公开(公告)号：US20160247776A1

公开(公告)日：2016-08-25

申请号：US15142690

申请日：2016-04-29

Applicant: FUJITSU LIMITED

Inventor： KOZO SHIMIZU ,  Seiki Sakuyama

IPC: H01L23/00

CPC classification number: H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

公开(公告)号：US09034475B2

公开(公告)日：2015-05-19

申请号：US13770225

申请日：2013-02-19

Applicant: Hitachi Cable, Ltd. ,  Hitachi Cable Fine-Tech, Ltd.

Inventor： Satoru Amou ,  Tomiya Abe ,  Daisuke Shanai ,  Hiroaki Komatsu ,  Kenichi Murakami

IPC: B32B27/08 ,  B32B27/18 ,  B32B27/20 ,  B32B27/26 ,  B32B27/28 ,  C09J163/00 ,  C09J171/10 ,  C08K7/04 ,  C09J171/00 ,  C09J181/06 ,  B32B5/00 ,  H05K1/02 ,  H05K3/38 ,  B32B7/12 ,  B32B15/08 ,  B32B3/08

CPC classification number: C09J171/00 ,  B32B3/08 ,  B32B5/00 ,  B32B7/12 ,  B32B15/08 ,  B32B27/08 ,  B32B27/281 ,  B32B2307/306 ,  B32B2307/7246 ,  B32B2307/732 ,  B32B2457/08 ,  C08G2650/54 ,  C08L79/08 ,  C09J181/06 ,  H05K1/02 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/0248 ,  Y10T428/26 ,  Y10T428/263 ,  Y10T428/264 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/2826 ,  Y10T428/31681 ,  Y10T428/31721 ,  C08K5/3415 ,  C08K7/04

Abstract: Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermosetting adhesive composition includes 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in the structure thereof; 5 to 30 parts by weight of a maleimide compound containing a plurality of maleimide groups in the structure thereof; and 3 to 20 vol % of an inorganic needle-like filler. The heat resistant adhesive film is obtained by applying the thermosetting adhesive composition onto a polyimide film, followed by drying. The wiring film is obtained by placing a conductor wiring layer on the heat resistant adhesive film.

Abstract translation: 提供了保存稳定性，可靠性和低温粘合性优异的热固性粘合剂组合物; 以及使用该组合物得到的卷曲耐热膜和布线膜。 热固性粘合剂组合物包含100重量份在其结构中具有双酚S骨架的苯氧基树脂; 5〜30重量份在其结构中含有多个马来酰亚胺基团的马来酰亚胺化合物; 和3〜20体积％的无机针状填料。 通过将热固性粘合剂组合物涂布在聚酰亚胺膜上，然后干燥获得耐热粘合剂膜。 通过将导体布线层放置在耐热粘合膜上而获得布线膜。

公开(公告)号：US20140338076A1

公开(公告)日：2014-11-13

申请号：US14445392

申请日：2014-07-29

Applicant: Mehdi M. Yazdanpanah

Inventor： Mehdi M. Yazdanpanah ,  Romaneh Jalilian ,  Brian Miller ,  David A. Mudd

IPC: G01Q80/00 ,  G01N1/02

CPC classification number: G01N1/02 ,  B82Y30/00 ,  G01N1/32 ,  H01J37/00 ,  H01J2237/208 ,  H01J2237/31732 ,  H01J2237/31745 ,  H01J2237/31749 ,  H01L21/76838 ,  H05K3/222 ,  H05K2201/0248

Abstract: Embodiments of the present invention provide apparatus of restoring probes attached to the manipulator in a control environment (e.g. vacuum chamber of an focus ion beam) without a need to open the vacuum chamber. Another embodiment of the present invention teaches construction and application of various shapes of nanoforks from a nanoneedles array inside a FIB vacuum chamber. In another embodiment, the present invention teaches edition and correction of completed and oxide-coated circuit boards by re-nano-wiring using nanoneedles of a nanoneedles array (as nanowire supply), contained in the same controlled space. In this embodiment, individual nanoneedles in a nanoneedle array are manipulated by a manipulator and placed in such a way to make electrical contact between the desired points.

