Abstract:
A communications device may include a connector block. The connector block may include a port. The port may be sized and configured to couple an optical fiber plug. The communications device may include an optical subassembly that may be connected to the connector block. The connector block may include a mount. The mount may be sized and configured to align the connector block and the optical subassembly. The mount may be configured as an EMI shield.
Abstract:
An electrical connector receptacle that includes receptacle-side electrical contacts, a socket, and a receptacle shield. The socket is configured such that a connector may be inserted therein allowing the electrical contacts of the connector to interface with the receptacle-side electrical contacts. The receptacle shield is placed in the back of the receptacle, and is composed of an Electro-Magnetic Interference barrier material. In one embodiment, the receptacle shield is configured to interface with an EMI barrier of the connector, and includes separate slots through which electrical connections may pass.
Abstract:
In one example embodiment, a collar clip includes a body that is sized and configured to partially encircle a shell of an optoelectronic transceiver module. Each extended element in a pair of the extended elements is separated from the other extended element in the pair by a cavity. Each cavity is configured to receive a portion of a corresponding structure of the shell.
Abstract:
Discloses is a transceiver module having a box optical subassembly, a printed circuit board, and a connector extending from the box optical subassembly to the printed circuit board. The box optical subassembly includes a laser diode, a laser driver, and at least one pin receiving a driver signal for said laser driver. Optionally, the box optical subassembly includes a thermal electric cooler to cool one or more components within the box optical subassembly. The connector mounts to the at least one pin and is receivable by a pin header mounted to the printed circuit board to accommodate for variations in the orientation of the optical subassembly relative to the printed circuit board during optical alignment of the optical subassembly.
Abstract:
The case temperature measurement device for an optoelectronic transceiver includes a case with at least one thermally conductive wall, at least one optical component at least partially disposed within the case, circuitry electrically coupled to the optical component. The circuitry includes a temperature sensor coupled to the circuitry. The case temperature measurement device also includes at least one protrusion formed on the wall of the case of the optoelectronic transceiver. The protrusion is thermally coupled to temperature sensor via a thermal pad. A method for estimating case temperature of the optoelectronic transceiver based on an internal temperature measurement and knowledge of the relationship between the measured internal temperature and the actual case temperature, and compensating for the effects of variable heat sources within the transceiver upon this estimate.
Abstract:
Presented is a detachable module connector comprising a main body with a first section, a second section, and a first opening extending through the first section and the second section, wherein the inner dimensions of the opening in the first section are different from the inner dimensions of the opening in the second section and the opening in the first section is sized to fit around a printed circuit board. The detachable connector is used to couple an electronic module that includes a printed circuit board to a host device. Also presented is a method of building a module using this detachable connector. The detachable connector simplifies the module manufacturing process because the module does not involve the costly hand-soldering and pcb-turning steps of the conventional methods.
Abstract:
A flexible circuit comprises a flexible substrate having first and second opposing surfaces. The flexible substrate can include multiple layers. A plurality of electrical traces can be mounted on either or both surfaces of the flexible substrate. A plurality of electrical components can also be mounted on either or both surfaces of the flexible substrate. A plurality of tooling cutouts is recessed in the sides of the flexible circuit. The tooling cutouts can have various shapes, such as, but not limited to, semi-circular, multiple straight edges, a single or multiple curved edges, etc. The cutouts are used to position and hold the flexible circuit in at least one other device.
Abstract:
An embodiment disclosed herein relates to a communications module. The communications module includes a body composed of a plastic resin and a plurality of conductive traces and contact pads defined on a portion of a surface of the body. The module also includes at least one substantially vertical ridge defined on the body surface, and at least one pocket defined on the body suitable for receiving an electronic component. The communications module may also include a body composed of a plastic resin and conductive features defined on a surface of the body configured to render the communications module operable without implementing a printed circuit board as part of the body. Additional embodiments relate to systems and methods for attaching one or more optical transmit assemblies to the communications module and for electrically connecting conductive traces in a temporary fashion on the surface of the body of the communications module.
Abstract:
A communications device may include a connector block. The connector block may include a port. The port may be sized and configured to couple an optical fiber plug. The communications device may include an optical subassembly that may be connected to the connector block. The connector block may include a mount. The mount may be sized and configured to align the connector block and the optical subassembly. The mount may be configured as an EMI shield.
Abstract:
A communications device may include a connector block. The connector block may include a port. The port may be sized and configured to couple an optical fiber plug. The communications device may include an optical subassembly that may be connected to the connector block. The connector block may include a mount. The mount may be sized and configured to align the connector block and the optical subassembly. The mount may be configured as an EMI shield.