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公开(公告)号：US20170271290A1
公开(公告)日：2017-09-21
申请号：US15459310
申请日：2017-03-15
Applicant: EPISTAR CORPORATION
Inventor： Shih-An LIAO , Shau-Yi CHEN , Ming-Chi HSU , Chun-Hung LIU , Min-Hsun HSIEH
CPC classification number: H01L24/16 , H01L24/06 , H01L24/13 , H01L24/20 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L33/30 , H01L33/62 , H01L33/647 , H01L2224/04105 , H01L2224/0612 , H01L2224/13309 , H01L2224/13311 , H01L2224/13313 , H01L2224/13339 , H01L2224/13499 , H01L2224/16058 , H01L2224/16105 , H01L2224/16227 , H01L2224/165 , H01L2224/2929 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/294 , H01L2224/29499 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/83121 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H01L2224/83862 , H01L2224/8388 , H01L2224/83886 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/12041 , H01L2924/15156 , H01L2924/00014 , H01L2924/01083 , H01L2924/01047 , H01L2924/01029 , H01L2924/00012
Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad, and a second bonding pad on a top surface of the stacking structure, wherein a shortest distance between the first bonding pad and the second bonding pad is less than 150 μm; a carrier comprising a connecting surface; a third bonding pad and a fourth bonding pad on the connecting surface of the carrier; and a conductive connecting layer comprising a current conductive area between the first bonding pad and the third bonding pad and between the second bonding pad and the fourth bonding pad.
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公开(公告)号：US20190237637A1
公开(公告)日：2019-08-01
申请号：US16262116
申请日：2019-01-30
Applicant: EPISTAR CORPORATION
Inventor： Ching-Tai CHENG , Shau-Yi CHEN , Yih-Hua RENN , Wei-Shan HU , Pei-Hsuan LAN
IPC: H01L33/50 , H01L25/075 , H01L33/60 , H01L33/44
Abstract: The application discloses a light-emitting device including a carrier, a light-emitting element and a connecting structure. The carrier includes a first connecting portion and a first necking portion extended from the first connecting portion. The first connecting portion has a first width, and the first necking portion has a second width. The second width is less than the first width. The light-emitting element includes a first light-emitting layer being able to emit a first light and a first contacting electrode formed under the first light-emitting layer. The first contacting electrode is corresponded to the first connecting portion. The connecting structure includes a first electrical connecting portion and a protecting portion surrounding the first electrical connecting portion. The first electrical connecting portion is electrically connected to the first connecting portion and the first contacting electrode. The first connecting portion substantially is located within a range surrounded by the protecting portion.
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公开(公告)号：US20200373469A1
公开(公告)日：2020-11-26
申请号：US16882412
申请日：2020-05-22
Applicant: EPISTAR CORPORATION , Yenrich Technology Corporation
Inventor： Shau-Yi CHEN , Tzu-Yuan LIN , Wei-Chiang HU , Pei-Hsuan LAN , Min-Hsun HSIEH
Abstract: A package includes a substrate, a first light-emitting unit, a second light-emitting unit, a light-transmitting layer, and a light-absorbing layer. The substrate has a first surface and an upper conductive layer on the first surface. The first light-emitting unit and the second light-emitting unit are disposed on the upper conductive layer. The first light-emitting unit has a first light-emitting surface and a first side wall. The second light-emitting unit has a second light-emitting surface and a second side wall. The light-transmitting layer is disposed on the first surface and covers the upper conductive layer, the first light-emitting unit, and the second light-emitting unit. The light-absorbing layer is disposed between the substrate and the light-transmitting layer, covers the upper conductive layer, the first side wall, and the second side wall, and exposes the first light-emitting surface and the second light-emitting surface.
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公开(公告)号：US20200227371A1
公开(公告)日：2020-07-16
申请号：US16836441
申请日：2020-03-31
Applicant: EPISTAR CORPORATION
Inventor： Shih-An LIAO , Shau-Yi CHEN , Ming-Chi HSU , Chun-Hung LIU , Min-Hsun HSIEH
Abstract: A light-emitting module includes a common carrier; a plurality of semiconductor devices formed on the common carrier, and each of the plurality of semiconductor devices including three semiconductor dies; a carrier including a connecting surface; a third bonding pad and a fourth bonding pad formed on the connecting surface; and a connecting layer. One of the three semiconductor dies includes a stacking structure; a first bonding pad; and a second bonding pad with a shortest distance less than 150 microns between the first bonding pad. The connecting layer includes a first conductive part including a first conductive material having a first shape; and a blocking part covering the first conductive part and including a second conductive material having a second shape with a diameter in a cross-sectional view. The first shape has a height greater than the diameter.
