公开(公告)号：US20230034763A1

公开(公告)日：2023-02-02

申请号：US17967681

申请日：2022-10-17

Applicant: EPISTAR CORPORATION ,  Yenrich Technology Corporation

Inventor： Shau-Yi CHEN ,  Tzu-Yuan LIN ,  Wei-Chiang HU ,  Pei-Hsuan LAN ,  Min-Hsun HSIEH

IPC: H01L33/58 ,  H01L27/15 ,  H01L33/62

Abstract: A package includes a substrate, a first light-emitting unit, a second light-emitting unit, a light-transmitting layer, and a light-absorbing layer. The substrate has a first surface and an upper conductive layer on the first surface. The first light-emitting unit and the second light-emitting unit are disposed on the upper conductive layer. The first light-emitting unit has a first light-emitting surface and a first side wall. The second light-emitting unit has a second light-emitting surface and a second side wall. The light-transmitting layer is disposed on the first surface and covers the upper conductive layer, the first light-emitting unit, and the second light-emitting unit. The light-absorbing layer is disposed between the substrate and the light-transmitting layer, covers the upper conductive layer, the first side wall, and the second side wall, and exposes the first light-emitting surface and the second light-emitting surface.

公开(公告)号：US20230017939A1

公开(公告)日：2023-01-19

申请号：US17947536

申请日：2022-09-19

Applicant: EPISTAR CORPORATION

Inventor： Shih-An LIAO ,  Shau-Yi CHEN ,  Ming-Chi HSU ,  Chun-Hung LIU ,  Min-Hsun HSIEH

IPC: H01L23/00 ,  H01L33/62

Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section view, and a distance from the first position to the first out contour is greater than that from the second position to the first outer contour.

公开(公告)号：US20220392876A1

公开(公告)日：2022-12-08

申请号：US17830268

申请日：2022-06-01

Applicant: EPISTAR CORPORATION ,  Yenrich Technology Corporation

Inventor： Min-Hsun HSIEH ,  Hsin-Mao LIU ,  Li-Yuan HUANG ,  Tzu-Hsiang WANG ,  Chi-Chih PU ,  Ya-Wen LIN ,  Hsiao-Pei CHIU ,  Pei-Yu LI

IPC: H01L25/075 ,  H01L33/62

Abstract: A light-emitting device includes a first carrier, which includes a side surface between a first surface and a second surface, upper conductive pads on the first surface, and lower conductive pads under the second surface; a RDL pixel package includes a RDL which includes bonding pads and bottom electrodes, and the light-emitting units on the RDL, and connected to the bonding pads. A light-transmitting layer on the RDL and covers the light-emitting units, an upper surface, a lower surface, and a lateral surface between the upper surface and the lower surface. The RDL pixel package is on the first surface and electrically connected to the upper conductive pads. A protective layer covers the first surface and contacting the side surface of the RDL pixel package. The lower electrodes and the upper conductive pads are connected, and the distance between two adjacent bonding pads is less than 30 μm.

公开(公告)号：US20220302357A1

公开(公告)日：2022-09-22

申请号：US17834487

申请日：2022-06-07

Applicant: EPISTAR CORPORATION

Inventor： Ching-Tai CHENG ,  Ju-Lien KUO ,  Min-Hsun HSIEH ,  Shau-Yi CHEN ,  Shih-An LIAO ,  Jhih-Hao CHEN

IPC: H01L33/50 ,  H01L33/52 ,  H01L33/00 ,  H01L33/22 ,  H01L51/52

Abstract: This disclosure discloses a light-emitting element having a light-emitting unit, a transparent layer and a wavelength conversion layer formed on the transparent layer. The transparent layer covers the light-emitting unit. The wavelength conversion layer includes a phosphor layer having a phosphor and a stress release layer without the phosphor

公开(公告)号：US20220059512A1

公开(公告)日：2022-02-24

申请号：US17515349

申请日：2021-10-29

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/60

Abstract: An embodiment of present invention discloses a light-emitting device which includes a first light-emitting area, a second light-emitting area, and a third light-emitting area. The first light-emitting area emits a red light and includes a first light-emitting unit. The second light-emitting area emits a blue light and includes a second light-emitting unit. The third light-emitting area emits a green light and includes a third light-emitting unit. The first light-emitting area is larger than the second light-emitting area and larger than the third light-emitting area. Each of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit has a width of less than 100 μm and a length of less than 100 μm.

