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公开(公告)号：US12082336B2
公开(公告)日：2024-09-03
申请号：US17216118
申请日：2021-03-29
Applicant: Lumentum Japan, Inc.
Inventor： Koichiro Adachi
CPC classification number: H05K1/024 , H01P3/081 , H05K1/0219 , H05K1/0245 , H05K2201/0191 , H05K2201/09236 , H05K2201/097 , H05K2201/09727
Abstract: A differential circuit board includes a dielectric layer having a first and a second surface, a first conductor line with a first line-width, a second conductor line with a second line-width less than the first line-width, and a ground conductor. The dielectric layer has a first portion with a first thickness between the first and second surface and a second portion with a second thickness less than the first thickness between the first and second surfaces. The first conductor line is disposed on the first surface of the first portion. The second conductor line is disposed on the first surface of the second portion. The ground conductor is disposed on the second surface of the first portion and the second surface of the second portion, wherein the ground conductor overlaps with the first conductor line and the second conductor line. The first and second conductor lines are differential transmission lines.
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公开(公告)号：US20180288872A1
公开(公告)日：2018-10-04
申请号：US15997585
申请日：2018-06-04
Applicant: Sakai Display Products Corporation
Inventor： Nobuhiro YONEZAWA
IPC: H05K1/11 , G02F1/133 , G02F1/1343
CPC classification number: H05K1/11 , G02F1/13306 , G02F1/133514 , G02F1/1343 , G02F1/13458 , G09G3/36 , G09G3/3607 , H05K1/118 , H05K3/323 , H05K3/361 , H05K2201/09381 , H05K2201/09445 , H05K2201/097
Abstract: The terminal connection structure includes a first terminal group 80 including a plurality of first terminals 81 aligned side-by-side, and a second terminal group 110 including a plurality of second terminals 112 aligned side-by-side and connected to the plurality of first terminals 81, the second terminal group 110 opposing to the first terminal group 80 and electrically connected to the first terminal group 80 via an anisotropic conductive film, wherein each of the first terminals 81 has a recess-projection shape and each of the second terminals 112 has a recess-projection shape, two adjacent first terminals 81A, 81B have different and corresponding shapes with each other, and two adjacent second terminals 112A, 112B have different and corresponding shapes with each other.
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公开(公告)号：US09907155B2
公开(公告)日：2018-02-27
申请号：US14438546
申请日：2013-11-14
Applicant: CANON KABUSHIKI KAISHA
Inventor： Takashi Numagi , Hikaru Nomura , Masanori Kikuchi , Hiroyuki Mizuno
CPC classification number: H05K1/0216 , H05K1/0243 , H05K1/0251 , H05K1/0298 , H05K1/111 , H05K1/114 , H05K1/115 , H05K1/181 , H05K3/429 , H05K2201/09254 , H05K2201/09263 , H05K2201/09627 , H05K2201/097 , H05K2201/10159
Abstract: A printed wiring board includes a first main wire having first inner layer wiring patterns which are wired on inner layers connected by first via conductors in series. In addition, a second main wire has second inner layer wiring patterns which are wired on the inner layers connected by second via conductors. The first inner layer wiring patterns and the second inner layer wiring patterns are wired so as to change the layer to the inner layer on the opposite side to each other. First and second branch wires are branched from the first and second via conductors, respectively.
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公开(公告)号：US09774070B2
公开(公告)日：2017-09-26
申请号：US14537059
申请日：2014-11-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Nobuo Ikemoto , Yuki Wakabayashi , Shigeru Tago
IPC: H01P3/08 , H01P11/00 , H05K1/02 , H05K1/11 , H05K1/14 , H05K3/36 , H01R12/62 , H05K3/00 , H05K3/46 , H01R103/00 , H01R24/50
CPC classification number: H01P3/082 , H01P3/08 , H01P11/003 , H01R12/62 , H01R24/50 , H01R2103/00 , H05K1/0219 , H05K1/0225 , H05K1/024 , H05K1/0242 , H05K1/0253 , H05K1/115 , H05K1/118 , H05K1/147 , H05K3/0052 , H05K3/363 , H05K3/4623 , H05K3/4632 , H05K2201/07 , H05K2201/09154 , H05K2201/0919 , H05K2201/09481 , H05K2201/09527 , H05K2201/096 , H05K2201/09618 , H05K2201/097 , H05K2201/09845 , H05K2201/10037 , H05K2201/10204 , Y10T29/49016
Abstract: In a high frequency signal line, a first signal line extends along a first dielectric element assembly, a first reference ground conductor extends along the first signal line, a second signal line is provided in or on the second dielectric element assembly and extends along the second dielectric element assembly, a second reference ground conductor is provided in or on the second dielectric element assembly and extends along the second signal line. A portion of a bottom surface at an end of the first dielectric element assembly and a portion of the top surface at an end of the second dielectric element assembly are joined together such that a joint portion of the first and second dielectric element assemblies includes a corner. The second signal line and the first signal line are electrically coupled together. The first and second reference ground conductors are electrically coupled together.
