公开(公告)号：US20110269306A1

公开(公告)日：2011-11-03

申请号：US13182364

申请日：2011-07-13

Applicant: KENJI FUKUDA

Inventor： KENJI FUKUDA

IPC: H01L21/283

CPC classification number: B23K1/0016 ,  B23K2101/40 ,  H01L24/17 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2203/0465 ,  Y02P70/613 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2924/00014

Abstract: An electronic component includes a plurality of first electrode pads arranged on a first substrate, a plurality of second electrode pads arranged at positions corresponding to the first electrode pads on a second substrate and a plurality of solder bumps which join together the first electrode pads and the second electrode pads. Here, the first substrate is located over the second substrate so that the first electrode pads and the second electrode pads are at positions which are shifted from opposite positions where the first electrode pads opposite to the second electrode pads, and at least a part of the solder bumps are solidified into hourglass-shaped.

Abstract translation: 电子部件包括布置在第一基板上的多个第一电极焊盘，布置在与第二基板上的第一电极焊盘相对应的位置处的多个第二电极焊盘以及将第一电极焊盘连接在一起的多个焊料凸块 第二电极垫。 这里，第一衬底位于第二衬底上，使得第一电极焊盘和第二电极焊盘处于与第二电极焊盘相对的第一电极焊盘的相对位置偏移的位置，并且至少一部分 焊料凸块固化成沙漏形。

公开(公告)号：US20110067911A1

公开(公告)日：2011-03-24

申请号：US12736986

申请日：2009-06-12

Applicant: Masayuki Ishikawa ,  Sho Nakagawa

Inventor： Masayuki Ishikawa ,  Sho Nakagawa

IPC: H05K1/11 ,  B23K31/02 ,  B32B15/00

CPC classification number: B23K1/0008 ,  B23K35/007 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/24 ,  B23K35/262 ,  B23K35/268 ,  B23K35/3013 ,  B23K2101/36 ,  B23K2103/52 ,  C22C5/02 ,  C22C11/06 ,  C22C13/00 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29144 ,  H01L2224/29298 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/83143 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2224/95085 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/15787 ,  H05K1/111 ,  H05K3/341 ,  H05K2201/09381 ,  H05K2201/09427 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T428/12486 ,  Y10T428/24777 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: In this method of bonding a part to a substrate using a solder paste, the solder paste is mounted or applied between a metallization layer formed on the substrate and a metallization layer formed on the part, and the part is bonded to the substrate by performing a reflow process in a non-oxidizing atmosphere to bond the substrate and the part. The metallization layer formed on the surface of the substrate is planar and includes a metallization layer main portion that has an area smaller than that of the metallization layer of the part and a solder guide portion that protrudes from a periphery of the metallization layer main portion.

Abstract translation: 在使用焊膏将部件接合到基板的方法中，将焊膏安装或施加在形成在基板上的金属化层和形成在该部件上的金属化层之间，并且通过执行 在非氧化性气氛中进行回流处理以将基板和部件结合。 形成在基板表面上的金属化层是平面的，并且包括具有小于该部分的金属化层的面积的金属化层主体部分和从金属化层主体部分的周边突出的焊料引导部分。

公开(公告)号：US20110000700A1

公开(公告)日：2011-01-06

申请号：US12446518

申请日：2007-10-11

Applicant: Yoshiaki Sato ,  Kohichiro Kawate ,  Tomihiro Hara ,  Noriko Kikuchi

Inventor： Yoshiaki Sato ,  Kohichiro Kawate ,  Tomihiro Hara ,  Noriko Kikuchi

IPC: H05K1/00 ,  H05K3/36

CPC classification number: H01R4/04 ,  H01R12/52 ,  H01R12/61 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/09709 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y10T29/49126

Abstract: A method of connecting circuit boards capable of easily accomplishing the connection maintaining reliability. A method of connection comprising the steps of obtaining a laminated body of a first circuit board, an adhesive sheet and a second circuit board, and accomplishing electric conduction between the first circuit and the second circuit by applying heat and pressure to the laminated body of the first circuit board, the adhesive sheet and the second circuit board, wherein an end of the circuit formed on at least either the first circuit board or the second circuit board is terminated at a position separated away from an end of the substrate, and the adhesive of the adhesive sheet is partly arranged between the end of the substrate of the circuit board and the end of the circuit so as to be adhered to the opposing circuit board.

