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公开(公告)号：US10309635B1
公开(公告)日：2019-06-04
申请号：US15849402
申请日：2017-12-20
Applicant: Valeo North America, Inc.
Inventor： Gavin Warner , Julien Hemon , Jonathan Blandin
IPC: F21V25/02 , H05K1/02 , F21S41/19 , F21V23/00 , F21V29/508 , F21V29/70 , F21W103/35 , F21W103/20 , F21Y115/10
CPC classification number: F21V25/02 , F21S41/192 , F21V23/002 , F21V23/005 , F21V29/508 , F21V29/70 , F21W2103/20 , F21W2103/35 , F21Y2115/10 , H05K1/0203 , H05K1/0268 , H05K2201/066 , H05K2201/10106 , H05K2201/1028
Abstract: A circuitry assembly including an electrical component, a peripheral circuitry that supports the electrical component, a support assembly affixed to the peripheral circuitry to evacuate heat excess generated by the electrical component and the peripheral circuitry, a main circuitry separated from the support assembly by a spacing, the main circuitry having a plurality of detection bands, and a plurality of ribbons electrically connecting the peripheral circuitry with the main circuitry and deformable between an undamaged state and a damaged state, wherein in the undamaged state the plurality of ribbons steps over the spacing and the plurality of detection bands and in the damaged state at least one ribbon of the plurality of ribbons contacts at least one detection band of the plurality of detection bands and generate a short circuit.
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公开(公告)号：US20190029104A1
公开(公告)日：2019-01-24
申请号：US15655515
申请日：2017-07-20
Applicant: Astec International Limited
Inventor： Yu-wei CHEN , Yi-kai LAN , Shih-chien CHOU
CPC classification number: H05K1/0206 , H05K7/209 , H05K2201/066 , H05K2201/10166
Abstract: According to some aspects of the present disclosure, cooling assemblies for electronic devices are disclosed. Example cooling assemblies include a circuit board having a first surface and a second surface opposite the first surface, a first set of electronic devices, a second set of electronic devices, and a third set of electronic devices. Each set includes at least two electronic devices electrically coupled in parallel and disposed on the first surface of the circuit board. At least one of the electronic devices of the first set is adjacent one of the electronic devices of the second set and is adjacent one of the electronic devices of the third set. The cooling assembly further includes a heat sink disposed on the second surface of the circuit board. The heat sink is in thermal contact with the first set, the second set, and the third set of electronic devices.
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公开(公告)号：US20180367055A1
公开(公告)日：2018-12-20
申请号：US15963267
申请日：2018-04-26
Applicant: Mitsubishi Electric Corporation
Inventor： Yasuhiko KITAMURA , Hiroaki TAKAHASHI , Shozo KANZAKI , Toshiyuki YASUTOMI
IPC: H02M7/00 , H02P27/06 , H05K1/18 , H05K1/11 , H01G9/15 , H01G11/04 , H01G9/26 , H01G11/10 , H01G9/028 , H01G9/045 , H01G11/30 , H01G11/78 , H05K1/02 , H01G11/18 , H01G9/00 , H02M1/14
CPC classification number: H02M7/003 , H01G9/0003 , H01G9/028 , H01G9/045 , H01G9/15 , H01G9/26 , H01G11/04 , H01G11/10 , H01G11/18 , H01G11/30 , H01G11/78 , H02M1/14 , H02M7/5387 , H02P27/06 , H05K1/0203 , H05K1/111 , H05K1/181 , H05K2201/066 , H05K2201/10015 , H05K2201/1009 , H05K2201/10166 , H05K2201/10409 , H05K2201/10522
Abstract: To downsize a power smoothing capacitor substrate unit for opening/closing modules configured to convert a low-voltage DC power to AC power to drive a three-phase AC motor. A plurality of unit capacitors (101) being a conductive polymer aluminum electrolytic capacitor are connected between a positive-side first conductive plate (10P0) connected to a positive-side power supply terminal (125P) and a negative-side second conductive plate (10N) connected to a negative-side power supply terminal (124N), and three or more capacitor rows are arranged for each of three pairs of divided power supply terminal blocks (130B) connected to the opening/closing modules (90B) and one or more capacitor rows are arranged between the terminal blocks. Accordingly, ripple currents in a large number of capacitors connected in parallel to each other are equalized to prevent a temperature increase in each capacitor.
