  H05K3/287 ,  H05K2201/0209

Abstract: A photosensitive resin composition comprises a component (A): a resin having a phenolic hydroxyl group; a component (B): an aliphatic compound having two or more functional groups, the functional groups being one or more group selected from an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group and a hydroxyl group; a component (C): a photosensitive acid generator; and a component (D): an inorganic filler having an average particle diameter of 100 nm or less.

公开(公告)号：US20170303387A1

公开(公告)日：2017-10-19

申请号：US15511841

申请日：2016-04-05

Applicant: Heraeus Precious Metals North America Conshohocken LLC

Inventor： Samson SHAHBAZI ,  Steven GRABEY ,  Mark CHALLINGSWORTH ,  Ryan PERSONS

IPC: H05K1/02 ,  C03C3/076 ,  C03C4/16 ,  H05K3/46 ,  H05K1/05 ,  C03C8/20 ,  C03C8/16 ,  C09K5/14 ,  C03C3/062 ,  C03C8/02 ,  C03B19/00

CPC classification number: H05K1/0204 ,  C03B19/00 ,  C03C3/062 ,  C03C3/076 ,  C03C4/16 ,  C03C8/02 ,  C03C8/16 ,  C03C8/20 ,  C03C2204/00 ,  C03C2205/00 ,  C09K5/14 ,  H05K1/0209 ,  H05K1/0271 ,  H05K1/0373 ,  H05K1/05 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/0209 ,  H05K2201/068

Abstract: A dielectric tape suitable for use in an electronic device is provided. A dielectric slip composition comprises an organic vehicle and a dielectric glass composition comprising at least about 20 wt % and no more than about 50 wt % silicon dioxide, based upon 100% total weight of the glass composition, at least about 10 wt % and no more than about 50 wt % alkali metal oxides, based upon 100% total weight of the glass composition, and at least about 1 wt % and no more than about 10 wt % of at least one transition metal oxide. A method of forming an electronic device is also provided. The method includes the steps of applying at least one dielectric tape to at least one non-planar surface of a substrate, and subjecting the at least one dielectric tape to one or more thermal treatment steps to form a dielectric layer.

公开(公告)号：US20170290149A1

公开(公告)日：2017-10-05

申请号：US15472684

申请日：2017-03-29

Applicant: Ajinomoto Co., Inc.

Inventor： Shigeo NAKAMURA ,  Shiro TATSUMI ,  Ikumi SAWA

IPC: H05K1/03 ,  H01L21/48 ,  H05K3/40 ,  H01L21/683 ,  H05K3/00 ,  H05K3/22 ,  H01L23/498 ,  H05K3/46

CPC classification number: H05K1/0373 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49894 ,  H01L2221/68345 ,  H05K3/0011 ,  H05K3/22 ,  H05K3/4038 ,  H05K3/4673 ,  H05K3/4682 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/06

Abstract: Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 μS/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160° C. for 20 hours is 200 μS/cm or less, can provide a thin insulating layer having excellent insulating properties.

公开(公告)号：US20170263804A1

公开(公告)日：2017-09-14

申请号：US15609134

申请日：2017-05-31

Applicant: Raytheon Company

Inventor： Michael H. Robson ,  Michael T. Pace

IPC: H01L31/18 ,  H05K1/02

CPC classification number: H01L31/18 ,  H05K1/0286 ,  H05K2201/0112 ,  H05K2201/0209 ,  H05K2201/10106 ,  Y02B20/346 ,  Y02P70/521

Abstract: A system to configure a conductive pathway and a method of forming a system of configurable conductivity pathways include a photosensitive layer that becomes conductive based on photoexcitation, and a light source layer deposited over the photosensitive layer, the light source layer selectively providing the photoexcitation to the photosensitive layer. The system further includes a controller to control the light source layer, the controller illuminating a portion of the light source layer corresponding with a user input image to photoexcite the photosensitive layer and configure the conductive pathway in the photosensitive layer according to the image.

公开(公告)号：US20170253013A1

公开(公告)日：2017-09-07

申请号：US15525665

申请日：2014-12-02

Applicant: Shengyi Technology Co., Ltd.

Inventor： Hui LI ,  Kehong FANG

IPC: B32B27/38 ,  B32B27/30 ,  H05K1/03 ,  C08J5/24 ,  C08J5/04 ,  B32B27/28 ,  C08L79/04

CPC classification number: B32B27/38 ,  B32B27/04 ,  B32B27/285 ,  B32B27/302 ,  B32B2260/046 ,  B32B2307/306 ,  B32B2371/00 ,  B32B2457/08 ,  C08G59/3218 ,  C08G61/02 ,  C08G73/065 ,  C08G2261/724 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/12 ,  C08J2379/04 ,  C08J2425/08 ,  C08J2435/06 ,  C08J2463/00 ,  C08J2471/10 ,  C08J2471/12 ,  C08L61/14 ,  C08L63/00 ,  C08L79/04 ,  C08L2201/02 ,  C08L2203/20 ,  C08L2205/035 ,  H05K1/024 ,  H05K1/03 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  C08K3/36 ,  C08L35/06 ,  C08L71/12

Abstract: A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.

公开(公告)号：US09756728B2

公开(公告)日：2017-09-05

申请号：US14423417

申请日：2013-05-22

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tadahiko Sakai ,  Hideki Eifuku ,  Koji Motomura

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/32 ,  H01L23/00 ,  H05K1/03 ,  H05K1/14 ,  H05K3/34

CPC classification number: H05K1/18 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/81193 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/147 ,  H05K3/323 ,  H05K3/3436 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2203/0278 ,  H05K2203/0425 ,  H05K2203/0465 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

Abstract: Disclosed is a component-mounted structure including a first object having a plurality of first electrodes, a second object as an electronic component having second electrodes, a joint portion joining the plurality of first electrodes and the corresponding second electrodes to each other, and a resin-reinforcing portion. The joint portion has a core including at least one of a first metal and a resin particle, and a layer of an intermetallic compound of the first metal and a second metal having a low melting point. The resin-reinforcing portion includes a particulate matter including the core and the intermetallic compound, in a portion except between the first and second electrodes. An amount of the particulate matter included in the portion is 0.1 to 10 vol %.

公开(公告)号：US20170247524A1

公开(公告)日：2017-08-31

申请号：US15129633

申请日：2015-03-26

Applicant: SAINT-GOBAIN CENTRE DE RECHERCHES ET D'ETUDES EUROPEEN

Inventor： Stéphane RAFFY

IPC: C08K3/22 ,  H05K1/16 ,  H05K9/00

CPC classification number: C08K3/22 ,  C08K2003/2237 ,  C08K2201/001 ,  H05K1/162 ,  H05K9/0083 ,  H05K2201/0187 ,  H05K2201/0209

Abstract: Polymer-ceramic composites, in particular for the field of electronics, include grains of titanium suboxides of general formulation TiOx in which x is between 1.00 and 1.99, limits included, and/or of barium and/or strontium titanate suboxides of general formulation Ba(1-m)SrmTiOy in which y is between 1.50 and 2.99, limits included, and m is between 0 and 1, limits included.