公开(公告)号：US20180211779A1

公开(公告)日：2018-07-26

申请号：US15745670

申请日：2016-06-16

Applicant: EPCOS AG

Inventor： Masakazu Hirose ,  Tomoya Imura ,  Tomohiro Terada ,  Goushi Tauchi

IPC: H01G4/12 ,  H01G4/30 ,  H01G4/012 ,  C04B35/475 ,  C04B35/628 ,  C04B35/626 ,  C04B41/45 ,  C04B41/51 ,  C04B41/88 ,  C04B35/64

CPC classification number: H01G4/1227 ,  C01G29/006 ,  C04B35/47 ,  C04B35/475 ,  C04B35/6262 ,  C04B35/62645 ,  C04B35/62821 ,  C04B35/638 ,  C04B35/64 ,  C04B41/4578 ,  C04B41/5111 ,  C04B41/88 ,  C04B2235/3201 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/3224 ,  C04B2235/3227 ,  C04B2235/3229 ,  C04B2235/3236 ,  C04B2235/3284 ,  C04B2235/3298 ,  C04B2235/602 ,  C04B2235/656 ,  C04B2235/6582 ,  C04B2235/768 ,  C04B2235/78 ,  C04B2235/85 ,  H01B3/10 ,  H01B3/12 ,  H01G4/012 ,  H01G4/30

Abstract: A dielectric composition, a dielectric element, an electronic component and a laminated electronic component are disclosed. In an embodiment the dielectric composition includes particles having a perovskite crystal structure including at least Bi, Na, Sr and Ti, wherein at least some of the particles have a core-shell structure including a core portion and a shell portion, and wherein the content of Bi present in the core portion is no greater than 0.83 times the content of Bi present in the shell portion.

公开(公告)号：US10024725B2

公开(公告)日：2018-07-17

申请号：US14442357

申请日：2013-09-27

Applicant: EPCOS AG

Inventor： Jan Ihle ,  Oliver Bard ,  Gerald Kloiber

IPC: G01K1/08 ,  G01K7/22

Abstract: The invention relates to a temperature sensor system comprising a first ceramic housing part comprising a sleeve-shaped lower part with a first lower end having a first opening, and a second upper end having a second opening, and an upper part connected to the second upper end. The temperature sensor system further comprises a temperature probe element which is at least partially arranged in the lower part and which has a ceramic sensor element housing, a sensor element arranged in the sensor element housing, and electrical supply lines. The sensor element housing is at least partially arranged in the first opening. The ceramic sensor element housing has a higher thermal conductivity than the first ceramic housing part. Also disclosed is a method for producing a temperature sensor system.

公开(公告)号：US20180169287A1

公开(公告)日：2018-06-21

申请号：US15894153

申请日：2018-02-12

Applicant: Relyon Plasma GmbH ,  EPCOS AG

Inventor： Stefan Nettesheim ,  Dominik Burger ,  Georg Kuegerl ,  Markus Puff

IPC: A61L9/12 ,  A61L9/22 ,  A61L9/04 ,  B01D53/66

CPC classification number: A61L9/122 ,  A61L9/015 ,  A61L9/046 ,  A61L9/22 ,  A61L2209/132 ,  A61L2209/14 ,  A61L2209/16 ,  A61L2209/212 ,  A61L2209/22 ,  B01D53/66 ,  B60H3/0078 ,  B60H3/0092 ,  F24F3/16 ,  F24F2003/1685 ,  H05H1/2475 ,  H05H2001/2481

Abstract: The invention relates to an air-conditioning device for a space to be air-conditioned. The air-conditioning device has a housing including an air supply and an air discharge. In the housing, a flow path is formed between the air supply and the air discharge. In the flow path, at least one heat exchanger, a blower, and a means for generating an excited gas are provided. Furthermore, a surface coating is provided in the flow path, which is configured for the catalytic decomposition of the ozone content of the excited gas, and which is arranged downstream of the means for generating the excited gas.

公开(公告)号：US20180160540A1

公开(公告)日：2018-06-07

申请号：US15575300

申请日：2016-04-20

Applicant: EPCOS AG

Inventor： Florian VELDEN ,  Guenter FEIST

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K1/11

CPC classification number: H05K1/184 ,  H05K1/11 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/1003 ,  H05K2201/10424 ,  H05K2201/10568 ,  H05K2201/10878

Abstract: A device for orienting contact terminals on an electrical component such that they fit to a circuit board of an electric circuit is disclosed. In an embodiment the device includes a carrier element configured to receive the electrical component and a plurality of bending elements, wherein the carrier element has a plurality of holes, each hole penetrating the carrier element from an upper side to an underside, wherein a respective section of the bending elements is secured to the carrier element and a respective end of the bending elements projects into a respective hole of the carrier element, and wherein the bending elements are configured such that the respective end of the bending elements, upon insertion of a respective contact terminal of the electrical component into the respective hole from the upper side of the carrier element, is bent within the hole and clamps the respective contact terminal.

公开(公告)号：US20180158613A1

公开(公告)日：2018-06-07

申请号：US15866385

申请日：2018-01-09

Applicant: EPCOS AG

Inventor： Günter Engel ,  Michael Schossmann ,  Markus Koini ,  Andrea Testino ,  Christian Hoffmann

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/12 ,  H01G4/224

CPC classification number: H01G4/2325 ,  H01G4/1209 ,  H01G4/224 ,  H01G4/232 ,  H01G4/30

Abstract: A capacitor arrangement is disclosed. In an embodiment the arrangement includes a ceramic multilayer capacitor including a main body comprising ceramic layers, first electrode layers and second electrode layers arranged there between and a first external contact and a second external contact on mutually opposite side surfaces, wherein the first external contact is electrically conductively connected to the first electrode layers and the second external contact is electrically conductively connected to the second electrode layers.

