公开(公告)号：US08664764B2

公开(公告)日：2014-03-04

申请号：US13493123

申请日：2012-06-11

Applicant: Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

Inventor： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/5389 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/96 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00

Abstract: One embodiment provides a semiconductor device having: a core substrate having first and second surfaces and an accommodation hole penetrating therethrough; a semiconductor element accommodated in the accommodation hole so that a front surface thereof is on the first surface side; a first metal film formed on a back surface of the semiconductor element; a second metal film formed on the second surface of the core substrate; an insulating layer covering the first and second metal films; and a third metal film formed on the insulating layer, via parts thereof penetrating through the insulating layer to respectively reach the first and second metal films.

Abstract translation: 一个实施例提供一种半导体器件，其具有：具有第一和第二表面的芯基板和贯穿其中的容纳孔; 容纳在所述容纳孔中使得其前表面位于所述第一表面侧的半导体元件; 形成在所述半导体元件的背面上的第一金属膜; 形成在芯基板的第二表面上的第二金属膜; 覆盖第一和第二金属膜的绝缘层; 以及形成在所述绝缘层上的第三金属膜，经由其穿过所述绝缘层的部分分别到达所述第一和第二金属膜。

公开(公告)号：US07763809B2

公开(公告)日：2010-07-27

申请号：US10920270

申请日：2004-08-18

Applicant: Akio Rokugawa ,  Masayuki Sasaki ,  Yuichi Matsuda

Inventor： Akio Rokugawa ,  Masayuki Sasaki ,  Yuichi Matsuda

IPC: H05K1/16

CPC classification number: H05K3/4682 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K1/113 ,  H05K3/007 ,  H05K3/045 ,  H05K3/108 ,  H05K3/20 ,  H05K3/205 ,  H05K3/388 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/0384 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49345

Abstract: A substrate of multilayered structure having a plurality of sets of an insulation layer and a wiring line layer, and having one face for mounting a semiconductor element thereon and the other face on which external connection terminals are to be provided, the face for mounting a semiconductor element being provided with pads to be bonded to an electrode terminal of the semiconductor element, the other face being provided with pads to be bonded to an external connection terminal, such as a terminal formed of a solder ball, and the wiring line layers on both sides of an insulation layer being connected with each other by vias piercing the insulation layer, wherein the surfaces of the pads to be bonded to an electrode terminal of a semiconductor element are flat and are in the same plane. A method of manufacturing such a multilayered substrate is also disclosed.

Abstract translation: 一种多层结构的基板，具有多组绝缘层和布线层，并且具有用于安装半导体元件的一个面和将要设置外部连接端子的另一个面，用于安装半导体的面 元件设置有要接合到半导体元件的电极端子的焊盘，另一个面设置有焊接到外部连接端子，例如由焊球形成的端子，并且两个布线层 绝缘层的侧面通过穿过绝缘层的通孔相互连接，其中要结合到半导体元件的电极端子的焊盘的表面是平坦的并且在同一平面中。 还公开了制造这种多层基板的方法。

公开(公告)号：US07725548B2

公开(公告)日：2010-05-25

申请号：US11489363

申请日：2006-07-19

Applicant: Takeshi Ohtani ,  Yuichi Matsuda ,  Yutaka Iwayama

Inventor： Takeshi Ohtani ,  Yuichi Matsuda ,  Yutaka Iwayama

IPC: G06F15/16

CPC classification number: H04L29/06027 ,  H04L12/1813 ,  H04L51/00 ,  H04L65/403

Abstract: Disclosed are a computer-readable recording medium which records communication programs, communication method and communication apparatus capable of easily performing selection and execution of communication units according to communication units of communication partners. A profile management unit manages specific information including a combination of device type information and user identification information in each communication unit, and user IDs associated with the combined information. An application controller, when a session using any one of communication units is established between users, refers to specific information and associates user IDs with the combined information in the communication unit. A collection unit collects presence information where state information indicating whether communication units are available is associated with the combined information in each communication unit. A presence management unit, when a user ID is specified, refers to presence information and reports presence information to client terminals of users where the session is established.