Abstract translation: 一种连接电路板的方法，能够容易地实现连接维护的可靠性。 一种连接方法，包括以下步骤：获得第一电路板，粘合片和第二电路板的层压体，并且通过向第一电路和第二电路的叠层体施加热和压力来实现第一电路和第二电路之间的导电 第一电路板，粘合片和第二电路板，其中形成在至少第一电路板或第二电路板的电路的端部终止于远离衬底的端部分离的位置，并且粘合剂 粘合片部分地布置在电路板的基板的端部和电路的端部之间，以便粘附到相对的电路板。

公开(公告)号：US20100259912A1

公开(公告)日：2010-10-14

申请号：US12662218

申请日：2010-04-06

Applicant: Dong-Kil Shin ,  Shle-Ge Lee

Inventor： Dong-Kil Shin ,  Shle-Ge Lee

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427 ,  Y02P70/611 ,  Y02P70/613

Abstract: Provided is an electronic device which may include a first structure having a first surface, a first land region on the first surface, a second structure having a second surface facing the first surface, a second land region on the second surface, and a connection structure between the first and second structures electrically connecting the first land region to the second land region. As provided, the first land region may have a major axis and a minor axis on the first surface and the second land region may have a major axis and a minor axis on the second surface. Furthermore, the major axes of the first and second land regions may have different orientations with respect to one another.

Abstract translation: 提供一种电子设备，其可以包括第一结构，其具有第一表面，第一表面上的第一焊盘区域，具有面向第一表面的第二表面的第二结构，第二表面上的第二焊盘区域，以及连接结构 在第一和第二结构之间，电连接第一焊盘区域和第二焊盘区域。 如上所述，第一焊盘区域可以在第一表面上具有长轴和短轴，并且第二焊盘区域可以在第二表面上具有长轴和短轴。 此外，第一和第二脊区域的长轴可以具有彼此不同的取向。

公开(公告)号：US20090229853A1

公开(公告)日：2009-09-17

申请号：US12397944

申请日：2009-03-04

Applicant: KENJI FUKUDA

Inventor： KENJI FUKUDA

IPC: H01B5/00 ,  B23K1/00

CPC classification number: B23K1/0016 ,  B23K2101/40 ,  H01L24/17 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2203/0465 ,  Y02P70/613 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2924/00014

Abstract: An electronic component includes a plurality of first electrode pads arranged on a first substrate, a plurality of second electrode pads arranged at positions corresponding to the first electrode pads on a second substrate and a plurality of solder bumps which join together the first electrode pads and the second electrode pads. Here, the first substrate is located over the second substrate so that the first electrode pads and the second electrode pads are at positions which are shifted from opposite positions where the first electrode pads opposite to the second electrode pads, and at least a part of the solder bumps are solidified into hourglass-shaped.

Abstract translation: 电子部件包括布置在第一基板上的多个第一电极焊盘，布置在与第二基板上的第一电极焊盘相对应的位置处的多个第二电极焊盘以及将第一电极焊盘连接在一起的多个焊料凸块 第二电极垫。 这里，第一衬底位于第二衬底上，使得第一电极焊盘和第二电极焊盘处于与第二电极焊盘相对的第一电极焊盘的相对位置偏移的位置，并且至少一部分 焊料凸块固化成沙漏形。

公开(公告)号：US07213740B2

公开(公告)日：2007-05-08

申请号：US11213414

申请日：2005-08-26

Applicant: Glenn A. Rinne

Inventor： Glenn A. Rinne

IPC: B23K31/00 ,  G02B6/26

CPC classification number: G02B6/4219 ,  B23K3/0623 ,  B23K2101/40 ,  G02B6/3502 ,  G02B6/3512 ,  G02B6/3538 ,  G02B6/3568 ,  G02B6/3574 ,  G02B6/3594 ,  G02B6/3652 ,  G02B6/4232 ,  G02B6/4238 ,  G02B6/4239 ,  H01L2224/75251 ,  H01L2924/01019 ,  H01L2924/12041 ,  H05K1/0212 ,  H05K3/303 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3457 ,  H05K2201/09427 ,  H05K2201/09781 ,  H05K2203/048 ,  H05K2203/0776 ,  H05K2203/167 ,  Y02P70/613

Abstract: A liquid prime mover can be used to position a component on a substrate. For example, a liquid material can be provided on the substrate adjacent the component such that the component has a first position relative to the substrate. A property of the liquid material can then be changed to move the component from the first position relative to the substrate to a second position relative to the substrate. Related structures are also discussed.

Abstract translation: 可以使用液体原动机将组件定位在基板上。 例如，液体材料可以设置在邻近部件的基板上，使得部件相对于基板具有第一位置。 然后可以改变液体材料的性质，以使组件相对于衬底从第一位置移动到相对于衬底的第二位置。 还讨论了相关结构。

公开(公告)号：US07102721B2

公开(公告)日：2006-09-05

申请号：US10939383

申请日：2004-09-14

Applicant: Hiroshi Ueda ,  Hitoshi Morishita

Inventor： Hiroshi Ueda ,  Hitoshi Morishita

IPC: G02F1/1345

CPC classification number: H05K3/361 ,  G02F1/1345 ,  H05K1/117 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427

Abstract: The present invention is directed to a liquid crystal display including: a plurality of electrode terminals arranged on one of end faces of a TFT glass substrate in such a manner as to be aligned on an imaginary line; and a plurality of lead terminals of a tape carrier package aligned on the electrode terminals, said plurality of lead terminals connected through an anisotropic conductive film; wherein the electrode terminals near the end face of the glass substrate is formed obliquely in such a manner as to be extended in the direction of both right and left with respect to the plurality of electrode terminals.

