公开(公告)号：US20230089982A1

公开(公告)日：2023-03-23

申请号：US17903581

申请日：2022-09-06

Applicant: Applied Materials, Inc.

Inventor： Phillip Criminale ,  Andrew Myles ,  Chunlei Zhang ,  Vivek B. Shah ,  Upendra Ummethala

IPC: H01L21/687 ,  H01L21/67 ,  B65G47/90 ,  G06N3/08

Abstract: An electronic device manufacturing system includes a transfer chamber, a tool station situated within the transfer chamber, a process chamber coupled to the transfer chamber, and a transfer chamber robot. The transfer chamber robot is configured to transfer substrates to and from the process chamber. The transfer chamber robot is further configured to be coupled to a sensor tool comprising one or more sensors configured to take measurements inside the process chamber. The sensor tool is retrievable from the tool station by an end effector of the transfer chamber robot.

公开(公告)号：US20220208520A1

公开(公告)日：2022-06-30

申请号：US17133787

申请日：2020-12-24

Applicant: APPLIED MATERIALS, INC.

Inventor： Tao Zhang ,  Upendra Ummethala

IPC: H01J37/32 ,  H03H7/40 ,  H05H1/46

Abstract: A method includes causing manufacturing equipment to generate a RF signal to energize a processing chamber associated with the manufacturing equipment. The method further includes receiving, from one or more sensors associated with the manufacturing equipment, current trace data associated with the RF signal. The method further includes updating impedance values of a digital replica associated with the manufacturing equipment based on the current trace data. The method further includes obtaining, from the digital replica, one or more outputs indicative of predictive data. The method further includes causing, based on the predictive data, performance of one or more corrective actions associated with the manufacturing equipment.

公开(公告)号：US20210398785A1

公开(公告)日：2021-12-23

申请号：US17466912

申请日：2021-09-03

Applicant: Applied Materials, Inc.

Inventor： Chuang-Chia Lin ,  Upendra Ummethala ,  Steven E. Babayan ,  Lei Lian

IPC: H01J37/32 ,  H01J37/22 ,  G01J3/443 ,  G01J3/02

Abstract: Embodiments disclosed herein include optical sensor systems and methods of using such systems. In an embodiment, the optical sensor system comprises a housing and an optical path through the housing. In an embodiment, the optical path comprises a first end and a second end. In an embodiment a reflector is at the first end of the optical path, and a lens is between the reflector and the second end of the optical path. In an embodiment, the optical sensor further comprises an opening through the housing between the lens and the reflector.

公开(公告)号：US11114286B2

公开(公告)日：2021-09-07

申请号：US16378271

申请日：2019-04-08

Applicant: Applied Materials, Inc.

Inventor： Chuang-Chia Lin ,  Upendra Ummethala ,  Steven E. Babayan ,  Lei Lian

IPC: H01J37/32 ,  H01J37/22 ,  G01J3/443 ,  G01J3/02 ,  G01J3/28

Abstract: Embodiments disclosed herein include optical sensor systems and methods of using such systems. In an embodiment, the optical sensor system comprises a housing and an optical path through the housing. In an embodiment, the optical path comprises a first end and a second end. In an embodiment a reflector is at the first end of the optical path, and a lens is between the reflector and the second end of the optical path. In an embodiment, the optical sensor further comprises an opening through the housing between the lens and the reflector.

公开(公告)号：US20210140824A1

公开(公告)日：2021-05-13

申请号：US16682616

申请日：2019-11-13

Applicant: Applied Materials, Inc.

Inventor： Chuang-Chia Lin ,  Upendra Ummethala

IPC: G01J3/443 ,  H01J37/32 ,  H01L21/66 ,  G01N21/31

Abstract: Embodiments disclosed herein include an optical sensor system for use in plasma processing tools. In an embodiment, the optical sensor system, comprises an optically clear body with a first surface and a second surface facing away from the first surface. In an embodiment, the optically clear body further comprises a third surface that is recessed from the second surface. In an embodiment, the optical sensor system further comprises a target over the third surface and a first reflector to optically couple the first surface to the target.

公开(公告)号：US20210080431A1

公开(公告)日：2021-03-18

申请号：US16597615

申请日：2019-10-09

Applicant: APPLIED MATERIALS, INC.

Inventor： Chuang-Chia Lin ,  Surajit Kumar ,  Upendra Ummethala

IPC: G01N29/12 ,  H03H9/02 ,  H01L21/67 ,  H01L21/66

Abstract: Embodiments disclosed herein include diagnostic substrates and methods of using such substrates. In an embodiment, a diagnostic substrate comprises a substrate, and a device layer over the substrate. In an embodiment, the diagnostic substrate further comprises a resonator in the device layer. In an embodiment, the resonator comprises a cavity, a cover layer over the cavity, and electrodes within the cavity for driving and sensing resonance of the cover layer. In an embodiment, the diagnostic substrate further comprises a reflector surrounding a perimeter of the resonator.

公开(公告)号：US20200321201A1

公开(公告)日：2020-10-08

申请号：US16378271

申请日：2019-04-08

Applicant: Applied Materials, Inc.

Inventor： Chuang-Chia Lin ,  Upendra Ummethala ,  Steven E. Babayan ,  Lei Lian

IPC: H01J37/32 ,  H01J37/22 ,  G01J3/02 ,  G01J3/443

Abstract: Embodiments disclosed herein include optical sensor systems and methods of using such systems. In an embodiment, the optical sensor system comprises a housing and an optical path through the housing. In an embodiment, the optical path comprises a first end and a second end. In an embodiment a reflector is at the first end of the optical path, and a lens is between the reflector and the second end of the optical path. In an embodiment, the optical sensor further comprises an opening through the housing between the lens and the reflector.