公开(公告)号：US20200049551A1

公开(公告)日：2020-02-13

申请号：US16535769

申请日：2019-08-08

Applicant: BCS Automotive Interface Solutions GmbH

Inventor： Laura Horan ,  Ulrich Backes

IPC: G01J1/08 ,  G01J1/04 ,  F21V5/04 ,  G02B3/08

Abstract: An optical assembly for an optical sensor device has a lens plate, a light source, and a light receiving unit. The lens plate includes a lens structure on a side associated with the light source and a light extraction structure on a side facing away from the light source. The lens structure has different local radii of curvature.

公开(公告)号：US20200000206A1

公开(公告)日：2020-01-02

申请号：US16023854

申请日：2018-06-29

Applicant: Sephora USA, Inc.

Inventor： Jamie G. Nichol

IPC: A45D44/00 ,  G01J1/46 ,  G01J1/08 ,  H05B37/02 ,  H05B33/08 ,  H04B1/02

Abstract: Exemplary embodiments provide a simple, inexpensive, and easy-to-operate color capture device that can capture color information and transmit the captured color information to an interface device such as smartphone, where the captured color information is optionally processed and is then transmitted to a remote server for subsequent production of the customized cosmetic.

公开(公告)号：US20190170572A1

公开(公告)日：2019-06-06

申请号：US16178840

申请日：2018-11-02

Applicant: Skorpios Technologies, Inc.

Inventor： Robert J. Stone ,  Stephen B. Krasulick

IPC: G01J1/08 ,  H04B17/00 ,  H04B10/073 ,  G01J1/42 ,  G01R31/3187 ,  H04B10/077 ,  H04B10/035

CPC classification number: G01J1/08 ,  G01J1/42 ,  G01J2001/083 ,  G01J2001/4247 ,  G01R31/3187 ,  H04B10/035 ,  H04B10/0731 ,  H04B10/0779 ,  H04B17/0082

Abstract: A photonics system includes a transmit photonics module and a receive photonics module. The photonics system also includes a transmit waveguide coupled to the transmit photonics module, a first optical switch integrated with the transmit waveguide, and a diagnostics waveguide optically coupled to the first optical switch. The photonics system further includes a receive waveguide coupled to the receive photonics module and a second optical switch integrated with the receive waveguide and optically coupled to the diagnostics waveguide.

公开(公告)号：US10241625B2

公开(公告)日：2019-03-26

申请号：US15724114

申请日：2017-10-03

Applicant: LG ELECTRONICS INC.

Inventor： Chansung Jeong ,  Dongjin Yoon ,  Sangtae Park

IPC: G06F3/042 ,  G01J1/04 ,  G01J1/08

Abstract: A display device is disclosed. The display device of present invention comprises a display panel; a light transmitting panel positioned at a front of the display panel, the light transmitting panel including a first edge and a second edge opposite to the first edge; a back cover positioned at a rear of the display panel; and a sensor unit adjacent to a lateral side of the display panel. The sensor unit includes a frame and a optical transmitter and a optical receiver. The optical transmitter includes a optical assembly and a optical bender.

公开(公告)号：US20180360359A1

公开(公告)日：2018-12-20

申请号：US15622846

申请日：2017-06-14

Applicant: Analog Devices Global

Inventor： John Jude O'Donnell ,  Colin G. Lyden ,  Michael C.W. Coln

IPC: A61B5/1455 ,  G01J1/46 ,  G01J1/08 ,  A61B5/00

Abstract: A photometry device can include a first LED to emit light to a target in response to a first current through the first LED, a second LED to emit light to the target in response to a second current through the second LED, and an inductor, coupled to the first and second LEDs, to store energy associated with at least one of the first and second currents.

公开(公告)号：US20180340821A1

公开(公告)日：2018-11-29

申请号：US15819570

申请日：2017-11-21

Applicant: TSINGHUA UNIVERSITY

Inventor： Qionghai Dai ,  Liheng Bian ,  Feng Chen ,  Jinli Suo

IPC: G01J1/44 ,  G01J1/08 ,  G02B21/26 ,  G02B21/06 ,  G02B21/36

Abstract: A microscopic tomography device based on light-sheet and single-pixel imaging is provided. The device includes: a light source; a pattern modulator, configured to modulate light from the light source into different illumination patterns; a light modulator, configured to modulate the illumination patterns as patterned light sheets; a detector, configured to detect the light passing through the sample after the sample is illuminated by the patterned light sheets; a focusing lens, configured to focus the light passing through the sample onto the detector; and a reconstruction component, configured to reconstruct an image of the sample at the illuminated depth using the illumination patterns, corresponding measurements and a single-pixel imaging algorithm.