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公开(公告)号：US20180356085A1
公开(公告)日：2018-12-13
申请号：US15684665
申请日：2017-08-23
Applicant: Fluence Bioengineering
Inventor： Dung Duong
CPC classification number: F21V23/005 , A01G7/045 , F21K9/232 , F21K9/90 , F21S4/28 , F21V7/005 , F21V7/0066 , F21V7/05 , F21V15/015 , F21V17/107 , F21V19/0015 , F21V19/003 , F21V23/001 , F21V23/02 , F21V23/0442 , F21V29/70 , F21V29/74 , F21V29/83 , F21Y2103/10 , F21Y2105/16 , F21Y2115/10 , H05B33/0854 , H05B37/0227 , H05B37/0272 , H05K1/0203 , H05K1/0209 , H05K1/0274 , H05K1/0277 , H05K1/05 , H05K1/056 , H05K1/181 , H05K1/182 , H05K1/185 , H05K3/0014 , H05K3/28 , H05K3/32 , H05K3/44 , H05K2201/066 , H05K2201/09009 , H05K2201/10106
Abstract: Examples of the present disclosure are related to systems and methods for lighting fixtures. More particularly, embodiments disclose lighting fixtures utilizing metal core PCB (MCPCB) for thermal, mechanical, and/or optical controls.
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公开(公告)号：US20180356077A1
公开(公告)日：2018-12-13
申请号：US15688358
申请日：2017-08-28
Applicant: Fluence Bioengineering
Inventor： Dung Duong , Randy Johnson , Nick Klase
CPC classification number: F21V23/005 , A01G7/045 , F21K9/232 , F21K9/90 , F21S4/28 , F21V7/005 , F21V7/0066 , F21V7/05 , F21V15/015 , F21V17/107 , F21V19/0015 , F21V19/003 , F21V23/001 , F21V23/02 , F21V23/0442 , F21V29/70 , F21V29/74 , F21V29/83 , F21Y2103/10 , F21Y2105/16 , F21Y2115/10 , H05B33/0854 , H05B37/0227 , H05B37/0272 , H05K1/0203 , H05K1/0209 , H05K1/0274 , H05K1/0277 , H05K1/05 , H05K1/056 , H05K1/181 , H05K1/182 , H05K1/185 , H05K3/0014 , H05K3/28 , H05K3/32 , H05K3/44 , H05K2201/066 , H05K2201/09009 , H05K2201/10106
Abstract: Examples of the present disclosure are related to systems and methods for lighting fixtures. More particularly, embodiments disclose lighting fixtures utilizing metal core PCB (MCPCB) for thermal, mechanical, and/or optical controls.
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Patent Agency Ranking
公开(公告)号：US20180348827A1
公开(公告)日：2018-12-06
申请号：US16042804
申请日：2018-07-23
Applicant: Apple Inc.
Inventor： Jonathan A. Matheson , Vinh H. Diep , Brian L. Chuang , Judith C. Segura , Frank F. Liang , Leanne Bach Lien T. Ly , Kevin Z. Lo , Po W. Chiu , Lukose Ninan , Chong Li
CPC classification number: G06F1/20 , G06F1/1656 , H05K1/0206 , H05K1/0209 , H05K7/20436 , H05K9/0049 , H05K2201/066 , H05K2201/0715 , H05K2201/10416
Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.
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公开(公告)号：US20180269371A1
公开(公告)日：2018-09-20
申请号：US15761485
申请日：2016-09-07
Applicant: Siemens Aktiengesellschaft
Inventor： Martin Franke , Peter Frühauf , Rüdiger Knofe , Bernd Müller , Stefan Nerreter , Michael Niedermayer , Ulrich Wittreich , Manfred Zäske
CPC classification number: H01L35/30 , F04D25/06 , F04D33/00 , H01L23/38 , H01L23/467 , H01L35/28 , H02H5/04 , H05K1/0203 , H05K2201/064 , H05K2201/066 , H05K2201/10037 , H05K2201/10151 , H05K2201/10219
Abstract: The present disclosure relates to a cooling arrangement for an electronic component. Some embodiments of the teachings thereof may include a heat sink with a contact surface as an interface for the electronic component. For example, a cooling arrangement for an electronic component may include: a heat sink with a contact surface for the electronic component; a converter for the conversion of thermal energy into useful energy; a functional element driven by the useful energy; and an active cooling device for the heat sink or for the electronic component.
