中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

76 records (took 0.017 seconds)

    ELECTRONIC COMPONENT
    7.
    发明申请
    ELECTRONIC COMPONENT 有权
    电子元件

    公开(公告)号：US20140361663A1

    公开(公告)日：2014-12-11

    申请号：US14369677

    申请日：2012-12-26

    Applicant: Kyocera Corporation

    Inventor： Akira Oikawa ,  Eiji Sakata

    IPC: H01L41/053 ,  H05K1/18 ,  H01L41/047

    CPC classification number: H01L41/053 ,  H01L23/3121 ,  H01L41/047 ,  H01L2924/0002 ,  H03H9/0038 ,  H03H9/059 ,  H03H9/1064 ,  H03H9/1085 ,  H05K1/185 ,  H05K2201/1009 ,  H05K2201/10196 ,  H01L2924/00

    Abstract: An electronic component has a support member, an SAW element which is mounted on the support member with a space S therebetween and which has a facing surface which faces the support member, and a resin portion which covers the SAW element and which is provided so as to seal the space S. The SAW element has a piezoelectric substrate, an IDT provided on the facing surface of the piezoelectric board, an wiring (an outer wiring) which is provided on the facing surface of the piezoelectric board and extends from the IDT toward the periphery side of the piezoelectric board, and a dam member which is adjacent to a lateral edge portion of the wiring and which is provided locally relative to the circumferential direction which surrounds the IDT.

    Abstract translation: 电子部件具有支撑部件，安装在支撑部件上的SAW元件，其间具有空间S，并且具有与支撑部件相对的面对面，以及覆盖SAW元件的树脂部，其设置为 以密封空间S.SMA元件具有压电基板，设置在压电板的相对表面上的IDT，设置在压电板的相对表面上并从IDT延伸的布线（外部布线） 压电板的周边侧和与布线的横向边缘部分相邻并且相对于围绕IDT的圆周方向局部设置的阻挡构件。

    SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
    8.
    发明申请
    SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME 有权
    半导体封装及其制造方法

    公开(公告)号：US20140203450A1

    公开(公告)日：2014-07-24

    申请号：US13860796

    申请日：2013-04-11

    Applicant: AMTEK SEMICONDUCTORS CO., LTD.

    Inventor： Chien-Ping Huang

    IPC: H01L23/433 ,  H01L21/71

    CPC classification number: H01L23/467 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/4882 ,  H01L21/565 ,  H01L21/71 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0209 ,  H05K1/0272 ,  H05K1/165 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/1009 ,  H01L2924/00014

    Abstract: A semiconductor package is provided, including a substrate having a top surface, a bottom surface opposing the top surface, a via communicating the top surface with the bottom surface, and a stator set formed by circuits; an axial tube axially installed in the via of the substrate; a plurality of electronic components mounted on the top surface of the substrate and electrically connected to the substrate; an encapsulant formed on the top surface of the substrate for encapsulating the electronic components and the axial tube; and an impeller axially coupled to the axial tube via the bottom surface of the substrate. In the semiconductor package, the stator set is formed in the substrate by a patterning process. Therefore, the thickness of the semiconductor package is reduced significantly.

    Abstract translation: 提供一种半导体封装，包括具有顶表面，与顶表面相对的底表面的衬底，将顶表面与底表面连通的通孔以及由电路形成的定子组; 轴向管轴向安装在基板的通路中; 安装在所述基板的顶表面上并电连接到所述基板的多个电子部件; 形成在所述基板的顶表面上用于封装所述电子部件和所述轴向管的密封剂; 以及经由衬底的底表面轴向联接到轴向管的叶轮。 在半导体封装中，通过图案化工艺在基板中形成定子组。 因此，半导体封装的厚度显着降低。

    Vibration assembly for portable electronic device
    9.
    发明授权
    Vibration assembly for portable electronic device 有权
    便携式电子设备振动总成

    公开(公告)号：US08212657B2

    公开(公告)日：2012-07-03

    申请号：US12479923

    申请日：2009-06-08

    Applicant: Tse-Shan Peng

    Inventor： Tse-Shan Peng

    IPC: H04B3/36 ,  G10K1/26 ,  H02K7/06

    CPC classification number: H05K1/147 ,  H05K2201/1009

    Abstract: A vibrating device for portable electronic device includes a frame, a main circuit board, a motor and a secondary circuit board. The frame defines a recess and a receiving hole. The main circuit board is fixed in the recess of the frame. The motor is fixed in the receiving hole of the frame. The secondary circuit board electronically connects the main circuit board and the motor.

    Abstract translation: 便携式电子装置的振动装置包括框架，主电路板，电动机和二次电路板。 框架限定凹部和接收孔。 主电路板固定在框架的凹槽中。 电机固定在机架的接收孔中。 二次电路板电连接主电路板和电机。

    Axial flow fan motor
    10.
    发明授权
    Axial flow fan motor 失效
    轴流风机马达

    公开(公告)号：US5925948A

    公开(公告)日：1999-07-20

    申请号：US777048

    申请日：1996-12-30

    Applicant: Kaoru Matsumoto

    Inventor： Kaoru Matsumoto

    IPC: F04D29/00 ,  F04D25/06 ,  H02K5/20 ,  H02K7/14 ,  H02K11/04 ,  H02K21/22 ,  H02K29/08 ,  H05K1/18 ,  H02K29/00 ,  H02K11/00

    CPC classification number: H05K1/18 ,  F04D25/0633 ,  H02K11/33 ,  H02K29/08 ,  H02K7/14 ,  H05K2201/09027 ,  H05K2201/1009 ,  H05K2201/10689

    Abstract: To reduce the number of parts composing a control circuit and to reduce an area occupied by a printed circuit board on which the parts are to be mounted, in an axial flow fan motor in which a shaft is rotatably mounted by bearings and an impeller is mounted on the shaft, the control circuit is in the form of an arcuate shape having an area corresponding to 30% to 60% of an total area of the boss portion and is installed into a printed circuit board having a diameter smaller than that of the boss portion. Also, by utilizing the functions installed into the integrated circuit of the control circuit, the parts provided on the circuit board may be dispensed with. As a result, a space which corresponds to that of the printed circuit board is generated in an interior of a casing to thereby enhance the cooling performance and to reduce the number of the parts and the manufacture steps.

    Abstract translation: 为了减少构成控制电路的部件的数量，并减少其上要安装部件的印刷电路板所占据的面积，在轴流风扇电机中，其中轴通过轴承可旋转地安装并且安装有叶轮 在轴上，控制电路是具有对应于凸台部分的总面积的30％至60％的面积的弧形形状，并且安装在直径小于凸台的直径的印刷电路板中 一部分。 此外，通过利用安装在控制电路的集成电路中的功能，可以省略设置在电路板上的部件。 结果，在壳体的内部产生与印刷电路板相对应的空间，从而提高冷却性能，减少部件数量和制造步骤。

Patent Agency Ranking