Abstract translation: 本发明的实施例提供了在控制环境（例如聚焦离子束的真空室）中恢复附接到操纵器的探针的装置，而不需要打开真空室。 本发明的另一个实施方案教导了在FIB真空室内的纳米针阵列中构造和应用各种形状的纳摩耳。 在另一个实施例中，本发明通过使用包含在相同受控空间中的纳米针阵列（作为纳米线供应）的纳米针通过再纳米布线来教导完成的和氧化物涂覆的电路板的编辑和校正。 在该实施例中，纳米针阵列中的单个纳米针由操纵器操纵并且以这样的方式放置以在期望的点之间进行电接触。

公开(公告)号：US20140187679A1

公开(公告)日：2014-07-03

申请号：US13831678

申请日：2013-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Jik Lee ,  Joon Ho Bae ,  Hyun Chul Jung

IPC: H05K1/03

CPC classification number: H05K1/0373 ,  H05K3/4676 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/0248

Abstract: This invention relates to a resin composition with good workability, including a liquid crystal oligomer, an epoxy resin, or a resin mixture thereof, and an inorganic filler having a nanocone shape, and to an insulating film for a printed circuit board, and a prepreg, which are manufactured using the resin composition.

Abstract translation: 本发明涉及具有良好加工性的树脂组合物，其包括液晶低聚物，环氧树脂或其树脂混合物，以及具有纳米体形状的无机填料，以及印刷电路板用绝缘膜和预浸料 ，其使用树脂组合物制造。

公开(公告)号：US08446075B2

公开(公告)日：2013-05-21

申请号：US13359037

申请日：2012-01-26

Applicant: Wataru Takahashi ,  Hitoshi Yoshikawa ,  Jun Kobayashi

Inventor： Wataru Takahashi ,  Hitoshi Yoshikawa ,  Jun Kobayashi

IPC: H01L41/047

CPC classification number: H05K1/095 ,  C08K2201/001 ,  G06F3/044 ,  H01L41/0478 ,  H02N1/006 ,  H05K1/162 ,  H05K2201/0133 ,  H05K2201/0245 ,  H05K2201/0248

Abstract: To provide a conductive film that is flexible, extendable and contractible, and for which the electrical resistance hardly increases even when the conductive film is extended. The conductive film contains an elastomer and metallic filler particles, and satisfies a condition (A) [an average value of reference numbers is 0.8 (1/μm) or more, or the metallic filler particles include flake-like metallic filler particles having a thickness of 1 μm or less and an aspect ratio of 26 or more and the average value of the reference numbers is 0.4 (1/μm) or more] and a condition (B) [a number of unit areas for which an area percentage of the elastomer is 60% or more is 20 or more], the condition (A) being a conductivity indicator and the condition (B) being a flexibility indicator.

Abstract translation: 为了提供柔性，可延伸和收缩的导电膜，并且即使当导电膜延伸时，其电阻也几乎不增加。 导电膜含有弹性体和金属填料粒子，满足条件（A）[参考数字的平均值为0.8（1 / mum）以上，或者金属填料粒子包括具有厚度的片状金属填料粒子 1个以上，宽高比26以上，基准数的平均值为0.4（1 / mum）以上]和条件（B）[单位面积的面积百分比 弹性体为60％以上为20以上]，条件（A）为电导率指标，条件（B）为柔性指标。

公开(公告)号：US20120152135A1

公开(公告)日：2012-06-21

申请号：US13294355

申请日：2011-11-11

Applicant: Chaofeng Zou ,  Mathew T. Stebbins ,  Jennifer C. Dawson ,  Karissa L. Eckert ,  Gary E. Labelle

Inventor： Chaofeng Zou ,  Mathew T. Stebbins ,  Jennifer C. Dawson ,  Karissa L. Eckert ,  Gary E. Labelle

IPC: B41M1/10 ,  H01B5/00

CPC classification number: H05K1/095 ,  B41M1/10 ,  H01B1/22 ,  H05K3/1275 ,  H05K2201/0108 ,  H05K2201/0248 ,  H05K2201/026

Abstract: Methods and compositions are disclosed and claimed for gravure printing of transparent conductive films comprising metal nanowires. Such films exhibiting low resistivity and superior coating uniformity may be used in electronic or optical articles.