公开(公告)号：US10126472B2

公开(公告)日：2018-11-13

申请号：US15256715

申请日：2016-09-05

Applicant: National Applied Research Laboratories

Inventor： Jyh-Rou Sze ,  Po-Jui Chen ,  Chun-Fu Lin

IPC: G01J1/08 ,  G02B5/18 ,  G02B17/00 ,  G02B27/30 ,  G02B27/42 ,  G02B27/10 ,  G01J3/02 ,  G01J3/18

Abstract: A multi-band spectrum division device is provided, comprising: a first parabolic reflection mirror, planar multi-mirrors, an optical grating and a second parabolic mirror. The first parabolic mirror is configured to reduce the divergent angle of incident optical beam, and to generate a collimated optical beam. The planar multi-mirrors are configured to adjust the incident angles of collimated beam on the grating surface. The grating is configured to disperse the incident signals with multi-wavelengths. The second parabolic mirror is configured to focus the multi-wavelength signals on its focal plane. Besides, each of the planar multi-mirrors has different location and angle in this device.

公开(公告)号：US20180259388A1

公开(公告)日：2018-09-13

申请号：US15915835

申请日：2018-03-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungtaek OH ,  Namsu KIM ,  Myunggon KIM ,  Seohyun KIM

IPC: G01J1/04 ,  G01J1/08 ,  G01J1/44

Abstract: An electronic device is disclosed and includes an optical sensor module, a window, a first shield-printed layer, and a second shield-printed layer. The optical sensor module includes a first optical sensor and a second optical sensor. The window covers the optical sensor module. The first shield-printed layer is printed in a first region for transmitting a sensor light from the first optical sensor on a lower surface of the window facing the optical sensor module. The second shield-printed layer is printed in a second region for transmitting a sensor light from the second optical sensor on the lower surface of the window. The first and second shield-printed layers are printed using a same coloring material.

公开(公告)号：US10036666B2

公开(公告)日：2018-07-31

申请号：US15137310

申请日：2016-04-25

Applicant: OMRON Corporation

Inventor： Tsuyoshi Miyata ,  Jun Nakajima ,  Seiji Miyashita ,  Kiyoshi Imai ,  Kazuya Ohtsuki

IPC: H01J40/14 ,  G01J1/42 ,  H01L31/02 ,  H01L31/167 ,  H01R4/2425 ,  G01J1/08

CPC classification number: G01J1/42 ,  G01J1/08 ,  H01L31/02005 ,  H01L31/167 ,  H01L2924/0002 ,  H01R4/2425 ,  H01L2924/00

Abstract: A photosensor is provided with a sensor circuit assembly. The sensor circuit assembly includes alight emitter, a light receiver, a light-emitter support, a light-receiver support, and a connecting part. The light emitter and the light receiver face each other. The light-emitter support extends from and supports the light emitter. The light-receiver support extends from and supports the light receiver. The connecting part connects one end of the light-emitter support with one end of the light-receiver support. The connecting part includes a seal and a connection terminal that protrudes from the seal. The connection terminal includes a first press-contact part, and a first pressure part that presses the first press-contact part in a press-contact direction.

公开(公告)号：US20180113022A1

公开(公告)日：2018-04-26

申请号：US15298370

申请日：2016-10-20

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tim Boescke ,  Christoph Goeltner

IPC: G01J1/44 ,  G01J1/02 ,  G01J1/08

CPC classification number: G01J1/44 ,  G01J1/0204 ,  G01J1/0271 ,  G01J1/08 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14629 ,  H01L27/14678

Abstract: An integrated circuit for sensor applications includes a plurality of photosensitive areas on a top side, capable of measuring incident light, thereby creating a signal, and a processing unit adapted to evaluate the signal measured by the photosensitive areas; and a sensor including 1) the integrated circuit, 2) a housing with a first cavity and a second cavity, and 3) a barrier located between the first cavity and the second cavity, wherein the integrated circuit is located within the first cavity, the top side of the integrated circuit faced upwardly, and a light source is located within the second cavity.