公开(公告)号：US20240403121A1

公开(公告)日：2024-12-05

申请号：US18203360

申请日：2023-05-30

Applicant: Advanced Micro Devices, Inc ,  ATI Technologies ULC

Inventor： Anil Harwani ,  Paul Blinzer ,  Kenneth Lawrence Mitchell ,  Adam Neil Calder Clark ,  Amitabh Mehra ,  Joshua Taylor Knight ,  Grant Evan Ley ,  Jerry Anton Ahrens ,  William Robert Alverson

IPC: G06F9/50

Abstract: Task scheduling based on component margins is described. In accordance with the described techniques, a scheduler of an operating system accesses a margin table when a request to perform tasks is received. The scheduler schedules tasks on various components of a system based on margins of those components. When a request to perform a task is received, for example, the scheduler accesses the margin table and selects a component to perform the task based on the margin information included in the margin table as well as based on the task, such as whether the task benefits more from being performed fast or being performed accurately. The scheduler then schedules the task using the selected component.

公开(公告)号：US20240143445A1

公开(公告)日：2024-05-02

申请号：US17974981

申请日：2022-10-27

Applicant: Advanced Micro Devices, Inc.

Inventor： Alicia Wen Ju Yurie Leong ,  William Robert Alverson ,  Joshua Taylor Knight ,  Jerry Anton Ahrens ,  Grant Evan Ley ,  Anil Harwani ,  Amitabh Mehra ,  Jayesh Hari Joshi

IPC: G06F11/14 ,  G11C29/52

CPC classification number: G06F11/1417 ,  G11C29/52

Abstract: Stability testing for memory overclocking is described. In accordance with the described techniques, operation of a memory with overclocked memory settings is testing during a boot up process of a computing device. Test results based on the testing are exposed via a user interface. The test results predict a stability of the memory over a subsequent time period if the memory is configured to operate with the overclocked memory settings.

公开(公告)号：US20240111684A1

公开(公告)日：2024-04-04

申请号：US17957479

申请日：2022-09-30

Applicant: Advanced Micro Devices, Inc.

Inventor： Sankaranarayanan Gurumurthy ,  Anil Harwani

IPC: G06F12/0897

CPC classification number: G06F12/0897 ,  G06F2212/601

Abstract: The disclosed method includes detecting a stalled memory request, for a first level cache within a cache hierarchy of a processor, that includes an outstanding memory request associated with a second level cache within the cache hierarchy that is higher than the first level cache. The method further includes indicating, to the second level cache, that the first level cache is experiencing a starvation issue due to stalled memory requests to enable the second level cache to perform starvation-remediation actions. Various other methods, systems, and computer-readable media are also disclosed.

公开(公告)号：US20240111622A1

公开(公告)日：2024-04-04

申请号：US17957948

申请日：2022-09-30

Applicant: Advanced Micro Devices, Inc.

Inventor： Siddharth K. Shah ,  Vilas Sridharan ,  Amitabh Mehra ,  Anil Harwani ,  William Fischofer

IPC: G06F11/07

CPC classification number: G06F11/0793 ,  G06F11/0721 ,  G06F11/079

Abstract: A disclosed method can include (i) reporting, by a microcontroller, detection of a violation of a physical infrastructure constraint to a machine check architecture, (ii) triggering, by the machine check architecture in response to the reporting, a machine-check exception such that the violation of the physical infrastructure constraint is recorded, and (iii) performing a corrective action based on the triggering of the machine-check exception. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US20240103591A1

公开(公告)日：2024-03-28

申请号：US18148098

申请日：2022-12-29

Applicant: Advanced Micro Devices, Inc ,  ATI Technologies ULC

Inventor： Adam Neil Calder Clark ,  Anil Harwani ,  Amitabh Mehra

IPC: G06F1/20

CPC classification number: G06F1/206

Abstract: Power management using temperature gradient information is described. In accordance with the described techniques, temperature measurements of a component are obtained from two or more sensors of the component. A temperature of a hotspot of the component is predicted based on the temperature measurements obtained from the two or more sensors of the component. Operation of the component is adjusted based on the predicted temperature of the hotspot.

公开(公告)号：US20240085964A1

公开(公告)日：2024-03-14

申请号：US18515131

申请日：2023-11-20

Applicant: Advanced Micro Devices, Inc.

