公开(公告)号：US20210016539A1

公开(公告)日：2021-01-21

申请号：US17061934

申请日：2020-10-02

Applicant: TactoTek Oy

Inventor： Vinski BRÄYSY ,  Anne ISOHÄTÄLÄ ,  Jarmo SÄÄSKI ,  Tomi SIMULA

IPC: B32B3/30 ,  B32B27/08 ,  G06F3/044

Abstract: A method for manufacturing an integrated multilayer structure for sensing applications, including obtaining at least one film including a sensing area; arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, said sensing electronics including at least one sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry; and molding or casting, and configuring, at least one plastic layer so that the plastic layer defines an integrated, intermediate layer between the sensing electronics and the sensing area and that the sensing area is superimposed with the sensing element of the sensing electronics, wherein it is further provided at least one physical feature to locally reduce the electrical distance between the sensing area and the sensing element to improve the associated sensing sensitivity.

公开(公告)号：US10897196B2

公开(公告)日：2021-01-19

申请号：US16682106

申请日：2019-11-13

Applicant: TactoTek Oy

Inventor： Miikka Kärnä ,  Tuomas Heikkilä

IPC: H02M3/156 ,  G05F1/67 ,  H02J1/10 ,  H02M7/217 ,  H02J9/06 ,  G05F1/445 ,  H02M1/08 ,  H02J3/38 ,  H05B45/10 ,  H05B45/395

Abstract: An arrangement involving printed conductive traces includes at least a voltage source (Vsupply) and at least one target component, preferably a light-emitting component such as an LED. The arrangement is adapted to produce a current-controlled voltage (VOUT2, Vout) originating from the voltage source, the current-controlled voltage being coupled to the at least one target component, wherein said voltage is dependent on the current (IR,LED, ILED) that is being passed through the target component and said voltage is adaptable to a varying resistance of the arrangement and its features.

公开(公告)号：US20210007222A1

公开(公告)日：2021-01-07

申请号：US17026960

申请日：2020-09-21

Applicant: TactoTek Oy

Inventor： Tero HEIKKINEN ,  Antti KERANEN ,  Mikko HEIKKINEN ,  Jarmo SAASKI

IPC: H05K1/03 ,  F21V3/00 ,  F21V8/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  H05K3/46

Abstract: Integrated multilayer structure for hosting electronics, including a first substrate—including organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side, a plastic layer, optionally including thermoplastic or thermoset plastics, molded onto said second side of the first substrate so as to at least partially cover it, and circuitry provided on the second side of the first substrate, said circuitry being at least partially embedded in the molded material of the plastic layer. Related method of manufacture is presented.

公开(公告)号：US10827609B2

公开(公告)日：2020-11-03

申请号：US16711610

申请日：2019-12-12

Applicant: TactoTek Oy

Inventor： Tero Heikkinen ,  Antti Keranen ,  Mikko Heikkinen ,  Jarmo Saaski

IPC: H05K1/03 ,  F21V3/00 ,  F21V8/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  H05K3/46 ,  F21Y115/10 ,  F21Y115/15

Abstract: An integrated multilayer structure for hosting electronics, includes a first substrate including organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture. The first substrate has a first side facing a predefined front side of the structure, the first side of the first substrate being optionally configured to face a user and/or use an environment of the structure or of its host device. The first substrate has an opposite second side, a plastic layer, optionally including thermoplastic or thermoset plastics, molded onto the second side of the first substrate so as to at least partially cover it. The first substrate further includes circuitry provided on the second side of the first substrate, wherein the circuitry is at least partially embedded in the molded material of the plastic layer. A related method of manufacture is also presented.

公开(公告)号：US20200284974A1

公开(公告)日：2020-09-10

申请号：US16871548

申请日：2020-05-11

Applicant: TACTOTEK OY

Inventor： Antti KERÄNEN ,  Mikko HEIKKINEN

IPC: F21V8/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/12 ,  H05K3/28

Abstract: A multilayer assembly for an electronic device includes a substrate film configured to accommodate electronics on at least first side thereof, a number of light sources on the first side of the substrate film and configured to emit light of predetermined frequency or frequency band, a plastic lightguide layer molded onto the first side of the substrate film and at least partially embedding the light sources, the plastic lightguide layer being of optically at least translucent material, and a masking layer provided on the outer surface of the plastic lightguide layer, wherein the masking layer defines a window for letting light emitted by the embedded light sources and propagated within the plastic lightguide layer to pass through the masking layer towards the environment.

