Abstract:
A defected ground structure with shielding effect is provided. The structure includes a dielectric layer, a defected metal layer, a grounded metal layer and at least a conductive mushroom-like structure. The defected metal layer has a line-shaped opening and is disposed in the dielectric layer. The conductive mushroom-like structure is disposed between the defected metal layer and the grounded metal layer and is arranged along an extending direction of the line-shaped opening periodically. The conductive mushroom-like structure includes a laterally extending member and a vertically extending member. The laterally extending member is parallel to the defected metal layer and a distance is maintained away from the defected metal layer. The projection area of the laterally extending member on the defected metal layer covers a length of the line-shaped opening corresponding to the laterally extending member. The vertically extending member connects the laterally extending member and the grounded metal layer.
Abstract:
A transmission line with a structure which is capable of forming a passive equalizer and an electrical apparatus using the same are illustrated. The transmission line has a substrate, a ground plane, a defect ground structure, a pair of transmission conducting lines, and at least one stub. The substrate has a plurality of surfaces. The ground plane is located on at least one of the surfaces. The defect ground structure is formed on the ground plane. The pair of transmission conducting lines is located on one of the surfaces, and stretching over the defect ground structure. The at least one stub is located above a plane of the defect ground structure, extending along with at least one side of two sides of the pair of the transmission conducting lines, and electrically coupled to the pair of the transmission conducting lines and the ground plane.
Abstract:
A filtering device is capable of suppressing common mode noises upon transmission of a differential signal, and includes a differential transmission line, a grounding layer, a dielectric unit and a conductive structure. The differential transmission line has a pair of conductive traces spaced apart from each other. The grounding layer is spaced apart from the differential transmission line. The dielectric unit is disposed between the differential transmission line and the grounding layer. The conductive structure is embedded in the dielectric unit, is coupled electrically to the conductive traces and the grounding layer, and cooperates with the differential transmission line, the grounding layer and the dielectric unit to form a stacked structure that has an effective negative permittivity, thereby suppressing the common mode noises coupled to the conductive traces. A differential signal transmission circuit is also disclosed.
Abstract:
A method for reducing EM radiation comprises at least one first resonance line disposed on one of electric surfaces, which is disposed at a side of a transmission line structure on one of the electric surface. The resonance line crosses over a slot of another electric surface. The slot is etched on a corresponding electric surface. In addition, the transmission line structure crosses over the slot of the electric surface. Then, the first resonance line connects the electric surface having the slot with another electric surface. It can adjust at least one of a length, a width and a shape of the first resonance line, to make an input impedance seen from a crossed point between the transmission line structure and the slot approximately 0.
Abstract:
Proposed is an apparatus for silencing electromagnetic noise, characterized by a plurality of centrally symmetrical ring-shaped through-via-hole crystalline units provided between a high voltage plane and a low voltage plane at a regular interval, thereby forming an omnidirectional noise suppression frequency band for reducing noise interference and electromagnetic radiation. In a first embodiment of the ring-shaped through-via-hole crystalline units, the through via holes are perpendicularly coupled between a metal plane and the low voltage plane. In a second embodiment of the ring-shaped through-via-hole crystalline units, the through via holes are perpendicularly coupled between two metal planes. Positioned at a regular interval, the through via holes enable provision of omnidirectional noise suppression frequency band, simplified design of a power plane, and reduction of production costs.