公开(公告)号：US20240172362A1

公开(公告)日：2024-05-23

申请号：US18426973

申请日：2024-01-30

Applicant: Samsung Display Co., LTD.

Inventor： SEHUI JANG ,  CHONGGUK LEE

IPC: H05K1/11 ,  G02F1/1345 ,  H01L25/18 ,  H05K1/02 ,  H05K1/18 ,  H10K59/131

CPC classification number: H05K1/118 ,  H05K1/0268 ,  H05K1/189 ,  G02F1/13452 ,  H01L25/18 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/09781 ,  H05K2201/10128 ,  H05K2201/10136 ,  H10K59/131

Abstract: A display device is provided and includes a display panel including a display area that displays an image and a pad area disposed at least at a side of the display area, and a flexible circuit film electrically connected to the pad area. The flexible circuit film includes connection pads, a first measurement pad, and a second measurement pad. The connection pads are arrayed in a first direction and inclined with respect to a reference line extending in a second direction different from the first direction, the first measurement pad is disposed adjacent to a first side of the connection pads, and the second measurement pad is disposed adjacent to a second side of the connection pads. The connection pads are between the first measurement pad and the second measurement pad.

公开(公告)号：US11991834B2

公开(公告)日：2024-05-21

申请号：US17079900

申请日：2020-10-26

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jae Uk Cho

IPC: H05K3/32 ,  B21J9/02 ,  B21J9/08 ,  H05K1/18

CPC classification number: H05K3/325 ,  B21J9/022 ,  B21J9/08 ,  H05K1/189 ,  H05K3/32 ,  H05K2201/10128 ,  H05K2201/10598 ,  H05K2203/0278 ,  H05K2203/1105

Abstract: A pressing method operatively associated with a press apparatus includes: providing a first substrate connected with a flexible printed circuit board onto a stage; providing a second substrate onto the stage; arranging the flexible printed circuit board on the second substrate; pressing a pad electrode-free area of the flexible printed circuit board; and pressing first pad electrodes of the flexible printed circuit board and second pad electrodes of the second substrate.

公开(公告)号：US11990695B2

公开(公告)日：2024-05-21

申请号：US17662715

申请日：2022-05-10

Applicant: Apple Inc.

Inventor： Sam Mahin Shirazi ,  Eric T. Chiang ,  Matthew Burke ,  Tiexuan Wang ,  Yong Gang Li ,  Henry H. Yang

IPC: H01R12/57 ,  H01R4/02 ,  H01R43/20 ,  H01R13/22 ,  H05K1/14 ,  H05K1/18

CPC classification number: H01R12/57 ,  H01R4/02 ,  H01R43/205 ,  H01R13/22 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10128

Abstract: Electronic assemblies and methods of attaching retention structures are described. The electronic assemblies may include a receiving substrate and a retention structure bonded to the receiving substrate. The retention structure may be patterned to include openings such as slot openings or a fishbone pattern in order to receive a pair of solder joints to bond the retention structure to a top side of the receiving substrate.

公开(公告)号：US11979984B2

公开(公告)日：2024-05-07

申请号：US17053735

申请日：2020-09-08

Applicant: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Changming Xiang

IPC: H05K1/11

CPC classification number: H05K1/112 ,  H05K2201/10106 ,  H05K2201/10128

Abstract: A splicing display screen is provided. The splicing display screen includes a circuit board, a plurality of display panels, and a plurality of first metal lines. The circuit board includes a plurality of circuit areas, and each of the circuit areas includes one of mounting areas and one of electrical connection areas. A plurality of first metal parts are disposed in the electrical connection areas. The display panels are disposed on the circuit board and positioned in the mounting areas, and metal connection pads on the display panels are electrically connected to the first metal parts by the first metal lines.

公开(公告)号：US20240147608A1

公开(公告)日：2024-05-02

申请号：US18088621

申请日：2022-12-26

Applicant: AUO Corporation

Inventor： Tsung-Ying Ke

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/028 ,  H05K1/189 ,  H05K2201/10128

Abstract: A display apparatus, including a display panel and a flexible circuit board, is provided. The display panel has a first side and a second side adjacent to each other. The flexible circuit board includes a first part and a second part connected to each other. The first part is electrically bonded to the first side of the display panel. The second part is electrically bonded to the second side of the display panel. The first part of the flexible circuit board is bent along a first bending axis. The second part of the flexible circuit board is bent along a second bending axis. The flexible circuit board is provided with an opening, and an intersection of the first bending axis and the second bending axis overlaps with the opening. A method of fabricating the display apparatus is also provided.

公开(公告)号：US20240138072A1

公开(公告)日：2024-04-25

申请号：US18231289

申请日：2023-08-07

Applicant: Samsung Display Co., LTD.

Inventor： SHINYA ONOUE ,  EUNJOONG MUN ,  HYEON DEUK HWANG ,  JUNGWOOK KIM ,  HEECHANG KIM ,  Kyounghee PARK ,  JIYUN BANG

IPC: H05K3/00 ,  H05K1/02 ,  H05K1/05 ,  H05K3/12

CPC classification number: H05K3/0014 ,  H05K1/0274 ,  H05K1/056 ,  H05K3/125 ,  H05K3/1283 ,  H05K2201/10128

Abstract: A method of manufacturing an electronic device includes providing a mold with a first opening defined therein and including a projection portion disposed in the first opening, forming, in the first opening, a first layer including a first material through an inkjet printing method, disposing the mold on a display panel in a way such that the first opening faces the display panel, and forming a display module by removing the mold. The display module is provided with a second opening defined therein and corresponding to the projection portion.