Abstract translation: 公开了一种计算机可读记录介质，其记录根据通信伙伴的通信单元能够容易地执行通信单元的选择和执行的通信程序，通信方法和通信设备。 简档管理单元管理包括每个通信单元中的设备类型信息和用户识别信息的组合的特定信息，以及与组合信息相关联的用户ID。 当在用户之间建立使用任何一个通信单元的会话时，应用控制器参考特定信息并将用户ID与通信单元中的组合信息相关联。 收集单元收集存在信息，其中指示通信单元可用的状态信息是否与每个通信单元中的组合信息相关联。 存在管理单元，当指定用户ID时，引用存在信息，并将存在信息报告给建立会话的用户的客户终端。

公开(公告)号：US20070174282A1

公开(公告)日：2007-07-26

申请号：US11412780

申请日：2006-04-28

Applicant: Yuichi Matsuda ,  Takao Mohri

Inventor： Yuichi Matsuda ,  Takao Mohri

IPC: G06F17/30

CPC classification number: H04L63/102 ,  G06F21/6272 ,  G06F21/629 ,  G06F2221/2101 ,  G06F2221/2141

Abstract: When a service apparatus receives a service request from a client apparatus, the service apparatus determines an access propriety based on whether the client apparatus is already registered in a list. If the client apparatus is not registered, the service apparatus acquires meta-information of the client apparatus in question and also other apparatuses. The service apparatus then determines an approving apparatus among the apparatuses based on the acquired meta-information. The approving apparatus is made to display the meta-information of the client apparatus in question and requests an approver to judge propriety of service provision.

Abstract translation: 当服务设备从客户端设备接收到服务请求时，服务设备基于客户端设备是否已经在列表中注册来确定访问适当性。 如果客户端装置未被登记，则服务装置获取有关的客户端装置的元信息，以及其他装置。 然后，服务装置基于获取的元信息来确定装置中的批准装置。 批准设备用于显示有问题的客户端设备的元信息，并要求审批者判断服务提供的适当性。

公开(公告)号：US20070136422A1

公开(公告)日：2007-06-14

申请号：US11489363

申请日：2006-07-19

Applicant: Takeshi Ohtani ,  Yuichi Matsuda ,  Yutaka Iwayama

Inventor： Takeshi Ohtani ,  Yuichi Matsuda ,  Yutaka Iwayama

IPC: G06F15/16

CPC classification number: H04L29/06027 ,  H04L12/1813 ,  H04L51/00 ,  H04L65/403

Abstract: Disclosed are a computer-readable recording medium which records communication programs, communication method and communication apparatus capable of easily performing selection and execution of communication units according to communication units of communication partners. A profile management unit manages specific information including a combination of device type information and user identification information in each communication unit, and user IDs associated with the combined information. An application controller, when a session using any one of communication units is established between users, refers to specific information and associates user IDs with the combined information in the communication unit. A collection unit collects presence information where state information indicating whether communication units are available is associated with the combined information in each communication unit. A presence management unit, when a user ID is specified, refers to presence information and reports presence information to client terminals of users where the session is established.

Abstract translation: 公开了一种计算机可读记录介质，其记录根据通信伙伴的通信单元能够容易地执行通信单元的选择和执行的通信程序，通信方法和通信设备。 简档管理单元管理包括每个通信单元中的设备类型信息和用户识别信息的组合的特定信息，以及与组合信息相关联的用户ID。 当在用户之间建立使用任何一个通信单元的会话时，应用控制器参考特定信息并将用户ID与通信单元中的组合信息相关联。 收集单元收集存在信息，其中指示通信单元可用的状态信息是否与每个通信单元中的组合信息相关联。 存在管理单元，当指定用户ID时，引用存在信息，并将存在信息报告给建立会话的用户的客户终端。

公开(公告)号：US20050214559A1

公开(公告)日：2005-09-29

申请号：US10525383

申请日：2003-08-21

Applicant: Takeshi Minoda ,  Yuichi Matsuda ,  Kaoru Yorita ,  Kenji Yonemochi ,  Kenji Oota ,  Etsuo Okahara ,  Toshio Arai

Inventor： Takeshi Minoda ,  Yuichi Matsuda ,  Kaoru Yorita ,  Kenji Yonemochi ,  Kenji Oota ,  Etsuo Okahara ,  Toshio Arai

IPC: B29C37/00 ,  B29C45/16 ,  C08J5/00 ,  B32B27/30 ,  B32B27/32

CPC classification number: B29C37/0028 ,  B29C45/1679 ,  C08J5/00 ,  Y10T428/31855 ,  Y10T428/31909 ,  Y10T428/31913 ,  Y10T428/31928 ,  Y10T428/31935 ,  Y10T428/31938

