公开(公告)号：US20180153510A1

公开(公告)日：2018-06-07

申请号：US15826614

申请日：2017-11-29

Applicant: EXO IMAGING INC.

Inventor： Yusuf Haque ,  Sandeep Akkaraju ,  Janusz Bryzek

IPC: A61B8/00 ,  H01L41/09 ,  H01L41/08 ,  H01L41/053 ,  B06B1/06 ,  B06B1/02 ,  A61B8/08

CPC classification number: A61B8/4494 ,  A61B8/0883 ,  A61B8/145 ,  A61B8/4427 ,  A61B8/4472 ,  A61B8/4483 ,  A61B8/4488 ,  A61B8/461 ,  A61B8/488 ,  A61B8/5207 ,  A61B8/546 ,  B06B1/0215 ,  B06B1/0238 ,  B06B1/0629 ,  B06B1/0662 ,  B06B1/0692 ,  B06B2201/76 ,  G01S7/52046 ,  G01S7/52079 ,  G01S7/521 ,  G01S15/8925 ,  H01L41/053 ,  H01L41/0805 ,  H01L41/0973 ,  H01L41/098

Abstract: A transceiver includes an array of pMUT elements, where each pMUT element includes: a substrate; a membrane suspending from the substrate; a bottom electrode disposed on the membrane; a piezoelectric layer disposed on the bottom electrode; and a first electrode disposed on the piezoelectric layer. Each pMUT element exhibits one or more modes of vibration.

公开(公告)号：US12263507B2

公开(公告)日：2025-04-01

申请号：US17095333

申请日：2020-11-11

Applicant: eXo Imaging, Inc.

Inventor： Brian Bircumshaw ,  Sandeep Akkaraju

IPC: B06B1/00 ,  B06B1/06 ,  G01S7/52 ,  G01S15/89 ,  H10N30/073 ,  H10N30/088 ,  H10N30/80 ,  H10N30/853 ,  H10N30/87

Abstract: The present disclosure provides methods to integrate piezoelectric micromachined ultrasonic transducer (pMUT) arrays with an application-specific integrated circuit (ASIC) using thermocompression or eutectic/solder bonding. In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using thermocompression, wherein any set of individual PMUTs of PMUT array is addressable. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using eutectic or solder bonding, wherein any set of individual PMUTs of the PMUT array is addressable.

公开(公告)号：USD1038979S1

公开(公告)日：2024-08-13

申请号：US29830797

申请日：2022-03-15

Applicant: Exo Imaging, Inc.

Designer： Michael Pupo ,  Ann Lambert ,  Annik Ragsdale ,  Sandeep Akkaraju

Abstract: The FIGURE is a front view of a computer display panel with graphical user interface, showing our new design.
The broken lines in the drawing represent portions of the computer display panel with graphical user interface that form no part of the claimed design.

公开(公告)号：USD1038140S1

公开(公告)日：2024-08-06

申请号：US29830799

申请日：2022-03-15

Applicant: Exo Imaging, Inc.

Designer： Michael Pupo ,  Ann Lambert ,  Annik Ragsdale ,  Sandeep Akkaraju

Abstract: The FIGURE is a front view of a computer display panel with graphical user interface, showing our new design.
The broken lines in the drawing represent portions of the computer display panel with graphical user interface that form no part of the claimed design.

公开(公告)号：US11998950B2

公开(公告)日：2024-06-04

申请号：US17018304

申请日：2020-09-11

Applicant: eXo Imaging, Inc.

Inventor： Brian Bircumshaw ,  Sandeep Akkaraju ,  Haesung Kwon

IPC: B06B1/06 ,  H10N30/50 ,  H10N30/87 ,  H10N30/00

CPC classification number: B06B1/0651 ,  B06B1/0662 ,  B06B1/0666 ,  H10N30/50 ,  H10N30/871 ,  H10N30/10516 ,  H10N30/877

Abstract: Methods for improving the electromechanical coupling coefficient and bandwidth of micromachined ultrasonic transducers, or MUTs, are presented as well as methods of manufacture of the MUTs improved by the presented methods.

公开(公告)号：US20230389897A1

公开(公告)日：2023-12-07

申请号：US18236233

申请日：2023-08-21

Applicant: Exo Imaging, Inc.

