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公开(公告)号：US20190081420A1
公开(公告)日：2019-03-14
申请号：US16002186
申请日：2018-06-07
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： CHIH-HENG CHUO , KUO-FU SU , GWUN-JIN LIN
Abstract: A stacked insertion structure for a flexible circuit board is provided. The flexible circuit board has an insertion section that is connected through a bent connection section to a fold-back section. The fold-back section is backward folded, through the bent connection section, toward and stacked on the insertion section such that a second coupling surface of the fold-back section corresponds to and overlap a first coupling surface of the insertion section for being insertable into an insertion socket of a connector. The fold-back section and the insertion section are bonded together with an adhesive layer therebetween or a height adjustment layer is provided therebetween to adjust an overall height of the two.
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公开(公告)号：US20180270947A1
公开(公告)日：2018-09-20
申请号：US15920915
申请日：2018-03-14
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , CHIH-HENG CHUO , GWUN-JIN LIN
Abstract: A signal attenuation reduction structure for a flexible circuit board includes at least one conductive paste coating zone formed on surfaces of signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to at least one signal line or covers a plurality of signal lines. An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction through the anisotropic conductive film.
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33.发明申请FLEXIBLE CIRCUIT BOARD COMBINED WITH CARRIER BOARD AND MANUFACTURING METHOD THEREOF 有权与运输板组合的柔性电路板及其制造方法公开(公告)号：US20160360611A1
公开(公告)日：2016-12-08
申请号：US15240155
申请日：2016-08-18
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , GWUN-JIN LIN
CPC classification number: H05K3/007 , H05K1/0281 , H05K1/0298 , H05K1/09 , H05K1/115 , H05K3/025 , H05K3/064 , H05K3/188 , H05K3/429 , H05K2201/0338 , H05K2201/0352 , H05K2201/09563 , H05K2203/0152
Abstract: Disclosed is a structure of a flexible circuit board combined with a carrier board. The carrier board includes a thick copper layer, a thin copper layer, and a release layer formed between the thick copper layer and the thin copper layer. The flexible circuit substrate and the carrier board are bonded together by an adhesive layer. In a subsequent process, the release layer, together with the thick copper layer, is peeled from a top surface of the thin copper layer and the thin copper layer is preserved by being bonded by the adhesive layer to the flexible circuit substrate.
Abstract translation: 公开了与载板组合的柔性电路板的结构。 载体板包括厚铜层，薄铜层和形成在厚铜层和薄铜层之间的剥离层。 柔性电路基板和载板通过粘合剂层粘合在一起。 在随后的工艺中，剥离层与厚铜层一起从薄铜层的顶表面剥离，并且通过粘合剂层粘合到柔性电路基板来保护薄铜层。
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公开(公告)号：US20150382454A1
公开(公告)日：2015-12-31
申请号：US14704179
申请日：2015-05-05
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , CHIH-HENG CHUO
Abstract: Disclosed is a spilled adhesive guide structure of a flexible circuit board. At least one contact pad is formed in a conductive circuit trace arranged on a substrate of the flexible circuit board. The substrate includes an insulation coverlay adhesively bonded thereon by an adhesive layer. The conductive circuit trace includes at least one spilled adhesive guide structure formed therein adjacent to the contact pad so that when the insulation coverlay is adhesively bonded by the adhesive layer to the conductive circuit trace, a spilled adhesive partially spilled out from the adhesive layer is guided into the spilled adhesive guide structure to prevent the spilled adhesive of the adhesive layer from covering a surface of the contact pad.
Abstract translation: 公开了柔性电路板的溢出的粘合剂引导结构。 至少一个接触焊盘形成在布置在柔性电路板的衬底上的导电电路迹线中。 基板包括通过粘合剂层粘合在其上的绝缘覆盖层。 导电电路迹线包括至少一个形成在其中的接触焊盘附近的溢出的粘合剂引导结构，使得当绝缘覆盖层通过粘合剂层粘合到导电电路迹线上时，从粘合剂层部分溢出的溢出的粘合剂被引导 进入溢出的粘合剂引导结构以防止粘合剂层的溢出的粘合剂覆盖接触垫的表面。
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Patent Agency Ranking
35.发明申请FLEXIBLE CIRCUIT BOARD COMBINED WITH CARRIER BOARD AND MANUFACTURING METHOD THEREOF 审中-公开与运输板组合的柔性电路板及其制造方法公开(公告)号：US20150359086A1
公开(公告)日：2015-12-10
申请号：US14714492
申请日：2015-05-18
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , GWUN-JIN LIN
CPC classification number: H05K3/007 , H05K1/0281 , H05K1/0298 , H05K1/09 , H05K1/115 , H05K3/025 , H05K3/064 , H05K3/188 , H05K3/429 , H05K2201/0338 , H05K2201/0352 , H05K2201/09563 , H05K2203/0152
Abstract: Disclosed is a structure of a flexible circuit board combined with a carrier board. The carrier board includes a thick copper layer, a thin copper layer, and a release layer formed between the thick copper layer and the thin copper layer. The flexible circuit substrate and the carrier board are bonded together by an adhesive layer. In a subsequent process, the release layer, together with the thick copper layer, is peeled from atop surface of the thin copper layer and the thin copper layer is preserved by being bonded by the adhesive layer to the flexible circuit substrate.