Abstract: An in-mold coating molded article is obtained by coating the surface of a resin molded product comprising a hydroxyl group-containing polypropylene resin composition (A) with a paint composition for in-mold coating, wherein the composition (A) comprises a polypropylene resin (i), an additive rubber (ii) and optionally a polymer compound (iii) other than the polypropylene resin (i) and the additive rubber (ii), the total hydroxyl value of the polypropylene resin (i), the additive rubber (ii) and the optional polymer compound (iii) is from 1 to 40, the composition (A) has a rubber component content (total of the amount of the additive rubber (ii) and the amount of components soluble in n-decane at 23° C. of the polypropylene resin (i) and the optional polymer compound (iii)) of from 15 to 80% by mass based on 100% by mass of the total amount of the rubber component and the resin component other than the rubber component, the paint composition comprises a vehicle component comprising 10 to 70% by mass of an oligomer having at least two (meth)acrylate groups and 90 to 30% by mass of an ethylenically unsaturated monomer copolymerizable with the oligomer, a (meth)acryl modified chlorinated polyolefin having a chlorine content of from 2 to 40% by mass, an organic peroxide polymerization initiator, and a polyisocyanate compound in a specific proportion. In the process for preparing the article, the article is prepared by injection molding method, injection compression molding method or injection press molding method. Accordingly, there can be provided an in-mold coating molded article such that the paint composition is monolithically formed on the surface of the resin molded product of the composition with good adhesion and a process for preparing the same.

Abstract translation: 通过将包含含羟基的聚丙烯树脂组合物（A）的树脂成型体的表面与用于模内涂布的涂料组合物进行涂布而获得模内涂布成型体，其中，组合物（A）含有聚丙烯树脂 （i），除了聚丙烯树脂（i）和添加剂橡胶（ii）以外的添加剂橡胶（ii）和任选的高分子化合物（iii），聚丙烯树脂（i），添加剂橡胶 ii）和任选的聚合物化合物（iii）为1至40，组合物（A）的橡胶组分含量（添加剂橡胶（ii）的总量）和可溶于正癸烷的组分的量在23 相对于橡胶成分和除了橡胶成分以外的树脂成分的总量的100质量％，聚丙烯树脂（i）和任选的高分子化合物（iii）的含量为15〜80质量％ ，所述涂料组合物包含包含10的载体组分 至70质量％的具有至少两个（甲基）丙烯酸酯基的低聚物和90〜30质量％的可与低聚物共聚的烯键式不饱和单体，具有氯含量为2〜（甲基）丙烯酸改性氯化聚烯烃 40质量％，有机过氧化物聚合引发剂和特定比例的多异氰酸酯化合物。 在制品制备过程中，制品采用注射成型法，注射成型法或注射成型法制备。 因此，可以提供一种模内涂布模制品，使得涂料组合物在组合物的树脂模制产品的表面上以良好的粘合力整体形成，以及其制备方法。

公开(公告)号：US09344347B2

公开(公告)日：2016-05-17

申请号：US12410138

申请日：2009-03-24

Applicant: Yuichi Matsuda ,  Yuji Nomura

Inventor： Yuichi Matsuda ,  Yuji Nomura

IPC: H04L12/26

CPC classification number: H04L43/0864 ,  H04L43/106

Abstract: In a delay time measuring apparatus a sequence number, data length, and receiving time of a data packet transmitted from a source unit to a destination unit are stored in a storage section. In addition, an ACK number and receiving time of an ACK packet returned from the destination unit to the source unit are stored in the storage section. After that, a calculation section obtains an ACK packet an ACK number of which is equal to a value obtained by adding data length of a second data packet of two successive data packets transmitted without waiting for the ACK packet to a sequence number of the second data packet of the two successive data packets from the storage section. Then the calculation section calculates round trip time from receiving time of the second data packet of the two successive data packets and receiving time of the ACK packet obtained.

Abstract translation: 在延迟时间测量装置中，从源单元发送到目的地单元的数据分组的序列号，数据长度和接收时间被存储在存储部分中。 此外，从目的地单元返回到源单元的ACK分组的ACK号码和接收时间被存储在存储部分中。 之后，计算部分获得ACK分组的ACK数量，该ACK分组的数量等于通过将不等待ACK分组发送的两个连续的数据分组的第二数据分组的数据长度与第二数据的序列号相加而获得的值 来自存储部分的两个连续数据分组的分组。 然后，计算部分计算两个连续数据分组的第二数据分组的接收时间和获得的ACK分组的接收时间的往返时间。

