公开(公告)号：US07921551B2

公开(公告)日：2011-04-12

申请号：US11886747

申请日：2006-03-23

Applicant: Yoshihisa Yamashita ,  Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani ,  Toshiyuki Kojima ,  Shingo Komatsu

Inventor： Yoshihisa Yamashita ,  Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani ,  Toshiyuki Kojima ,  Shingo Komatsu

IPC: H05K3/30

CPC classification number: H01L21/6835 ,  B30B5/02 ,  B30B15/065 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68354 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75314 ,  H01L2224/7598 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83224 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15724 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H05K3/303 ,  H05K3/305 ,  H05K3/323 ,  H05K3/341 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0173 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/0665 ,  H01L2224/05599

Abstract: An electronic component mounting method includes a step of applying a resin composition (3) including solder powder, convective additive and resin having fluidity at the melting temperature of the solder powder on a main surface of a wiring substrate (1) provided with conductive wirings and connecting terminals, a step of preparing a group of electronic components consisting of a plurality of electronic components (7, 8 and 9) including at least a passive component, the respective electronic components comprising electrode terminals, position-aligning connecting terminals with the electrode terminals, and making the group of electronic components abut a surface of the resin composition, a step of heating at least the resin composition so as to melt solder powder and make the solder powder self-assembled between the connecting terminals and the electrode terminals by the convective additive, and thereby connecting the connecting terminals and the electrode terminals by soldering, and a step of fixedly adhering the group of electronic components to the wiring substrate using the resin by hardening the resin in the resin composition. Accordingly, a mounting process can be remarkably simplified without forming bumps in advance.

Abstract translation: 电子部件安装方法包括以下步骤：将包含焊料粉末，对流添加剂和流动性的树脂组合物（3）在焊料粉末的熔融温度下涂覆在具有导电布线的布线基板（1）的主表面上，以及 连接端子，准备由至少包括无源部件的多个电子部件（7,8,9）组成的一组电子部件的步骤，所述各个电子部件包括电极端子，位置对准连接端子与电极端子 并且使电子部件组与该树脂组合物的表面接触，至少加热该树脂组合物以熔化焊料粉末并通过对流使焊料粉末自组装在连接端子与电极端子之间的步骤 通过焊接连接端子和电极端子，a 通过使树脂组合物中的树脂硬化，使用树脂将电子部件组固定地粘合到布线基板的步骤。 因此，无需预先形成凸块，可以显着地简化安装工艺。

公开(公告)号：US07732920B2

公开(公告)日：2010-06-08

申请号：US11909856

申请日：2006-03-14

Applicant: Seiichi Nakatani ,  Takashi Kitae ,  Yoshihisa Yamashita ,  Takashi Ichiryu ,  Seiji Karashima

Inventor： Seiichi Nakatani ,  Takashi Kitae ,  Yoshihisa Yamashita ,  Takashi Ichiryu ,  Seiji Karashima

IPC: H01L23/04 ,  H01L23/06

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/83007 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2224/83874 ,  H01L2224/8388 ,  H01L2224/83888 ,  H01L2224/9201 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/0695 ,  H01L2224/05599

Abstract: The flip chip mounted body of the present invention includes: a circuit board (213) having a plurality of connection terminals (211); a semiconductor chip (206) having a plurality of electrode terminals (207) that are disposed opposing the connection terminals (211); and a porous sheet (205) having a box shape that is provided on an opposite side of a formation surface of the electrode terminal (207) of the semiconductor chip (206), is folded on an outer periphery of the semiconductor chip (206) on the formation surface side of the electrode terminal (207) and is in contact with the circuit board (213), wherein the connection terminal (211) of the circuit board (213) and the electrode terminal (207) of the semiconductor chip (206) are connected electrically via a solder layer (215), and the circuit board (213) and the semiconductor chip (206) are fixed by a resin (217). Thereby, the flip chip mounted body with excellent productivity and reliability that can mount the semiconductor chip on the circuit board, and a method and an apparatus for mounting the flip chip mounted body are provided.

Abstract translation: 本发明的倒装芯片安装体包括：具有多个连接端子（211​​）的电路板（213）; 具有与所述连接端子相对设置的多个电极端子（207）的半导体芯片（206）。 在所述半导体芯片（206）的外周折叠具有设置在所述半导体芯片（206）的所述电极端子（207）的形成面的相反侧的盒状的多孔片（205） 在电极端子（207）的形成面侧与电路基板（213）接触，电路基板（213）的连接端子（211​​）和半导体芯片的电极端子（207） 206）通过焊料层（215）电连接，并且电路板（213）和半导体芯片（206）由树脂（217）固定。 因此，提供了将半导体芯片安装在电路板上的优异的生产率和可靠性的倒装芯片安装体以及安装倒装芯片安装体的方法和装置。