Abstract translation: 公开了与载板组合的柔性电路板的结构。 载体板包括厚铜层，薄铜层和形成在厚铜层和薄铜层之间的剥离层。 柔性电路基板和载板通过粘合剂层粘合在一起。 在随后的工艺中，剥离层与厚铜层一起从薄铜层的顶表面剥离，并且通过粘合剂层粘合到柔性电路基板来保护薄铜层。
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36.发明申请公开(公告)号：US20150327368A1
公开(公告)日：2015-11-12
申请号：US14446605
申请日：2014-07-30
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , GWUN-JIN LIN
CPC classification number: H05K1/118 , H05K1/0215 , H05K1/113 , H05K1/144 , H05K2201/058
Abstract: An interconnecting conduction structure for electrically connecting conductive traces of a lapped flexible circuit board is disclosed. The lapped flexible circuit board includes a first flexible circuit board and a second flexible circuit board. A through hole is formed in the second flexible circuit board and an interconnecting conduction member is filled in the through hole of the second flexible circuit board. The interconnecting conduction member is electrically connected to a second solder pad of the second flexible circuit board and a first solder pad of the first flexible circuit board in order to formed a lapped connection between conductive traces of the first flexible circuit board and the second flexible circuit board.
Abstract translation: 公开了用于电连接重叠的柔性电路板的导电迹线的互连导电结构。 重叠的柔性电路板包括第一柔性电路板和第二柔性电路板。 在第二柔性电路板中形成通孔，并且在第二柔性电路板的通孔中填充互连导电部件。 互连导电构件电连接到第二柔性电路板的第二焊盘和第一柔性电路板的第一焊盘，以便在第一柔性电路板和第二柔性电路板的导电迹线之间形成重叠连接 板。
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公开(公告)号：US20150237716A1
公开(公告)日：2015-08-20
申请号：US14283372
申请日：2014-05-21
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , CHIH-HENG CHUO , GWUN-JIN LIN
CPC classification number: H05K1/0271 , H05K1/0277 , H05K1/028 , H05K1/0281 , H05K1/118 , H05K2201/09063 , H05K2201/09145
Abstract: Disclosed is a tear protection structure for a flexible circuit board. In an extension section of a flexible circuit board, at least a slit line is formed. The slit line has at least a terminal end from which a stress-diverting cut segment extends. The stress-diverting cut segment is formed by cutting in a cutting direction that defines an angle with respect to an extension direction of the extension section to serve as the tear protection structure of the flexible circuit board. The extension section of the flexible circuit board is foldable along the slit line. The stress-diverting cut segment may further include a tear protection hole formed in a termination end thereof.
Abstract translation: 公开了一种用于柔性电路板的撕裂保护结构。 在柔性电路板的延伸部中，至少形成有切割线。 切割线至少具有应力分流切割部分从该终端延伸的终端。 应力转向切割段通过沿切割方向切割形成，该切割方向限定相对于延伸部分的延伸方向的角度，以用作柔性电路板的撕裂保护结构。 柔性电路板的延伸部分沿着切口线可折叠。 应力转向切割段还可以包括在其终止端中形成的撕裂保护孔。
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38.发明申请公开(公告)号：US20140374148A1
公开(公告)日：2014-12-25
申请号：US14138383
申请日：2013-12-23
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , GWUN-JIN LIN
IPC: H05K1/11
CPC classification number: H05K3/4061 , H05K1/0283 , H05K1/115 , H05K1/118 , H05K2201/09845 , H05K2201/09854 , H05K2203/1572
Abstract: A conductive connection structure for a conductive wiring layer of a flexible circuit board includes a first through hole and a second through hole formed in a lamination structure including a conductive wiring layer, a first covering layer, and a second covering layer. The first through hole extends through the first covering layer and the conductive wiring layer. The second through hole extends through the second covering layer. The second through hole is formed at a location corresponding to an exposed zone on a second surface of the conductive wiring layer and communicates with the first through hole. A first conductive paste layer is formed on a surface of the first covering layer and fills in the first through hole to form a pillar portion in the first through hole. The pillar portion has a bottom end forming a curved cap. The exposed zone of the second surface of the conductive wiring layer is at least partially covered by the curved cap.
Abstract translation: 用于柔性电路板的导电布线层的导电连接结构包括形成在包括导电布线层，第一覆盖层和第二覆盖层的叠层结构中的第一通孔和第二通孔。 第一通孔延伸穿过第一覆盖层和导电布线层。 第二通孔延伸穿过第二覆盖层。 第二通孔形成在与导电布线层的第二表面上的暴露区相对应的位置处，并与第一通孔连通。 第一导电浆料层形成在第一覆盖层的表面上并填充在第一通孔中，以在第一通孔中形成柱部分。 柱部具有形成弯曲帽的底端。 导电布线层的第二表面的暴露区域至少部分被弯曲的盖子覆盖。
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39.发明申请STRUCTURE OF VIA HOLE OF ELECTRICAL CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 审中-公开电路板通孔的结构及其制造方法公开(公告)号：US20140299363A1
公开(公告)日：2014-10-09
申请号：US14308998
申请日：2014-06-19
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , GWUN-JIN LIN
CPC classification number: H05K3/4053 , H05K1/118 , H05K3/0047 , H05K3/4038 , H05K3/42 , H05K3/429 , H05K2203/143 , H05K2203/1461 , Y10T29/49165
Abstract: A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.
Abstract translation: 电路板的通孔的结构包括在载体板上形成布线之后形成的粘合剂层和导体层。 至少一个通孔在垂直方向上穿过载板，布线，粘合剂层和导体层延伸并形成孔壁表面。 导体层相对于垂直方向上的电路迹线的暴露区域显示高度差。 导电覆盖部分覆盖导体层和通孔的孔壁表面。 载板是单面板，双面板，多层板或其组合，单面板，双面板和多层板可以是柔性板， 刚性板，或组合柔性和刚性板的复合板。
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