Mold materials for formed ceramic
    34.
    发明授权

    公开(公告)号:US11207795B1

    公开(公告)日:2021-12-28

    申请号:US16137434

    申请日:2018-09-20

    Applicant: Apple Inc.

    Abstract: A mold apparatus to form a ceramic (or glass) includes a first mold portion having a first coefficient of thermal expansion and a second mold portion having a second coefficient of thermal expansion. In some embodiments, the first mold portion and/or the second mold portion are substantially immiscible with the ceramic material, such as silicon oxide, at a temperature greater than 600° C. In some embodiments, the first coefficient of thermal expansion and the second coefficient of thermal expansion are substantially similar to that of the glass or ceramic material. In some embodiments, the first coefficient of thermal expansion is different from the second coefficient of thermal expansion. In some embodiments, the first mold portion and the second mold portion contain a surface coating and a passivation layer.

    Cladded metal structures for dissipation of heat in a portable electronic device

    公开(公告)号:US10856443B2

    公开(公告)日:2020-12-01

    申请号:US16407011

    申请日:2019-05-08

    Applicant: Apple Inc.

    Abstract: This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.

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