Abstract:
Disclosed herein are Raman probes that include: (a) a first optical fiber for receiving laser excitation light from a light source and transmitting the same; (b) a first filter for receiving light from the first optical fiber and adapted to pass the laser excitation light and to block spurious signals associated with the light; (c) a second filter for receiving light from the first filter and adapted to direct the light toward a specimen; and (d) focusing apparatus for receiving the light from the second filter, focusing the light on the specimen so as to generate the Raman signal, and returning the Raman signal to the second filter. The second filter is further configured so that when the second filter receives the Raman signal from the focusing apparatus, the second filter filters out unwanted laser excitation light before directing the Raman signal to a second optical fiber.
Abstract:
Apparatus is disclosed for precision alignment and assembly of opto-electronic components relative to one another, the apparatus comprising a selected optical component having a periphery forming at least one flat surface; a holding block having at least one attachment region corresponding to the at least one flat surface of the selected optical component; a positioning mechanism having a first portion and a second portion, the first portion configured to position the selected optical component relative to another opto-electronic component, and the second portion configured to position the holding block relative to the selected optical component and in contact with a platform in attachment with the another opto-electronic component; and an attachment component disposed between the selected optical component and the holding block, and the attachment component disposed between the holding block and the platform so as to fix the selected optical component in position relative to the another opto-electronic component. A method of precision alignment and assembly of opto-electronic components relative to one another is disclosed, the method comprising: positioning the selected optical component relative to the another optical component using the first portion of the positioning mechanism; positioning the holding block relative to the selected optical component and in contact with the platform; and securing the selected optical component and the holding block, and the holding block and the platform, with the attachment component.
Abstract:
A laser source for generating amplified and filtered optical output, comprising a VCSEL, a power optical amplifier, and a filter. A laser source for generating amplified and filtered optical output, comprising a first mirror and a second mirror forming a cavity, an optical amplifier disposed in the cavity, and filter means for filtering ASE generated and amplified by the optical amplifier. A system for generating amplified and filtered optical output, comprising an optical platform having electrical connections and a fiber optic connection, a VCSEL configured to generate seed light, an optical amplifier configured to receive and amplify seed light to generate power boosted ASE and a filter configured to reduce background noise from the power boosted ASE. A method of generating optical output having high optical power with high spectral fidelity, comprising generating seed light, amplifying seed light, and filtering the amplified optical output to reduce background noise.
Abstract:
Systems and methods disclosed include: a support apparatus configured to detachably receive a chip; movable pins extendible from a first position to a second position, where, in the first position, the movable pins do not contact a chip positioned on the support apparatus, and in the second position, the movable pins contact electrical terminals of a heating element within a chip positioned on the support apparatus; a radiation source configured to direct radiation to be incident on a chip positioned on the support apparatus; a detector; and an electronic processor, the electronic processor being configured to detect molecules in a sample positioned within the chip, and to determine a temperature of the chip by measuring an electrical resistance between two of the multiple pins connected to the electrical terminals.
Abstract:
We disclose apparatus that includes: (a) an enclosure including an aperture; (b) a prism mounted in the enclosure so that a surface of the prism is exposed through the aperture; (c) an optical assembly contained within the enclosure, the optical assembly including a radiation source and a radiation detector, the source being configured to direct radiation towards the prism and the detector being configured to detect radiation from the source reflected from the exposed surface of the prism; and (d) an electronic processor contained within the enclosure, the electronic processor being in communication with the detector. The apparatus can be configured so that, during operation, the electronic processor determines information about a sample placed in contact with the exposed surface of the prism based on radiation reflected from the exposed prism surface while it is in contact with the sample.
Abstract:
We disclose apparatus that includes: (a) an enclosure including an aperture; (b) a prism mounted in the enclosure so that a surface of the prism is exposed through the aperture; (c) an optical assembly contained within the enclosure, the optical assembly including a radiation source and a radiation detector, the source being configured to direct radiation towards the prism and the detector being configured to detect radiation from the source reflected from the exposed surface of the prism; and (d) an electronic processor contained within the enclosure, the electronic processor being in communication with the detector. The apparatus can be configured so that, during operation, the electronic processor determines information about a sample placed in contact with the exposed surface of the prism based on radiation reflected from the exposed prism surface while it is in contact with the sample.
Abstract:
Systems and methods disclosed include: a support apparatus configured to detachably receive a chip; movable pins extendible from a first position to a second position, where, in the first position, the movable pins do not contact a chip positioned on the support apparatus, and in the second position, the movable pins contact electrical terminals of a heating element within a chip positioned on the support apparatus; a radiation source configured to direct radiation to be incident on a chip positioned on the support apparatus; a detector; and an electronic processor, the electronic processor being configured to detect molecules in a sample positioned within the chip, and to determine a temperature of the chip by measuring an electrical resistance between two of the multiple pins connected to the electrical terminals.
Abstract:
A laser package comprising a semiconductor laser having an operating temperature range and a heater, wherein the heater is configured to heat the laser when the laser package is positioned in an environment having an ambient temperature which lies outside of the operating temperature range of the laser, so that the laser will remain within the operating temperature range.
Abstract:
We disclose an apparatus comprising: a hand-portable optical analysis unit including an optical interface; and a device configured to receive and releasably engage the hand-portable optical analysis unit. The device comprises: a housing; a sample unit in the housing; and a resilient member configured to bias the sample unit and the hand-portable analysis unit towards each other when the hand-portable optical analysis unit is received in the device to compress a sample disposed between the sample unit and the optical interface of the optical analysis unit. Methods of analyzing samples are also disclosed.