CONTACT FOR A MEDICAL CONNECTOR ASSEMBLY

    公开(公告)号:US20210257792A1

    公开(公告)日:2021-08-19

    申请号:US17173583

    申请日:2021-02-11

    Abstract: A connector apparatus for a medical device includes a cylindrical core of nonconductive material, a beam of conductive material, and a sleeve of conductive material. The cylindrical core includes an outside surface, an inside surface, a hollow center having a cross sectional area, and a slot opening in the cylindrical core extending from the outside surface to the inside surface. The beam is placed in the slot opening in the cylindrical core, wherein the beam reduces the cross-sectional area of the hollow center of the cylindrical core. The sleeve of conductive material is placed over the outside surface of the cylindrical core.

    HERMETICALLY SEALED IMPLANTABLE MEDICAL DEVICE AND METHOD OF FORMATION

    公开(公告)号:US20210251488A1

    公开(公告)日:2021-08-19

    申请号:US17173714

    申请日:2021-02-11

    Abstract: Embodiments of the present disclosure relate to implantable medical devices (IMDs). In an exemplary embodiment, an IMD comprises a power source and a housing enclosing the power source. The housing comprises a first side and a second side extending along a longitudinal axis between a first end and a second end, wherein the first side is opposite the second side and the first end is opposite the second end, and wherein a first distance between the first and second ends is greater than a second distance the first and second sides. The IMD further comprises a printed circuit board arranged on the first side of the base and conductively coupled to the power source. The IMD also comprises a non-conductive enclosure arranged over the printed circuit board and hermetically sealing the printed circuit board, the non-conductive enclosure comprising an outer surface. And, the IMD comprises first and second electrodes arranged on the outer surface of the non-conductive enclosure, wherein the first external electrode is coupled to the printed circuit board by a first trace and the second external electrode is coupled to the printed circuit board by a second trace.

    ELECTRICAL CONNECTOR AND METHOD FOR MANUFACTURING AN ELECTRICAL CONNECTOR
    37.
    发明申请
    ELECTRICAL CONNECTOR AND METHOD FOR MANUFACTURING AN ELECTRICAL CONNECTOR 审中-公开
    电气连接器及制造电气连接器的方法

    公开(公告)号:US20160268706A1

    公开(公告)日:2016-09-15

    申请号:US15065065

    申请日:2016-03-09

    Abstract: An electrical connector for detachably connecting an electrical lead to an implantable medical device includes a conductive housing and a plurality of spring contacts. The conductive housing extends from a proximal end to a distal end. The conductive housing has an interior surface forming a hollow cylinder. The plurality of spring contacts projects from the interior surface of the conductive housing and toward the proximal end. The plurality of spring contacts is at least partially contained within the conductive housing and configured to form an electrical connection to an electrical lead inserted within the conductive housing. The conductive housing and the plurality of spring contacts are integrally formed by an additive manufacturing process such that the electrical connector is a unitary structure.

    Abstract translation: 用于将电引线可拆卸地连接到可植入医疗装置的电连接器包括导电壳体和多个弹簧触点。 导电壳体从近端延伸到远端。 导电壳体具有形成中空圆筒的内表面。 多个弹簧触点从导电壳体的内表面突出并且朝向近端伸出。 多个弹簧触点至少部分地容纳在导电外壳内并且被配置为形成与插入导电壳体内的电引线的电连接。 导电壳体和多个弹簧触头通过附加制造工艺一体地形成,使得电连接器是整体结构。

    IMPLANTABLE MEDICAL DEVICE WITH FLEX CIRCUIT
    38.
    发明公开

    公开(公告)号:US20240325764A1

    公开(公告)日:2024-10-03

    申请号:US18615244

    申请日:2024-03-25

    CPC classification number: A61N1/3758 A61N1/3754

    Abstract: Methods of manufacturing an implantable medical device, and devices resulting from such methods. A printed circuit board assembly is made, and a first portion of encapsulant is applied to at least a portion of the printed circuit board assembly. A flex circuit is attached, such as by soldering, to the printed circuit board assembly. The flex circuit is then secured to the first portion of encapsulant, prior to applying a second portion of encapsulant.

Patent Agency Ranking