Wearable device to disposable patch connection via conductive adhesive

    公开(公告)号:US11179106B2

    公开(公告)日:2021-11-23

    申请号:US16355009

    申请日:2019-03-15

    Abstract: A medical device configured to be adhesively coupled to an external surface of a subject, and to facilitate physiological monitoring of the subject, includes: a first portion having a housing that at least partially encloses an interior chamber and has a grip portion that has a peanut-like shape; and a second portion including a flexible patch configured to facilitate operably coupling the first portion to the subject. The flexible patch includes third and fourth sensor connections configured to operably interface with the first and second sensor connections, respectively; first and second sensing elements; and a flexible circuit assembly configured to electrically couple the third sensor connection to the first sensing element and the fourth sensor connection to the second sensing element. An adhesive assembly is configured to couple the first portion to the second portion, and includes conductive adhesive portions.

    HERMETICALLY SEALED IMPLANTABLE MEDICAL DEVICE AND METHOD OF FORMATION

    公开(公告)号:US20210251488A1

    公开(公告)日:2021-08-19

    申请号:US17173714

    申请日:2021-02-11

    Abstract: Embodiments of the present disclosure relate to implantable medical devices (IMDs). In an exemplary embodiment, an IMD comprises a power source and a housing enclosing the power source. The housing comprises a first side and a second side extending along a longitudinal axis between a first end and a second end, wherein the first side is opposite the second side and the first end is opposite the second end, and wherein a first distance between the first and second ends is greater than a second distance the first and second sides. The IMD further comprises a printed circuit board arranged on the first side of the base and conductively coupled to the power source. The IMD also comprises a non-conductive enclosure arranged over the printed circuit board and hermetically sealing the printed circuit board, the non-conductive enclosure comprising an outer surface. And, the IMD comprises first and second electrodes arranged on the outer surface of the non-conductive enclosure, wherein the first external electrode is coupled to the printed circuit board by a first trace and the second external electrode is coupled to the printed circuit board by a second trace.

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