Abstract translation: 本发明涉及一种液晶显示器，它包括：多个电极端子，以在假想线上对齐的方式设置在TFT玻璃基板的一个端面上; 以及在所述电极端子上排列的带状载体封装体的多个引线端子，所述多个引线端子通过各向异性导电膜连接; 其中靠近玻璃基板的端面的电极端子以相对于多个电极端子在左右两个方向上延伸的方式倾斜地形成。

公开(公告)号：US07078819B2

公开(公告)日：2006-07-18

申请号：US09854269

申请日：2001-05-11

Applicant: Thomas H. DiStefano

Inventor： Thomas H. DiStefano

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/81 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/49805 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/742 ,  H01L24/94 ,  H01L2224/02319 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/11003 ,  H01L2224/1184 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/29298 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/18301 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/0215 ,  H05K2201/0248 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/0465 ,  H05K2203/074 ,  H05K2203/306 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A soldered assembly for a microelectronic element includes a microelectronic element, solder columns extending from a surface of the microelectronic element and terminals connected to distal ends of the columns. The assembly can be handled and mounted using conventional surface-mount techniques, but provides thermal fatigue resistance. The solder columns may be inclined relative to the chip surface, and may contain long, columnar inclusions preferentially oriented along the lengthwise axes of the columns.

Abstract translation: 用于微电子元件的焊接组件包括微电子元件，从微电子元件的表面延伸的焊料柱和连接到柱的远端的端子。 组件可以使用传统的表面贴装技术进行处理和安装，但提供耐热疲劳性能。 焊料柱可以相对于芯片表面倾斜，并且可以包含沿着柱的纵向轴线优先取向的长的柱状夹杂物。

公开(公告)号：US20060091525A1

公开(公告)日：2006-05-04

申请号：US11265952

申请日：2005-11-03

Applicant: Saiki Hajime ,  Iba Masahiro

Inventor： Saiki Hajime ,  Iba Masahiro

IPC: H01L23/053

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L2224/81191 ,  H01L2924/01322 ,  H05K3/3452 ,  H05K3/3463 ,  H05K2201/09427 ,  H05K2201/099 ,  H05K2201/10992 ,  H05K2203/0465 ,  H05K2203/0594 ,  Y02P70/613 ,  H01L2924/00

Abstract: An electronic device comprised of a wiring board with a semiconductor component. The device is unlikely to have any defects, such as cracks to a solder joint portion during a reflow process of a flip-chip connection. The semiconductor component is flip-chip bonded at a pad array at a component side thereof to a pad array at a board side by way of an individual solder joint portion. In a solder resist layer at a semiconductor component side and a solder resist layer at a board side, D/D0 is prepared to be in a range of 0.70 to 0.99, where D is a bottom inner diameter of an opening at the board side and D0 is a bottom inner diameter of an opening at the component side.

Abstract translation: 一种由具有半导体部件的布线板构成的电子装置。 在倒装芯片连接的回流工艺期间，器件不太可能具有任何缺陷，例如焊接部分的裂纹。 半导体部件在其一侧的焊盘阵列处通过单独的焊接部分在基板侧被倒装成焊盘阵列。 在半导体部件侧的阻焊层和基板侧的阻焊层中，D / D 0为0.70〜0.99的范围，其中D为板侧开口的底部内径 D 0是部件侧的开口的底部内径。

公开(公告)号：US20060027396A1

公开(公告)日：2006-02-09

申请号：US11199311

申请日：2005-08-08

Applicant: Yu-Jun Yang

Inventor： Yu-Jun Yang

IPC: H05K1/11

CPC classification number: H05K3/363 ,  H05K3/3494 ,  H05K2201/09427 ,  H05K2203/0195 ,  H05K2203/0278 ,  Y10T29/49126

Abstract: The present invention relates to a hot bar soldering method for soldering two circuit boards, including following steps: firstly, providing a first circuit board (4) including a plurality of first pads (42) and a second circuit board (5) including a plurality of second pads (52), each of the pads having opposite first and second ends, and the first pads being longer than the second pads; secondly, aligning each of the first pads and the corresponding second pads, and leaving the first ends (421) of the first pads uncovered by the second circuit board; finally, hot pressing the second circuit board where the first pads and the second pads overlap and simultaneously at the second ends of the first pads.

Abstract translation: 本发明涉及一种用于焊接两个电路板的热棒焊接方法，包括以下步骤：首先，提供包括多个第一焊盘（42）的第一电路板（4）和包括多个第一焊盘 的第二焊盘（52），每个焊盘具有相对的第一和第二端，并且第一焊盘比第二焊盘长; 其次，使每个第一焊盘和相应的第二焊盘对准，并且留下未被第二电路板覆盖的第一焊盘的第一端（421）; 最后，在第一焊盘和第二焊盘重叠的同时在第一焊盘的第二端处热压第二电路板。