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公开(公告)号：US09615417B2
公开(公告)日：2017-04-04
申请号：US14189246
申请日：2014-02-25
Applicant: Grote Industries, LLC
Inventor： Donald L. Gramlich, Jr. , Timothy W. Brooks , Martin J. Marx , James E. Roberts , William L. Corwin , David W. Vinup
IPC: H05K1/18 , H05B33/08 , H01L25/075 , H01L25/16 , H05K1/09 , H05K3/28 , F21Y101/00
CPC classification number: H05B33/0821 , F21Y2101/00 , F21Y2115/10 , H01L25/0753 , H01L25/167 , H01L2924/0002 , H05K1/09 , H05K1/181 , H05K3/284 , H05K2201/0108 , H05K2201/097 , H05K2201/10106 , Y02P70/611 , H01L2924/00
Abstract: A lighting device is described that includes a voltage source, a substrate, a wiring, a first light emitting diode (LED) and a second LED, a first electrical conductive element (ECE) and a second ECE, and a transparent, conductive sheet material. The wiring is formed on the substrate, and is connected to the voltage source. The first LED and the second LED are formed on the wiring. The first ECE and the second ECE are formed on the wiring. The sheet material is laminated onto the first and second LEDs and the first and second ECEs. The first and second LEDs are electrically connected in parallel and have opposite polarities. A sheet resistance exists between the first ECE and the first LED and between the second ECE and the second LED.
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Patent Agency Ranking
公开(公告)号：US20160262264A1
公开(公告)日：2016-09-08
申请号：US14983517
申请日：2015-12-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngbae KIM
CPC classification number: H05K1/0281 , H05K3/281 , H05K2201/0191 , H05K2201/09236 , H05K2201/09672 , H05K2201/097 , H05K2201/09736 , H05K2201/10128 , H05K2201/10136
Abstract: A connection substrate and a display device including the same are provided. The connection substrate includes a first conductive portion disposed on a tensile surface of a base film and having a first thickness, a second conductive portion disposed on a compressive surface of the base film and having a second thickness smaller than the second thickness, a first insulating layer disposed on the first conductive portion and a second insulating layer disposed on the second conductive portion. A distance from a top surface of the first conductive portion to a top surface of the first insulating layer is smaller than the first thickness.
Abstract translation: 提供了连接基板和包括该连接基板的显示装置。 连接基板包括设置在基膜的拉伸表面上并具有第一厚度的第一导电部分，设置在基膜的压缩表面上并具有小于第二厚度的第二厚度的第二导电部分，第一绝缘体 层，设置在第一导电部分上，第二绝缘层设置在第二导电部分上。 从第一导电部分的顶表面到第一绝缘层的顶表面的距离小于第一厚度。
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公开(公告)号：US20160174376A1
公开(公告)日：2016-06-16
申请号：US14905728
申请日：2014-07-24
Applicant: LG CHEM, LTD.
Inventor： Ducksu OH , Sung Soo PARK , Minsoo KANG
CPC classification number: H05K1/142 , H01L51/5203 , H01L2251/5338 , H05K1/028 , H05K1/111 , H05K1/117 , H05K1/118 , H05K1/14 , H05K1/141 , H05K1/147 , H05K3/361 , H05K3/363 , H05K3/403 , H05K2201/0397 , H05K2201/05 , H05K2201/097 , H05K2201/10128 , H05K2201/10681
Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.