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公开(公告)号：US20180266647A1
公开(公告)日：2018-09-20
申请号：US15923541
申请日：2018-03-16
Applicant: VALEO ILUMINACION
Inventor： Jose-David Roldan , Jose-Ramon Martinez-Perez , Juan-Jose Santaella , Juan Lara-Cabeza , Miguel-Angel Pena , Manuel Calmaestra , Antonio Domingo Illan , Jaime Arjona
CPC classification number: F21S45/48 , F21S43/14 , F21S45/47 , F21S45/49 , F21V19/0015 , F21V29/89 , F21Y2115/10 , H05K1/0209 , H05K2201/066 , H05K2201/10106
Abstract: Lighting module for an automotive vehicle, comprising: a printed circuit board; and heat dissipation means comprising at least one metallic sheet; the at least one metallic sheet is stuck on the printed circuit board and the at least one metallic sheet comprises at least a first portion and a second portion which are not coplanar with each other. And a method for producing a lighting module for an automotive vehicle, comprising: providing a printed circuit board; providing heat dissipation means comprising at least one metallic sheet; shaping the at least one metallic sheet into at least a first portion and a second portion which are not coplanar with each other; and sticking the at least one metallic sheet on the printed circuit board.
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公开(公告)号：US20180263106A1
公开(公告)日：2018-09-13
申请号：US15914228
申请日：2018-03-07
Inventor： Timo Feismann , Matthias Rieke
IPC: H05K1/02 , H05K7/20 , H05K1/14 , H02K7/14 , H02K11/33 , H02K21/24 , F04D25/06 , F04D25/08 , F04D29/28
CPC classification number: H05K1/0203 , F04D25/068 , F04D25/08 , F04D29/282 , H02K7/14 , H02K11/33 , H02K21/24 , H02K2203/03 , H02K2211/03 , H05K1/144 , H05K7/20172 , H05K7/20863 , H05K2201/042 , H05K2201/064 , H05K2201/066 , H05K2201/1003 , H05K2201/1009
Abstract: An electronic assembly including a cooling device comprises a cooling plate equipped, on its upper face, with a plurality of pin-fins; a first printed circuit board including at least one heat-generating zone bearing against the lower face of the cooling plate; each pin including a blowing means comprising a hub equipped with blades, the blades being arranged axially along each pin so as to be able to rotate about the pin, thus creating a flow of air for cooling the pins.
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公开(公告)号：US10062633B2
公开(公告)日：2018-08-28
申请号：US15549243
申请日：2016-01-29
Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
Inventor： Shungo Hiratani , Hideaki Tahara , Kazuyoshi Ohara , Munsoku O , Hideo Morioka , Arinobu Nakamura
IPC: H01L23/50 , H01L23/367 , H01L25/07
CPC classification number: H01L23/3675 , H01L23/36 , H01L23/50 , H01L25/072 , H05K1/0209 , H05K1/183 , H05K7/209 , H05K2201/066 , H05K2201/10166
Abstract: Provided is a substrate unit configured to improve heat dissipation efficiency while preventing workability from degrading at the time of assembly. A substrate unit includes: a substrate that has one surface on having a conductive pattern, and includes an opening; a conductive member that includes a main portion is fixed to the other surface of the substrate, and at least one terminal of an electronic component is electrically connected via the opening; and a heat dissipation member is fixed to a surface of the conductive member opposite a substrate side surface thereof, wherein the conductive member is provided with an extension portion that extends from the main portion of the conductive member and to which an external device is to be electrically connected, the extension portion intersecting a plane that extends along the heat dissipation member.
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