Inventor： Sriram Sambamurthy ,  Sriram Sundaram ,  Indrani Paul ,  Larry David Hewitt ,  Anil Harwani ,  Aaron Joseph Grenat ,  Dana Glenn Lewis ,  Leonardo Piga ,  Wonje Choi ,  Karthik Rao

IPC: G06F1/28 ,  G01R31/40 ,  G06F1/30

CPC classification number: G06F1/28 ,  G01R31/40 ,  G06F1/30

Abstract: A system and method for updating power supply voltages due to variations from aging are described. A functional unit includes a power supply monitor capable of measuring power supply variations in a region of the functional unit. An age counter measures an age of the functional unit. A control unit notifies the power supply monitor to measure an operating voltage reference. When the control unit receives a measured operating voltage reference, the control unit determines an updated age of the region different from the current age based on the measured operating voltage reference. The control unit updates the age counter with the corresponding age, which is younger than the previous age in some cases due to the region not experiencing predicted stress and aging. The control unit is capable of determining a voltage adjustment for the operating voltage reference based on an age indicated by the age counter.

公开(公告)号：US20240053891A1

公开(公告)日：2024-02-15

申请号：US17887245

申请日：2022-08-12

Applicant: Advanced Micro Devices, Inc.

Inventor： William Robert Alverson ,  Amitabh Mehra ,  Jerry Anton Ahrens ,  Grant Evan Ley ,  Anil Harwani ,  Joshua Taylor Knight

IPC: G06F3/06

CPC classification number: G06F3/061 ,  G06F3/0673 ,  G06F3/0655

Abstract: Random access memory (RAM) is attached to an input/output (I/O) controller of a chipset (e.g., on a motherboard). This chipset attached RAM is optionally used as part of a tiered storage solution with other tiers including, for example, nonvolatile memory (e.g., a solid state drive (SSD)) or a hard disk drive. The chipset attached RAM is separate from the system memory, allowing the chipset attached RAM to be used to speed up access to frequently used data stored in the tiered storage solution without reducing the amount of system memory available to an operating system running on the one or more processing units.

公开(公告)号：US20230315171A1

公开(公告)日：2023-10-05

申请号：US17704912

申请日：2022-03-25

Applicant: Advanced Micro Devices, Inc.

Inventor： Jerry Anton Ahrens ,  William Robert Alverson ,  Amitabh Mehra ,  Grant Evan Ley ,  Anil Harwani ,  Joshua Taylor Knight

IPC: G06F1/20 ,  H05K5/02 ,  H05K7/20

CPC classification number: G06F1/206 ,  H05K5/0213 ,  H05K5/0239 ,  H05K7/20209

Abstract: Package lids with carveouts configured for processor connection and alignment are described. Lid carveouts are configured to align and mechanically secure a cooling device to the package lid by receiving protrusions of the cooling device. Because the lid carveouts ensure precise alignment and orientation of a cooling device relative to a package lid, the lid design enables targeted cooling of discrete portions of the lid. Lid carveouts are further configured to expose one or more connectors disposed on a surface that supports package internal components. When contacted by corresponding connectors of a cooling device, the lid carveouts enable direct connections between the package and the attached cooling device. By creating a direct connection between package components and an attached cooling device, the lid carveouts enable a high-speed connection for proactive and on-demand cooling actuation.

公开(公告)号：US11720266B2

公开(公告)日：2023-08-08

申请号：US17591924

申请日：2022-02-03

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： William R. Alverson ,  Amitabh Mehra ,  Anil Harwani ,  Jerry A. Ahrens ,  Grant E. Ley ,  Jayesh Joshi

IPC: G06F3/06 ,  G11C29/10

CPC classification number: G06F3/0632 ,  G06F3/0604 ,  G06F3/0673 ,  G11C29/10

Abstract: Automatic memory overclocking, including: increasing a memory frequency setting for a memory module until a memory stability test fails; determining an overclocked memory frequency setting including a highest memory frequency setting passing the memory stability test; and generating a profile including the overclocked memory frequency setting.

公开(公告)号：US11435806B2

公开(公告)日：2022-09-06

申请号：US16715184

申请日：2019-12-16

Applicant: ADVANCED MICRO DEVICES, INC. ,  ATI TECHNOLOGIES ULC

Inventor： Jerry A. Ahrens ,  Amitabh Mehra ,  Anil Harwani ,  William R. Alverson ,  Grant E. Ley ,  Charles Sy Lee

IPC: G06F1/3234

Abstract: Automatic voltage reconfiguration in a computer processor including one or more cores includes executing one or more user-specified workloads; determining, based on the user-specified workloads, a respective minimum safe voltage for each core of one or more cores; and modifying a respective voltage configuration for each core of the one or more cores based on the respective minimum safe voltage.