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公开(公告)号：US20210151405A1
公开(公告)日：2021-05-20
申请号：US17163746
申请日：2021-02-01
Applicant: EPISTAR CORPORATION
Inventor： Shih-An LIAO , Shau-Yi CHEN , Ming-Chi HSU , Chun-Hung LIU , Min-Hsun HSIEH
Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section view, and a distance from the first position to the first out contour is greater than that from the second position to the first outer contour.
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Patent Agency Ranking
公开(公告)号：US20200373468A1
公开(公告)日：2020-11-26
申请号：US16990121
申请日：2020-08-11
Applicant: EPISTAR CORPORATION
Inventor： Ching-Tai CHENG , Shau-Yi CHEN , Yih-Hua RENN , Wei-Shan HU , Pei-Hsuan LAN
IPC: H01L33/50 , H01L25/075 , H01L33/44 , H01L33/60
Abstract: The application discloses a light-emitting device including a carrier, a light-emitting element and a connecting structure. The carrier includes a first connecting portion and a first necking portion extended from the first connecting portion. The first connecting portion has a first width, and the first necking portion has a second width. The second width is less than the first width. The light-emitting element includes a first light-emitting layer being able to emit a first light and a first contacting electrode formed under the first light-emitting layer. The first contacting electrode is corresponded to the first connecting portion. The connecting structure includes a first electrical connecting portion and a protecting portion surrounding the first electrical connecting portion. The first electrical connecting portion is electrically connected to the first connecting portion and the first contacting electrode. The first connecting portion substantially is located within a range surrounded by the protecting portion.
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公开(公告)号：US20240145650A1
公开(公告)日：2024-05-02
申请号：US18407075
申请日：2024-01-08
Applicant: EPISTAR CORPORATION , Yenrich Technology Corporation
Inventor： Shau-Yi CHEN , Tzu-Yuan LIN , Wei-Chiang HU , Pei-Hsuan LAN , Min-Hsun HSIEH
CPC classification number: H01L33/58 , H01L27/156 , H01L33/62
Abstract: A package comprises a substrate including a first surface, and an upper conductive layer arranged on the first surface, a first light-emitting unit arranged on the upper conductive layer, and comprises a first semiconductor layer, a first substrate, a first light-emitting surface and a first side wall, a second light-emitting unit, which is arranged on the upper conductive layer, and comprises a second light-emitting surface and a second side wall, a light-transmitting layer arranged on the first surface and covers the upper conductive layer, the first light-emitting unit, and the second light-emitting unit, a light-absorbing layer, which is arranged between the substrate and the light-transmitting layer in a continuous configuration of separating the first light-emitting unit and the second light-emitting unit from each other, and a reflective wall arranged on the first side wall, wherein a height of the reflective wall is lower than that of the light-absorbing layer.
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公开(公告)号：US20230034763A1
公开(公告)日：2023-02-02
申请号：US17967681
申请日：2022-10-17
Applicant: EPISTAR CORPORATION , Yenrich Technology Corporation
Inventor： Shau-Yi CHEN , Tzu-Yuan LIN , Wei-Chiang HU , Pei-Hsuan LAN , Min-Hsun HSIEH
Abstract: A package includes a substrate, a first light-emitting unit, a second light-emitting unit, a light-transmitting layer, and a light-absorbing layer. The substrate has a first surface and an upper conductive layer on the first surface. The first light-emitting unit and the second light-emitting unit are disposed on the upper conductive layer. The first light-emitting unit has a first light-emitting surface and a first side wall. The second light-emitting unit has a second light-emitting surface and a second side wall. The light-transmitting layer is disposed on the first surface and covers the upper conductive layer, the first light-emitting unit, and the second light-emitting unit. The light-absorbing layer is disposed between the substrate and the light-transmitting layer, covers the upper conductive layer, the first side wall, and the second side wall, and exposes the first light-emitting surface and the second light-emitting surface.
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公开(公告)号：US20230017939A1
公开(公告)日：2023-01-19
申请号：US17947536
申请日：2022-09-19
Applicant: EPISTAR CORPORATION
Inventor： Shih-An LIAO , Shau-Yi CHEN , Ming-Chi HSU , Chun-Hung LIU , Min-Hsun HSIEH
Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section view, and a distance from the first position to the first out contour is greater than that from the second position to the first outer contour.
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公开(公告)号：US20220302357A1
公开(公告)日：2022-09-22
申请号：US17834487
申请日：2022-06-07
Applicant: EPISTAR CORPORATION
Inventor： Ching-Tai CHENG , Ju-Lien KUO , Min-Hsun HSIEH , Shau-Yi CHEN , Shih-An LIAO , Jhih-Hao CHEN
Abstract: This disclosure discloses a light-emitting element having a light-emitting unit, a transparent layer and a wavelength conversion layer formed on the transparent layer. The transparent layer covers the light-emitting unit. The wavelength conversion layer includes a phosphor layer having a phosphor and a stress release layer without the phosphor
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