公开(公告)号：US20100011572A1

公开(公告)日：2010-01-21

申请号：US12439602

申请日：2008-04-24

Applicant: Takashi Kitae ,  Seiichi Nakatani ,  Seiji Karashima

Inventor： Takashi Kitae ,  Seiichi Nakatani ,  Seiji Karashima

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/3436 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L29/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11524 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/293 ,  H01L2224/73204 ,  H01L2224/8101 ,  H01L2224/81201 ,  H01L2224/81801 ,  H01L2224/83888 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10157 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K3/323 ,  H05K3/3484 ,  H05K2201/09036 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  Y02P70/613 ,  Y10T29/49137 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A process for producing an electronic component assembly, comprising the steps of: (1) preparing a first electronic component whose surface (A) is provided with a plurality of electrodes (a) and a second electronic component whose surface (B) is provided with a plurality of electrodes (b) wherein at least one concave portion is formed in the surface (A) (except for a surface region on which the electrodes (a) are provided) and/or the surface (B) (except for a surface region on which the electrodes (b) are provided); (2) supplying a resin that comprises a solder powder onto the surface (A) of the first electronic component; (3) bringing the second electronic component into contact with a surface of the resin such that the plurality of electrodes (a) of the first electronic component are opposed to the plurality of electrodes (b) of the second electronic component; and (4) heating the first electronic component and/or the second electronic component, and thereby forming solder connections from the solder powder, the solder connections serving to electrically interconnect the electrodes (a) and (b), wherein, upon the heating step (4), gas bubbles are generated within the resin such that the bubble generation originates at least from the concave portion, and the generated bubbles cause the solder powder to move and congregate onto the electrodes (a) and (b).

Abstract translation: 一种电子部件组件的制造方法，包括以下步骤：（1）制备其表面（A）设置有多个电极（a）的第一电子部件和其表面（B）设置有第二电子部件 多个电极（b），其中在表面（A）中形成至少一个凹部（除了设置电极（a）的表面区域之外））和/或表面（B）（表面除外） 设置电极（b）的区域）; （2）将包含焊料粉末的树脂供给到第一电子部件的表面（A）上; （3）使第二电子部件与树脂的表面接触，使得第一电子部件的多个电极（a）与第二电子部件的多个电极（b）相对; 和（4）加热第一电子部件和/或第二电子部件，从而形成从焊料粉末的焊接连接，焊料连接用于电连接电极（a）和（b），其中，在加热步骤 （4）中，在树脂内产生气泡，使得气泡产生至少从凹部产生，所产生的气泡使焊料粉末移动并聚集在电极（a）和（b）上。

公开(公告)号：US07640659B2

公开(公告)日：2010-01-05

申请号：US12064131

申请日：2005-08-11

Applicant: Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

Inventor： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

IPC: H05K3/02 ,  H05K3/10

CPC classification number: H01L21/4846 ,  H01L2224/11 ,  H05K3/04 ,  H05K3/101 ,  H05K3/102 ,  H05K3/3484 ,  H05K2203/0108 ,  H05K2203/0425 ,  H05K2203/083 ,  H05K2203/087 ,  Y10T29/49155 ,  Y10T156/1744

Abstract: [Problem] To provide a conductive pattern formation method in which a fine pattern can be formed in a simple way at low cost.[Means for Solving Problem] A flat plate having a convex pattern on its surface is provided so as to oppose a substrate, a fluid body including conductive particles and a gas bubble generating agent is supplied into a gap between the substrate and the flat plate, and thereafter, the fluid body is heated for generating gas bubbles from the gas bubble generating agent included in the fluid body. The fluid body is forced out of the gas bubbles as the gas bubbles generated from the gas bubble generating agent grow, so as to self-assemble between the convex pattern formed on the flat plate and the substrate owing to interfacial force, and an aggregate of the conductive particles included in the fluid body having self-assembled is made into a conductive pattern formed on the substrate.

Abstract translation: [问题]提供一种导电图案形成方法，其中可以以简单的方式以低成本形成精细图案。 解决问题的手段在其表面上具有凸形图案的平板被设置为与基板相对，包括导电颗粒和气泡发生剂的流体被供应到基板和平板之间的间隙中， 此后，流体体被加热，从包含在流体中的气泡发生剂产生气泡。 当气泡发生剂产生的气泡生长时，液体被迫离开气泡，从而由于界面力而在平板上形成的凸形图案与基板之间自组装， 包含在具有自组装的流体中的导电颗粒被制成形成在基板上的导电图案。