公开(公告)号：US11968779B2

公开(公告)日：2024-04-23

申请号：US17933704

申请日：2022-09-20

Applicant: LG INNOTEK CO., LTD.

Inventor： Ki Tae Park ,  Chae Won Kang ,  Man Ki Son

IPC: H05K1/02 ,  H05K3/28

CPC classification number: H05K1/0296 ,  H05K1/028 ,  H05K3/28 ,  H05K2201/10128

Abstract: A flexible printed circuit board according to an embodiment includes: a substrate; a circuit pattern disposed on the substrate; and a protective layer on the circuit pattern, wherein the circuit pattern includes a first circuit pattern and a second circuit pattern connected to a chip in a chip mounting region, a first direction that is a direction in which the circuit pattern extends and a second direction perpendicular to the first direction are defined in the substrate, the substrate includes first and second ends facing each other in the first direction and third and fourth ends facing each other in the second direction, the protective layer includes fifth and sixth ends spaced apart from ends of the substrate and facing in the first direction and seventh and eighth ends spaced apart from ends of the substrate and facing in the second direction, and an outer pattern disposed adjacent to the third end and the fourth end on the substrate, wherein the outer pattern includes: a first outer pattern and a second outer pattern adjacent to a pad portion of the first circuit pattern and facing in the second direction; and a third outer pattern and a fourth outer pattern adjacent to a pad portion of the second circuit pattern and facing in the second direction, the first outer pattern includes a first pattern portion and a second pattern portion spaced apart from each other, the second outer pattern includes a third pattern portion and a fourth pattern portion spaced apart from each other, the third outer pattern includes a fifth pattern portion and a sixth pattern portion spaced apart from each other, the fourth outer pattern includes a seventh pattern portion and an eighth pattern portion spaced apart from each other, and a fifth end of the protective layer is disposed between the first pattern portion and the second pattern portion and between the third pattern portion and the fourth pattern portion.

公开(公告)号：US11957018B2

公开(公告)日：2024-04-09

申请号：US18314354

申请日：2023-05-09

Applicant: InnoLux Corporation

Inventor： Hui-Min Huang ,  Li-Wei Sung ,  Cheng-Tso Chen ,  Chia-Min Yeh

IPC: H10K59/131 ,  G09F9/33 ,  H01L27/12 ,  H05K1/02 ,  H05K1/11 ,  H05K3/06

CPC classification number: H10K59/131 ,  G09F9/33 ,  H01L27/124 ,  H05K1/025 ,  H05K1/115 ,  H05K3/06 ,  H10K59/1315 ,  G09G2300/0426 ,  H05K2201/09227 ,  H05K2201/10128

Abstract: A display device includes: a substrate having display and non-display areas; a first conductive layer including first and second sub-conductive lines; a second conductive layer including third and fourth sub-conductive lines, wherein, in the display area, the first sub-conductive line and the third sub-conductive lines cross from a top view; and a third conductive layer including third conductive lines and corresponding to the non-display area; wherein, corresponding to the non-display area, a portion of a projection of the one of the third conductive lines is overlapped with a portion of a projection of the second sub-conductive line on the substrate, and another portion of the projection of the one of the third conductive lines is overlapped with a portion of a projection of the fourth sub-conductive line on the substrate.

公开(公告)号：US11956899B2

公开(公告)日：2024-04-09

申请号：US17488894

申请日：2021-09-29

Applicant: Samsung Display Co., Ltd.

Inventor： Joo-Nyung Jang

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/117 ,  H05K1/028 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/06 ,  H05K2201/10128

Abstract: A display panel includes a substrate including a display area and a pad area, a plurality of pad electrodes disposed on the pad area, and an insulating layer disposed between adjacent ones of the plurality of pad electrodes and including a heat absorbing particle. A laser is irradiated to heat the insulating layer, and the heat absorbing particle in the insulating layer absorbs the heat and cures an anisotropic conductive film by heat transfer to electrically connect the plurality of pad electrodes to a plurality of bump electrodes.

公开(公告)号：US11937414B2

公开(公告)日：2024-03-19

申请号：US18194042

申请日：2023-03-31

Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Qizhong Chen ,  Bing Ji

IPC: H05K1/18 ,  H01L23/552 ,  H05K9/00 ,  H01L25/18

CPC classification number: H05K9/0024 ,  H01L23/552 ,  H05K9/0054 ,  H01L25/18 ,  H05K1/189 ,  H05K9/009 ,  H05K2201/10128

Abstract: The display assembly includes a display module, a flexible printed board, an integrated circuit chip, and a composite tape. The integrated circuit chip and a binding portion of the flexible printed board are respectively in binding connection with the display module. The composite tape includes: a conductive fabric layer comprising a first part and a second part, the first part covering the integrated circuit chip and the binding portion, and the second part covering at least part of a grounding portion of the flexible printed board; and an insulating film layer on a side of the conductive fabric layer facing the integrated circuit chip and the flexible printed board, and including a third part, which is at the first part of the conductive fabric layer and covering the integrated circuit chip and the binding portion, and the insulating film layer avoiding the at least part of the grounding portion.