公开(公告)号：US08638542B2

公开(公告)日：2014-01-28

申请号：US12833185

申请日：2010-07-09

Applicant: Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Yukio Shimizu ,  Tomoo Yamasaki ,  Yuta Sakaguchi

Inventor： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Yukio Shimizu ,  Tomoo Yamasaki ,  Yuta Sakaguchi

IPC: H01G4/06 ,  H01G4/005 ,  H01G7/00

CPC classification number: H05K1/162 ,  H01G4/012 ,  H01G4/232 ,  H01G4/302 ,  H05K1/0287 ,  H05K1/0306 ,  H05K2201/09263 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/097 ,  H05K2201/09945

Abstract: A capacitor includes a dielectric substrate and a large number of filamentous conductors formed to penetrate through the dielectric substrate in a thickness direction thereof. An electrode is connected to only respective one ends of a plurality of filamentous conductors constituting one of groups each composed of a plurality of filamentous conductors. The electrode is disposed in at least one position on each of both surfaces of the dielectric substrate, or in at least two positions on one of the surfaces. Further, an insulating layer is formed on each of both surfaces of the dielectric substrate so as to cover regions between the electrodes, and a conductor layer is formed on the corresponding insulating layer integrally with a desired number of electrodes.

Abstract translation: 电容器包括电介质基板和形成为在其厚度方向上穿过电介质基板的大量丝状导体。 电极仅与构成一组各自由多根丝状导体构成的多个丝状导体的相应一端连接。 电极设置在电介质基板的两个表面的每一个上的至少一个位置，或者在其中一个表面上的至少两个位置。 此外，在电介质基板的两个表面的每个表面上形成绝缘层，以覆盖电极之间的区域，并且在相应的绝缘层上形成与期望数量的电极一体的导体层。

公开(公告)号：US20130081796A1

公开(公告)日：2013-04-04

申请号：US13613720

申请日：2012-09-13

Applicant: Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

Inventor： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

IPC: F28F7/00 ,  B32B37/02

CPC classification number: H01L23/3677 ,  H01L21/4882 ,  H01L21/50 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H05K7/2039 ,  H05K7/20509 ,  H01L2924/00

Abstract: A thermal interface material includes a metal foil, which has a first surface and an opposite second surface, and a plurality of rod conductors each having a side surface extending in a thickness direction of the metal foil. The rod conductors are arranged on at least one of the first and second surfaces of the metal foil in a planar direction that is perpendicular to the thickness direction. A resin layer covers at least the first surface and the second surface of the metal foil and the side surfaces of the rod conductors.

Abstract translation: 热界面材料包括金属箔，其具有第一表面和相对的第二表面，以及多个棒状导体，每个棒状导体的侧表面在金属箔的厚度方向上延伸。 棒状导体沿垂直于厚度方向的平面方向布置在金属箔的第一表面和第二表面中的至少一个上。 树脂层至少覆盖金属箔的第一表面和第二表面以及棒状导体的侧表面。

公开(公告)号：US08324513B2

公开(公告)日：2012-12-04

申请号：US13009987

申请日：2011-01-20

Applicant: Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

Inventor： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

IPC: H05K1/11

CPC classification number: H01L23/552 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/105 ,  H01L2223/6622 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A wiring substrate includes a core substrate including an inorganic dielectric insulating base material having first and second surfaces, and linear conductors penetrating the insulating base; a first wiring layer on the first surface electrically connected to a portion of linear conductors; a second wiring layer on the second surface electrically connected to the portion of the linear conductors; a first insulating layer on the first surface covering the first wiring layer and including a first through-hole; a third wiring layer on the first insulating layer electrically connected to the first wiring layer via the first through-hole; a second insulating layer on the second surface covering the second wiring layer and including a second through-hole; and a fourth wiring layer on the second insulating layer electrically connected to the second wiring layer via the second through-hole.

Abstract translation: 布线基板包括：芯基板，包括具有第一表面和第二表面的无机介电绝缘基材，以及贯穿绝缘基体的线状导体; 第一表面上的第一布线层，电连接到一部分直线导体; 在所述第二表面上的与所述线状导体的所述部分电连接的第二布线层; 在所述第一表面上覆盖所述第一布线层并包括第一通孔的第一绝缘层; 所述第一绝缘层上的第三布线层经由所述第一通孔与所述第一布线层电连接; 覆盖所述第二布线层并且包括第二通孔的所述第二表面上的第二绝缘层; 以及通过第二通孔与第二布线层电连接的第二绝缘层上的第四布线层。