公开(公告)号：US20090126876A1

公开(公告)日：2009-05-21

申请号：US12078891

申请日：2008-04-08

Applicant: Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

Inventor： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

IPC: B32B38/18

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/83047 ,  H01L2224/83091 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2225/06513 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/30105 ,  H01L2924/381 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2203/087 ,  Y10T156/1744 ,  H01L2924/00011 ,  H01L2924/066 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a method for connecting substrates are provided. A circuit board 10 having a plurality of connecting terminals 11 and a semiconductor chip 20 having a plurality of electrode terminals 21 are disposed in mutually facing relation and a resin 13 containing conductive particles 12 and a gas bubble generating agent is supplied into the space therebetween. In this state, the resin 13 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the resin 13. The resin 13 is pushed toward the outside of the generated gas bubbles 30 by the growth thereof. The resin 13 pushed to the outside is self-assembled in the form of columns between the respective terminals of the circuit board 10 and the semiconductor chip 20. In this state, by pressing the semiconductor chip 20 against the circuit board 10, the conductive particles 12 contained in the resin 13 self-assembled between the facing terminals are brought into contact with each other to provide electrical connection between the terminals.

公开(公告)号：US20090078746A1

公开(公告)日：2009-03-26

申请号：US12282774

申请日：2007-02-22

Applicant: Seiji Karashima ,  Yasushi Taniguchi ,  Seiichi Nakatani ,  Kenichi Hotehama ,  Takashi Kitae ,  Susumu Sawada

Inventor： Seiji Karashima ,  Yasushi Taniguchi ,  Seiichi Nakatani ,  Kenichi Hotehama ,  Takashi Kitae ,  Susumu Sawada

IPC: B23K1/20 ,  B23K3/00

CPC classification number: H05K3/3484 ,  H01L24/11 ,  H01L2224/11522 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K2203/0425 ,  H05K2203/083 ,  H05K2203/087 ,  H01L2924/00

Abstract: A method for forming bumps 19 on electrodes 32 of a wiring board 31 includes the steps of: (a) supplying a fluid 14 containing conductive particles 16 and a gas bubble generating agent onto a first region 17 including the electrodes 32 on the wiring board 31; (b) disposing a substrate 40 having a wall surface 45 formed near the electrodes 32 for forming a meniscus 55 of the fluid 14, so that the substrate 40 faces the wiring board 31; and (c) heating the fluid 14 to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.

Abstract translation: 在布线板31的电极32上形成凸块19的方法包括以下步骤：（a）将含有导电粒子16和气泡生成剂的流体14供给到布线板31上的包括电极32的第一区域17上 ; （b）设置具有形成在电极32附近的壁面45的基板40，以形成流体14的弯液面55，使得基板40面向布线板31; 和（c）加热流体14以从包含在流体14中的气泡生成剂产生气泡30。

公开(公告)号：US20080128664A1

公开(公告)日：2008-06-05

申请号：US11793175

申请日：2005-12-14

Applicant: Takashi Kitae ,  Seiji Karashima ,  Koichi Hirano ,  Toshiyuki Kojima ,  Seiichi Nakatani ,  Shingo Komatsu ,  Yoshihisa Yamashita

Inventor： Takashi Kitae ,  Seiji Karashima ,  Koichi Hirano ,  Toshiyuki Kojima ,  Seiichi Nakatani ,  Shingo Komatsu ,  Yoshihisa Yamashita

IPC: H01B1/02

CPC classification number: H05K3/323 ,  H01L21/6835 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/11001 ,  H01L2224/11003 ,  H01L2224/1141 ,  H01L2224/11502 ,  H01L2224/11522 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  Y02P70/613 ,  H01L2924/00011 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/0695 ,  H01L2924/062 ,  H01L2924/0615 ,  H01L2924/068 ,  H01L2924/0705 ,  H01L2924/0675 ,  H01L2924/07001 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00014

Abstract: There is provided a flip-chip mounting resin composition which can be used for a flip-chip mounting process that is high in productivity and reliability and thus can be applicable to a flip-chip mounting of a next-generation LSI. This flip-chip mounting resin composition comprises a resin, metal particles and a convection additive 12 that boils upon heating the resin 13. Upon the heating of the resin 13, the metal particles melt and the boiling convection additive 12 convects within the resin 13. This flip-chip mounting resin composition is supplied between a circuit substrate 10 and a semiconductor chip 20, and subsequently the resin 13 is heated so that the molten metal particles self-assemble into the region between each electrode of the circuit substrate and each electrode of the semiconductor chip. As a result, an electrical connection is formed between each electrode of the circuit substrate and each electrode of the semiconductor chip. Finally, the resin 13 is allowed to cure so that the semiconductor chip 20 is secured to the circuit substrate 10, which leads to in a formation of a flip chip assembly.