公开(公告)号：US20200083806A1

公开(公告)日：2020-03-12

申请号：US16682106

申请日：2019-11-13

Applicant: TactoTek Oy

Inventor： Miikka KÄRNÄ ,  Tuomas HEIKKILÄ

IPC: H02M3/156 ,  H02J3/38 ,  H02M1/08 ,  G05F1/445 ,  H02J9/06 ,  H02M7/217 ,  H02J1/10 ,  G05F1/67 ,  H05B33/08

Abstract: An arrangement involving printed conductive traces includes at least a voltage source (Vsupply) and at least one target component, preferably a light-emitting component such as an LED. The arrangement is adapted to produce a current-controlled voltage (VOUT2, Vout) originating from the voltage source, the current-controlled voltage being coupled to the at least one target component, wherein said voltage is dependent on the current (IR,LED, ILED) that is being passed through the target component and said voltage is adaptable to a varying resistance of the arrangement and its features.

公开(公告)号：US10575407B2

公开(公告)日：2020-02-25

申请号：US16018127

申请日：2018-06-26

Applicant: TactoTek Oy

Inventor： Mikko Heikkinen ,  Jarmo Sääski ,  Jarkko Torvinen ,  Paavo Niskala ,  Mikko Sippari ,  Pasi Raappana ,  Antti Keränen

IPC: H05K3/00 ,  H05K1/02 ,  H05K1/03 ,  B29C45/14 ,  B29L31/34

Abstract: A system for carrying out a manufacturing method of an electromechanical structure apparatus includes an entity for producing conductors on a flat film, an entity for attaching electronic elements at locations on the flat film in relation to the desired three-dimensional shape of the flat film, the electronic elements including a number of SMT components, the locations of the electronic elements on the flat film selected such that the locations omit substantial deformation during subsequent 3D forming of the flat film, an entity for forming the flat film into a three-dimensional film and an entity for injection molding.

公开(公告)号：US10485094B1

公开(公告)日：2019-11-19

申请号：US16113198

申请日：2018-08-27

Applicant: TactoTek Oy

Inventor： Anne Isohätälä ,  Hasse Sinivaara ,  Heikki Tuovinen ,  Ville Wallenius ,  Vinski Bräysy ,  Tomi Simula ,  Mikko Heikkinen ,  Minna Pirkonen ,  Tuukka Junkkari ,  Jarmo Sääski ,  Janne Asikkala ,  Antti Keränen

IPC: G01R27/26 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K1/16 ,  G06F3/044

Abstract: Integrated multilayer structure suitable for use in sensing applications is disclosed including at least one plastic layer, at least one film layer provided on both sides of the plastic layer. A film layer on a first side of the plastic layer includes electronics incorporating reactance sensing electronics for sensing of selected target quantities, and conversion thereof into representative electrical signals. The sensing electronics include an electrode and a connection element for connecting the electrode to control circuitry. A film layer on a second side of the plastic layer includes features including one conductive feature that is configured to shape an electromagnetic field to adapt a sensitivity or directionality the sensing response of the sensing electronics on the first side of the plastic layer.

公开(公告)号：US10248277B2

公开(公告)日：2019-04-02

申请号：US16156008

申请日：2018-10-10

Applicant: TACTOTEK OY

Inventor： Jarmo Sääski ,  Jarkko Torvinen ,  Pasi Raappana ,  Mikko Heikkinen

IPC: G06F3/044 ,  B29C45/14 ,  B32B27/08 ,  H05K1/03 ,  H05K1/14 ,  H05K3/28 ,  H05K3/12 ,  H05K1/02 ,  H05K1/18 ,  H05K3/36 ,  B29L31/34

Abstract: An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.

公开(公告)号：US10225932B1

公开(公告)日：2019-03-05

申请号：US16113555

申请日：2018-08-27

Applicant: TactoTek Oy

Inventor： Tomi Simula ,  Vinski Bräysy ,  Mikko Heikkinen ,  Juha-Matti Hintikka ,  Minna Pirkonen ,  Pasi Raappana ,  Tuomas Heikkilä ,  Jarmo Sääski ,  Juhani Harvela

IPC: H05K5/00 ,  H05K7/00 ,  H05K1/14 ,  H05K1/11 ,  H01R12/71 ,  H05K1/02 ,  H05K1/18

Abstract: Interface arrangement comprising an electrical node type component for providing electrical or electromagnetic connection between an external system and a host structure of the interface arrangement. The interface arrangement comprising a first substrate film defining a cavity. A first material layer arranged to at least partly fill the cavity and to embed or at least partly cover at least one electrical element at least partly arranged into the cavity. The at least one electrical element comprises at least a converter element configured for adapting signals to be transferred between the external system and electronics of the host structure. A first connection element arranged at least partly into the cavity and configured for connecting to the external system. The first connection element is further at least functionally connected to the converter element. Related multilayer structures and methods of manufacture are presented.