Abstract translation: 提供了一种安装在显示装置的基板上的柔性印刷电路板。
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公开(公告)号：US20160150639A1
公开(公告)日：2016-05-26
申请号：US14947065
申请日：2015-11-20
Applicant: Amphenol Corporation
Inventor： Mark W. Gailus , Marc B. Cartier, JR. , Vysakh Sivarajan , David Levine
CPC classification number: H05K1/0222 , H01R43/205 , H05K1/0216 , H05K1/0219 , H05K1/025 , H05K1/0251 , H05K1/0253 , H05K1/0298 , H05K1/115 , H05K3/0047 , H05K3/4038 , H05K3/429 , H05K2201/07 , H05K2201/09063 , H05K2201/09318 , H05K2201/09545 , H05K2201/096 , H05K2201/097 , H05K2201/09718 , H05K2201/09845 , H05K2201/09854 , H05K2201/10189
Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; first and second signal vias forming a differential signal pair, the first and second signal vias extending through the attachment layers and connecting to respective signal traces on a breakout layer of the routing layers; an antipad of a first type around and between the first and second signal vias in one or more of the attachment layers; and antipads of a second type around the first and second signal vias in at least one routing layer adjacent to the breakout layer.
Abstract translation: 印刷电路板包括多个层，包括附着层和布线层; 形成差分信号对的第一和第二信号通孔，第一和第二信号通孔延伸穿过连接层并连接到路由层的突围层上的各个信号迹线; 围绕一个或多个附着层中的第一和第二信号通孔之间和第一信号通路之间的第一类型的止动件; 以及围绕与突出层相邻的至少一个路由层中的第一和第二信号通孔周围的第二类型的反码器。
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公开(公告)号：US20150319845A1
公开(公告)日：2015-11-05
申请号：US14438546
申请日：2013-11-14
Applicant: CANON KABUSHIKI KAISHA
Inventor： Takashi Numagi , Hikaru Nomura , Masanori Kikuchi , Hiroyuki Mizuno
CPC classification number: H05K1/0216 , H05K1/0243 , H05K1/0251 , H05K1/0298 , H05K1/111 , H05K1/114 , H05K1/115 , H05K1/181 , H05K3/429 , H05K2201/09254 , H05K2201/09263 , H05K2201/09627 , H05K2201/097 , H05K2201/10159
Abstract: A main wire 111 has inner layer wiring patterns 161 to 165 which are wired on an inner layers 114 and 115 connected by via conductors 166 to 169 in series. In addition, a main wire 112 has inner layer wiring patterns 181 to 185 which are wired on the inner layers 114 and 115 connected by via conductors 186 to 189. The inner layer wiring patterns 161 to 165 and the inner layer wiring patterns 181 to 185 are wired so as to change the layer to the inner layer on the opposite side to each other. Branch wires 1211 to 1214 and 1221 to 1224 are branched from the via conductors 166 to 169 and 186 to 189, respectively. Thereby, the present invention provides an inexpensive printed wiring board which can reduce ringing without upsizing the printed wiring board.
Abstract translation: 主导线111具有布线在通过导体166至169串联连接的内层114和115上的内层布线图案161至165。 此外，主导线112具有布线在通过导体186至189连接的内层114和115上的内层布线图案181至185.内层布线图案161至165和内层布线图案181至185 被布线以将层改变成彼此相对侧上的内层。 分支线1211至1214和1221至1224分别从通孔导体166至169和186至189分支。 因此，本发明提供了一种廉价的印刷布线板，其可以在不使印刷线路板增大的情况下减少振铃。
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公开(公告)号：US20150229016A1
公开(公告)日：2015-08-13
申请号：US14696671
申请日：2015-04-27
Applicant: Samtec, Inc.
Inventor： Gary Ellsworth BIDDLE
CPC classification number: H01P3/081 , H01P3/026 , H01P5/028 , H01P5/08 , H05K1/0216 , H05K1/0219 , H05K1/0228 , H05K1/0237 , H05K1/0245 , H05K1/025 , H05K1/115 , H05K1/118 , H05K1/14 , H05K2201/09236 , H05K2201/09672 , H05K2201/097 , H05K2201/09781 , H05K2201/0979
Abstract: A substrate including a first transmission line arranged to transmit electrical signals and including first and second traces and a first dielectric layer. The first and second traces are separated from each other by the first dielectric layer. A printed circuit board includes a first transmission line arranged to transmit electrical signals and including first, second, and third traces; and a first dielectric layer. The first and second traces are separated from the third trace by the first dielectric layer.
Abstract translation: 一种衬底，包括布置成传输电信号并且包括第一和第二迹线的第一传输线和第一介电层。 第一和第二迹线通过第一介电层彼此分离。 印刷电路板包括布置成传输电信号并且包括第一，第二和第三迹线的第一传输线; 和第一电介质层。 第一和第二迹线通过第一介电层与第三迹线分离。
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