公开(公告)号：US20240222543A1

公开(公告)日：2024-07-04

申请号：US18092142

申请日：2022-12-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung CHEN

IPC: H01L31/173 ,  H01L31/0203 ,  H01L31/0216 ,  H01L31/18

CPC classification number: H01L31/173 ,  H01L31/0203 ,  H01L31/02164 ,  H01L31/02165 ,  H01L31/18 ,  G01S7/4813

Abstract: An optical device includes an emitter, a receiver, a transparent element, and a block layer. The transparent element is disposed over the emitter and the receiver. The transparent element defines a recess between the emitter and the receiver. The block layer is conformally disposed over the transparent element and the recess.

公开(公告)号：US20240175745A1

公开(公告)日：2024-05-30

申请号：US18434706

申请日：2024-02-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Ying-Chung CHEN

IPC: G01J1/02

CPC classification number: G01J1/0209 ,  G01J1/0214

Abstract: An optical system and a method of manufacturing an optical system are provided. The optical system includes a carrier, a light emitter, a light receiver, a block structure and an encapsulant. The light emitter is disposed on the carrier. The light receiver is disposed on the carrier and physically spaced apart from the light emitter. The light receiver has a light detecting area. The block structure is disposed on the carrier. The encapsulant is disposed on the carrier and covers the light emitter, the light receiver and the block structure. The encapsulant has a recess over the block structure.

公开(公告)号：US20240170603A1

公开(公告)日：2024-05-23

申请号：US18427783

申请日：2024-01-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi WU ,  Chang Chin TSAI ,  Bo-Yu HUANG ,  Ying-Chung CHEN

IPC: H01L31/16 ,  H01L31/024 ,  H01L33/62 ,  H01L33/64 ,  H04B10/40

CPC classification number: H01L31/16 ,  H01L31/024 ,  H01L33/62 ,  H01L33/644 ,  H04B10/40

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.

公开(公告)号：US20240102799A1

公开(公告)日：2024-03-28

申请号：US18530130

申请日：2023-12-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung CHEN ,  Hsun-Wei CHAN ,  Lu-Ming LAI ,  Kuang-Hsiung CHEN

IPC: G01C3/08

CPC classification number: G01C3/08

Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.

公开(公告)号：US20210183839A1

公开(公告)日：2021-06-17

申请号：US17187539

申请日：2021-02-26

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Ying-Chung CHEN ,  Lu-Ming LAI

IPC: H01L25/16 ,  F21V8/00 ,  G02B6/42 ,  H01L31/0232 ,  H01L27/15 ,  H01L25/00 ,  H01L27/146 ,  H01L31/12 ,  H01L31/0203 ,  H01L33/48 ,  H01S5/02253 ,  H01S5/02325 ,  H01S5/02326

Abstract: An optical module includes a carrier, a light emitter disposed on the carrier, a light detector disposed on the carrier, and a housing disposed on the carrier. The housing defines a first opening that exposes the light emitter and a second opening that exposes the light detector. The optical module further includes a first light transmission element disposed on the first opening and a second light transmission element disposed on the second opening. A first opaque layer is disposed on the first light transmission element, the first opaque layer defining a first aperture, and a second opaque layer disposed on the second light transmission element, the second opaque layer defining a second aperture.

公开(公告)号：US20190386187A1

公开(公告)日：2019-12-19

申请号：US16011555

申请日：2018-06-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi WU ,  Ying-Chung CHEN ,  Hsin-Ying HO

IPC: H01L33/56 ,  H01L33/62 ,  H01L31/0203 ,  H01L31/02

Abstract: An optical package device comprises a carrier, a die, a support element, and an encapsulant. The die is on the carrier. The support element is on the carrier and adjacent to the die. The encapsulant covers the die and the support element. The encapsulant has a first top surface over the die and a second top surface adjacent to the first top surface. A ratio of a distance between the first top surface and the second top surface of the encapsulant to a distance between the die and the first top surface of the encapsulant is less than 0.1.

公开(公告)号：US20190097387A1

公开(公告)日：2019-03-28

申请号：US16118228

申请日：2018-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Hsuan TSAI ,  Lu-Ming LAI ,  Ying-Chung CHEN ,  Shih-Chieh TANG

IPC: H01S5/022 ,  H01S5/02 ,  H01L33/62 ,  H01L23/00 ,  H01L23/538 ,  H01L25/075 ,  H01S5/40 ,  H01L33/48

Abstract: An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.

公开(公告)号：US20180182913A1

公开(公告)日：2018-06-28

申请号：US15870278

申请日：2018-01-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung CHEN ,  Hsu-Liang HSIAO ,  Sung-Fu YANG

IPC: H01L31/16

CPC classification number: H01L31/16 ,  H01L31/02325

Abstract: An optical device includes: (1) an emitter; (2) a detector disposed adjacent to the emitter; (3) an encapsulation layer encapsulating the emitter and the detector; (4) a dielectric layer disposed on the emitter, the detector and the encapsulation layer; (5) a redistribution layer disposed on the dielectric layer and electrically connected to the emitter and the detector; and (6) a light shielding structure disposed on the encapsulation layer and corresponding to a location between the emitter and the detector.

公开(公告)号：US20180130719A1

公开(公告)日：2018-05-10

申请号：US15347683

申请日：2016-11-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-An FANG ,  Ying-Chung CHEN

IPC: H01L23/10 ,  H01L23/055 ,  H01L21/52 ,  H01L23/00

CPC classification number: H01L23/10 ,  H01L21/50 ,  H01L21/52 ,  H01L23/055 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/164 ,  H01L2924/19106 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00

Abstract: A semiconductor device package includes a carrier, a lid, an electronic component and a sealant. The carrier has a first surface and a second surface opposite the first surface, and defines a hole extending from the first surface to the second surface. The lid is attached to the first surface of the carrier. The lid and the carrier define a chamber. The electronic component is attached to the first surface of the carrier and is disposed in the chamber. The sealant is attached to the second surface of the carrier and covers the hole.

公开(公告)号：US20160013223A1

公开(公告)日：2016-01-14

申请号：US14795613

申请日：2015-07-09

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Jung-Hsuan CHANG ,  Ying-Chung CHEN

IPC: H01L27/144 ,  H01L31/18 ,  H01L31/0232 ,  H01S5/183

CPC classification number: H01L31/0232 ,  G01S7/4813 ,  G01S7/499 ,  G01S17/026 ,  H01L27/1446 ,  H01L31/18 ,  H01S5/18355 ,  Y02P70/521

Abstract: The present disclosure relates to an optical module. In an embodiment, the optical module includes a carrier, a light source, a light detector, and a first polarizer. The light source and the light detector are disposed adjacent to a first surface of the carrier. The first polarizer is disposed on the light detector. The optical module is configured to polarize light emitted from the light source into a first polarization direction substantially perpendicular to a second polarization direction of light permitted through the first polarizer.

Abstract translation: 本发明涉及一种光学模块。 在一个实施例中，光学模块包括载体，光源，光检测器和第一偏振器。 光源和光检测器邻近载体的第一表面设置。 第一偏振器设置在光检测器上。 光学模块被配置为将从光源发射的光偏振到基本上垂直于通过第一偏振器允许的光的第二偏振方向的第一偏振方向。