Abstract translation: 公开和要求保护用于凹版印刷包含金属纳米线的透明导电膜的方法和组合物。 具有低电阻率和优异的涂层均匀性的这种膜可以用于电子或光学制品中。

公开(公告)号：US20110234363A1

公开(公告)日：2011-09-29

申请号：US13158356

申请日：2011-06-10

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H01C7/10 ,  H01B1/24 ,  H01B1/22 ,  B05D5/12 ,  B82Y99/00

CPC classification number: H01C7/1006 ,  B82Y10/00 ,  H01B1/22 ,  H01B1/24 ,  H01C7/105 ,  H01C17/0652 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0738 ,  H05K2203/0723 ,  H05K2203/105 ,  Y10S977/742 ,  Y10S977/779 ,  Y10T428/30 ,  Y10T428/31678

Abstract: One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.

Abstract translation: 一个或多个实施例提供了一种使用具有半导体或导电材料的电压可切换介电材料的器件，该器件具有相对较高的纵横比，以便增强器件上的VSD材料的机械和电学特性。

公开(公告)号：US07981325B2

公开(公告)日：2011-07-19

申请号：US12703701

申请日：2010-02-10

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H01B1/06 ,  H01B1/02 ,  H01B1/12 ,  H02H9/00 ,  H01C7/12 ,  H01C7/10

CPC classification number: H01C7/1006 ,  B82Y10/00 ,  H01B1/22 ,  H01B1/24 ,  H01C7/105 ,  H01C17/0652 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0738 ,  H05K2203/0723 ,  H05K2203/105 ,  Y10S977/742 ,  Y10S977/779 ,  Y10T428/30 ,  Y10T428/31678

Abstract: One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.

Abstract translation: 一个或多个实施例提供了一种使用具有半导体或导电材料的电压可切换介电材料的器件，该器件具有相对较高的纵横比，以便增强器件上的VSD材料的机械和电学特性。

公开(公告)号：US07968010B2

公开(公告)日：2011-06-28

申请号：US12703723

申请日：2010-02-10

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H01B1/00 ,  C25D5/34 ,  B05D5/12

CPC classification number: H01C7/1006 ,  B82Y10/00 ,  H01B1/22 ,  H01B1/24 ,  H01C7/105 ,  H01C17/0652 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0738 ,  H05K2203/0723 ,  H05K2203/105 ,  Y10S977/742 ,  Y10S977/779 ,  Y10T428/30 ,  Y10T428/31678

Abstract: One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.

Abstract translation: 一个或多个实施例提供了一种使用具有半导体或导电材料的电压可切换介电材料的器件，该器件具有相对较高的纵横比，以便增强器件上的VSD材料的机械和电学特性。

公开(公告)号：US20110147048A1

公开(公告)日：2011-06-23

申请号：US13060845

申请日：2010-04-13

Applicant: Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Takashi Yamaguchi ,  Shigeki Kawakami ,  Michihiro Kimura

Inventor： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Takashi Yamaguchi ,  Shigeki Kawakami ,  Michihiro Kimura

IPC: H01B5/00 ,  H01R43/02

CPC classification number: H05K3/282 ,  H01L2924/0002 ,  H05K1/148 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/083 ,  H05K2201/10977 ,  H05K2203/104 ,  Y10T29/49213 ,  H01L2924/00

Abstract: There is provided an electrode structure to be electrically connected to a connection conductor by being bonded thereto with an anisotropic conductive adhesive mainly composed of a thermosetting resin, the electrode structure including an electrode for connection using an adhesive, the electrode being arranged on a base material, and an organic film serving as an oxidation preventing film configured to cover a surface of the electrode for connection using an adhesive, in which the organic film has a higher decomposition temperature than the maximum temperature of heat treatment to be performed. A wiring body and a connecting structure using an adhesive are also provided.

Abstract translation: 提供了一种电极结构，其通过用主要由热固性树脂构成的各向异性导电粘合剂与连接导体电连接，该电极结构包括使用粘合剂连接的电极，该电极设置在基材上 以及作为氧化防止膜的有机膜，其被配置为使用粘合剂覆盖用于连接的电极的表面，其中有机膜具有比要进行的热处理的最高温度更高的分解温度。 还提供了布线体和使用粘合剂的连接结构。