公开(公告)号：US20210202793A1

公开(公告)日：2021-07-01

申请号：US17130712

申请日：2020-12-22

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH

IPC: H01L33/00 ,  H01L21/66 ,  H01L33/62

Abstract: A method of repairing a light emitting device, comprises: providing a light emitting device comprising a carrier board and a first light emitting unit; destroying the first light emitting unit and forming a removal surface on the light emitting device; planarizing the removal surface; providing a bonding structure on the removal surface; and fixing a second light emitting unit on the planarized removal surface through the bonding material.

公开(公告)号：US20200313051A1

公开(公告)日：2020-10-01

申请号：US16900557

申请日：2020-06-12

Applicant: EPISTAR CORPORATION

Inventor： Cheng-Nan HAN ,  Tsung-Xian LEE ,  Min-Hsun HSIEH ,  Hung-Hsuan CHEN ,  Hsin-Mao LIU ,  Hsing-Chao CHEN ,  Ching-San TAO ,  Chih-Peng NI ,  Tzer- Perng CHEN ,  Jen-Chau WU

IPC: H01L33/58 ,  H01L33/38 ,  H01L33/46 ,  H01L33/44 ,  H01L33/20 ,  H01L23/00

Abstract: The disclosure discloses an optoelectronic element comprising: an optoelectronic unit comprising a first metal layer, a second metal layer, and an outermost lateral surface; an insulating layer having a first portion overlapping the optoelectronic unit and extending beyond the lateral surface, and a second portion separated from the first portion in a cross-sectional view; and a first conductive layer formed on the insulating layer.

公开(公告)号：US20200295225A1

公开(公告)日：2020-09-17

申请号：US16817621

申请日：2020-03-13

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Chang-Lin LEE

IPC: H01L33/00 ,  H01L25/075

Abstract: A method of processing light-emitting elements includes: transferring a plurality of light-emitting elements from original wafers or next-stage carriers, based on a predetermined pattern. The predetermined pattern arranges two adjacent LED groups in a first direction on the original wafer or carriers to be placed on two non-adjacent positions in the first direction on the next-stage carriers. The light-emitting elements on the original wafer have a horizontal wafer pitch and a vertical wafer pitch. The light-emitting elements on each of the next-stage carriers have a first horizontal pitch and a first vertical pitch. The first horizontal pitch is greater than the horizontal wafer pitch, or the first vertical pitch is greater than the vertical wafer pitch. Besides, a light-emitting element device using the aforementioned method is also provided.

公开(公告)号：US20190341523A1

公开(公告)日：2019-11-07

申请号：US16514489

申请日：2019-07-17

Applicant: EPISTAR CORPORATION

Inventor： Ching-Tai CHENG ,  Ju-Lien KUO ,  Min-Hsun HSIEH ,  Shau-Yi CHEN ,  Shih-An LIAO ,  Jhih-Hao CHEN

IPC: H01L33/22 ,  H01L33/50 ,  H01L33/00 ,  H01L51/52

Abstract: A light-emitting element having a light-emitting unit, a transparent layer and a wavelength conversion layer formed on the transparent layer. The transparent layer covers the light-emitting unit. The wavelength conversion layer includes a phosphor layer having a phosphor and a stress release layer without the phosphor.

公开(公告)号：US20190259922A1

公开(公告)日：2019-08-22

申请号：US16280465

申请日：2019-02-20

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Tsung-Hong Lu

IPC: H01L33/50 ,  H01L33/60 ,  H01L33/62

Abstract: A light-emitting device includes a light-emitting unit, a light-transmitting layer, a wavelength conversion structure, and a reflective layer. The light-emitting unit includes a top surface and a first side surface. The light-transmitting layer covers the top surface and the first side surface of the light-emitting unit. The wavelength conversion structure is located on the light-transmitting layer. The wavelength conversion structure includes a wavelength conversion layer, a first barrier layer located on the wavelength conversion layer, a second barrier layer located under the wavelength conversion layer, and a third barrier layer covering side surfaces of the wavelength conversion layer, the first barrier layer, and the second barrier layer. The reflective layer surrounds the light-transmitting layer and the wavelength conversion structure.