公开(公告)号：US09955273B2

公开(公告)日：2018-04-24

申请号：US15301663

申请日：2014-04-04

Applicant: EPCOS AG

Inventor： Gino Rocca ,  Jan Tue Ravnkilde

IPC: H04R29/00 ,  H04R1/04 ,  H04R3/04 ,  H04R3/00 ,  H04R19/00

CPC classification number: H04R29/004 ,  H04R1/04 ,  H04R3/00 ,  H04R3/04 ,  H04R19/005

Abstract: A microphone assembly is disclosed. In an embodiment, the assembly includes a transducer and an electronic circuit operatively connected to the transducer, wherein the electronic circuit comprises a test mode circuitry configured to selectively set the microphone assembly in one or more test modes or an operational mode, and wherein the one or more test modes enable determining at least one parameter of the transducer.

公开(公告)号：US09934892B2

公开(公告)日：2018-04-03

申请号：US15102645

申请日：2014-11-13

Applicant: EPCOS AG

Inventor： Dennis Sun ,  Jamie Jing ,  Qirong Li

IPC: H01C7/10 ,  H01C7/102 ,  H01C1/142 ,  H01C17/28 ,  H01C17/30 ,  H01C1/144

CPC classification number: H01C7/102 ,  H01C1/142 ,  H01C1/144 ,  H01C17/28 ,  H01C17/281 ,  H01C17/283 ,  H01C17/30

Abstract: A method for fabricating a varistor device is presented. In an embodiment the method includes providing a base body for the varistor device, wherein the base body comprises a ceramic material, providing a basic material for a base metal electrode region on the base body, exposing the base body with the basic material to a temperature under a protective gas atmosphere such that the base metal electrode region is formed and firmly connected to the base body and completing the varistor device.

公开(公告)号：US09875851B2

公开(公告)日：2018-01-23

申请号：US15451120

申请日：2017-03-06

Applicant: EPCOS AG

Inventor： Guenter Engel ,  Michael Schossmann ,  Markus Koini ,  Andrea Testino ,  Christian Hoffmann

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/248 ,  H01G4/12 ,  H01G4/008 ,  H01G4/232 ,  C04B35/493 ,  B32B18/00

CPC classification number: H01G4/30 ,  B32B18/00 ,  B32B2457/00 ,  C04B35/493 ,  C04B2235/3201 ,  C04B2235/3203 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3227 ,  C04B2235/3234 ,  C04B2235/3249 ,  C04B2235/3262 ,  C04B2235/3274 ,  C04B2235/3275 ,  C04B2235/3279 ,  C04B2235/3281 ,  C04B2235/3291 ,  C04B2235/3296 ,  C04B2235/3427 ,  C04B2235/768 ,  C04B2235/79 ,  C04B2237/346 ,  C04B2237/348 ,  C04B2237/704 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1218 ,  H01G4/1236 ,  H01G4/1245 ,  H01G4/232 ,  H01G4/248

Abstract: A ceramic multi-layer capacitor includes a main body, which has ceramic layers arranged along a layer stacking direction to form a stack, and first and second electrode layers arranged between the ceramic layers. The multi-layer capacitor also includes a first external contact-connection arranged on a first side surface of the main body and electrically conductively connected to the first electrode layers, and a second external contact-connection arranged on a second side surface of the main body. The second side surface is situated opposite the first side surface and is electrically conductively connected to the second electrode layers.

公开(公告)号：US09854360B2

公开(公告)日：2017-12-26

申请号：US15300039

申请日：2014-05-07

Applicant: Epcos AG

Inventor： Fabrizio Conso

IPC: H04R3/00 ,  H04R3/06 ,  H04R1/04 ,  H03K5/26 ,  H04R29/00 ,  H04R19/04

CPC classification number: H04R3/06 ,  H03K5/26 ,  H04R1/04 ,  H04R19/04 ,  H04R29/004 ,  H04R2201/003

Abstract: A MEMS microphone which is able to be set to different modes of operation is proposed that requires one single pin to apply an external clock frequency to the microphone. The applied clock frequency is selected according to a desired mode of operation and the microphone detects the applied frequency and sets the mode of operation.

公开(公告)号：US20170338787A1

公开(公告)日：2017-11-23

申请号：US15525576

申请日：2015-10-30

Applicant: EPCOS AG

Inventor： Andrew TUCKER ,  Norbert JARFAS

IPC: H03H1/00 ,  H01F27/28 ,  H01R9/03

Abstract: The present invention concerns a line filter (1), which is configured to be installed onto a system cable (2), wherein the line filter (1) comprises a magnetic component (4), wherein the line filter (1) defines a cable path (6) through the line filter (1), wherein the line filter (1) is configured to allow a placement of the system cable (2) along the cable path (6) at the time of an installation, thereby providing a magnetic coupling of the system cable (2) to the magnetic component (4), and wherein the line filter (1) comprises an insulation displacement connector (16) and a shunt component (5) wherein the insulation displacement connector (16) is configured to be tightened at the time of the installation, thereby providing a galvanic connection of the system cable (2) to the shunt component (5). Further, the present invention concerns a method of installing a line filter (1) onto a system cable (2).