Abstract translation: 提供了一种倒装芯片安装树脂组合物，其可用于生产率和可靠性高的倒装芯片安装工艺，因此可以应用于下一代LSI的倒装芯片安装。 这种倒装芯片安装树脂组合物包括在加热树脂13时沸腾的树脂，金属颗粒和对流添加剂12。 在加热树脂13时，金属颗粒熔化，沸腾对流添加剂12在树脂13内对流。 将该倒装芯片安装树脂组合物供给在电路基板10和半导体芯片20之间，随后加热树脂13，使得熔融金属颗粒自组装成电路基板的每个电极和电极的每个电极之间的区域 半导体芯片。 结果，在电路基板的每个电极和半导体芯片的每个电极之间形成电连接。 最后，使树脂13固化，使得半导体芯片20固定到电路基板10，这导致形成倒装芯片组件。

公开(公告)号：US20070216023A1

公开(公告)日：2007-09-20

申请号：US11683612

申请日：2007-03-08

Applicant: Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Sawada

Inventor： Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Sawada

IPC: H01L23/34

CPC classification number: H05K3/3484 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/268 ,  B23K35/3613 ,  C22C11/00 ,  C22C12/00 ,  C22C13/00 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/29311 ,  H01L2924/00014 ,  H01L2224/1319 ,  H01L2224/133 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2224/16225

Abstract: The present invention provides a conductive resin composition for connecting electrodes electrically, in which metal particles are dispersed in a flowing medium, wherein the flowing medium includes a first flowing medium that has relatively high wettability with the metal particles and a second flowing medium that has relatively low wettability with the metal particles, and the first flowing medium and the second flowing medium are dispersed in a state of being incompatible with each other. Thereby, a flip chip packaging method that can be applied to flip chip packaging of LSI and has high productivity and high reliability is provided.

Abstract translation: 本发明提供一种导电树脂组合物，用于电连接电极，其中金属颗粒分散在流动介质中，其中流动介质包括与金属颗粒相比具有较高润湿性的第一流动介质和具有相对较高的第二流动介质 与金属颗粒的低润湿性，以及第一流动介质和第二流动介质在彼此不相容的状态下分散。 因此，提供了可以应用于LSI的倒装芯片封装并且具有高生产率和高可靠性的倒装芯片封装方法。

公开(公告)号：US06749774B2

公开(公告)日：2004-06-15

申请号：US10309596

申请日：2002-12-03

Applicant: Hiroaki Takezawa ,  Takashi Kitae ,  Yukihiro Ishimaru ,  Tsutomu Mitani

Inventor： Hiroaki Takezawa ,  Takashi Kitae ,  Yukihiro Ishimaru ,  Tsutomu Mitani

IPC: H01B122

CPC classification number: H01B1/22 ,  C09J9/02 ,  H01R4/04 ,  H05K3/321 ,  H05K2201/0129 ,  H05K2203/121 ,  Y10T428/249985 ,  Y10T428/2804 ,  Y10T428/2852

Abstract: A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group, an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.

Abstract translation: 通过使用包含粘合剂树脂和金属填料作为主要成分的导电粘合剂，其中将官能团引入到粘合剂树脂的分子链中，提供了具有改进的粘合强度和对弯曲应力的更高可靠性的安装技术， 与电极金属容易形成多齿结合。 作为热塑性树脂，选自羰基，羧基，氨基，亚氨基，亚氨基乙酸基，亚氨基丙酸基，羟基，硫醇中的至少两种官能团 基团，吡啶鎓基，亚氨基，偶氮基，次氮基，铵基和咪唑基。 因此，可以实现与电极金属的牢固结合。 将导电粘合剂丝网印刷到设置在基板上的电极，并且在部件的电极安装之后，将该结构加热以形成安装的结构。

公开(公告)号：US06620345B2

公开(公告)日：2003-09-16

申请号：US09947353

申请日：2001-09-07

Applicant: Hiroaki Takezawa ,  Yukihiro Ishimaru ,  Takashi Kitae ,  Tsutomu Mitani ,  Tousaku Nishiyama

Inventor： Hiroaki Takezawa ,  Yukihiro Ishimaru ,  Takashi Kitae ,  Tsutomu Mitani ,  Tousaku Nishiyama

IPC: H01B122

CPC classification number: H01L24/83 ,  C09J9/02 ,  H01B1/22 ,  H01L23/49883 ,  H01L24/28 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01R4/04 ,  H05K3/321 ,  H05K13/0469 ,  H05K2201/0769 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/121 ,  Y02P70/611 ,  Y10T428/2982 ,  Y10T428/2984 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in the conductive adhesive agent when a binder resin 2 is being hardened, to thereby form an elution preventing film 5 on a surface of the conductive particle 3. By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.

Abstract translation: 本发明的导电性粘合剂含有防粘膜成膜剂4，当粘合剂树脂2硬化时，在导电性粘合剂中出现通过导电性粒子3的电连续性而变为反应性的成膜剂，从而形成洗脱防止膜 通过使用该导电性粘合剂，使包装结构耐迁移，耐硫化。