Inventor： Janusz Bryzek ,  Sandeep Akkaraju ,  Yusuf Haque ,  Joe Adam

IPC: A61B8/00 ,  H01L23/00 ,  B06B1/02 ,  B06B1/06 ,  G01S15/89 ,  B81B7/00

CPC classification number: A61B8/4494 ,  H01L24/73 ,  H01L24/32 ,  H01L24/48 ,  B06B1/0215 ,  B06B1/0622 ,  B06B1/0666 ,  B06B1/067 ,  B06B1/0681 ,  A61B8/4488 ,  G01S15/8938 ,  G01S15/8965 ,  B81B7/0058 ,  B06B2201/76 ,  B81B2207/012 ,  B81B2207/053 ,  B81B2207/098 ,  H01L2224/73265 ,  H01L2224/73253 ,  H01L2224/73207 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/16145 ,  H01L2924/1461

Abstract: Described are transducer assemblies and imaging devices comprising: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

公开(公告)号：US11828844B2

公开(公告)日：2023-11-28

申请号：US16978139

申请日：2019-03-01

Applicant: eXo Imaging, Inc.

Inventor： Sandeep Akkaraju

IPC: G01S15/58 ,  G01S7/52 ,  A61B8/00

CPC classification number: G01S15/586 ,  G01S7/52053 ,  G01S7/52079 ,  A61B8/4254 ,  A61B8/4427

Abstract: Disclosed herein are portable ultrasound imaging systems for thumb-dominant operations comprising: a portable ultrasound probe, wherein the portable ultrasound probe is configured to be operable using a first hand of the user; a mobile device comprising a mobile application installed thereon, the mobile application comprising a user interface, the mobile application configured to be operable using a second hand of the user and; and direct electronic communication between the portable ultrasound probe and the mobile device, the direct electronic communication configured to allow a user to control an operation of the portable ultrasound probe for imaging via user interaction with the user interface.

公开(公告)号：US11794209B2

公开(公告)日：2023-10-24

申请号：US17272910

申请日：2020-09-11

Applicant: eXo Imaging, Inc.

Inventor： Brian Lee Bircumshaw ,  Sandeep Akkaraju ,  Haesung Kwon

IPC: B06B1/06 ,  H10N30/50 ,  H10N30/87 ,  H10N30/00

CPC classification number: B06B1/0651 ,  B06B1/0662 ,  B06B1/0666 ,  H10N30/50 ,  H10N30/10516 ,  H10N30/871 ,  H10N30/877

Abstract: Methods for improving the electromechanical coupling coefficient and bandwidth of micromachined ultrasonic transducers, or MUTs, are presented as well as methods of manufacture of the MUTs improved by the presented methods.

公开(公告)号：US11730451B2

公开(公告)日：2023-08-22

申请号：US17155940

申请日：2021-01-22

Applicant: eXo Imaging, Inc.

Inventor： Janusz Bryzek ,  Sandeep Akkaraju ,  Yusuf Haque ,  Joe Adam

IPC: B06B1/06 ,  A61B8/00 ,  H01L23/00 ,  B06B1/02 ,  G01S15/89 ,  B81B7/00

CPC classification number: A61B8/4494 ,  A61B8/4488 ,  B06B1/0215 ,  B06B1/067 ,  B06B1/0622 ,  B06B1/0666 ,  B06B1/0681 ,  B81B7/0058 ,  G01S15/8938 ,  G01S15/8965 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  B06B2201/76 ,  B81B2207/012 ,  B81B2207/053 ,  B81B2207/098 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/1461

Abstract: Described are transducer assemblies and imaging devices comprising: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

公开(公告)号：US11199623B2

公开(公告)日：2021-12-14

申请号：US17153631

申请日：2021-01-20

Applicant: EXO IMAGING, INC.

Inventor： Yusuf Haque ,  Sandeep Akkaraju ,  Janusz Bryzek ,  Brian Bircumshaw

IPC: G01S15/89 ,  A61B8/00 ,  G01N29/24 ,  H01L41/09 ,  G01S7/52 ,  B06B1/06 ,  B81B3/00 ,  G01N29/26 ,  G01N29/34 ,  G10K11/34 ,  A61B8/08 ,  G01N29/02 ,  G01N29/06 ,  G01N29/04

Abstract: An imaging device includes a transducer that includes an array of piezoelectric elements formed on a substrate. Each piezoelectric element includes at least one membrane suspended from the substrate, at least one bottom electrode disposed on the membrane, at least one piezoelectric layer disposed on the bottom electrode, and at least one top electrode disposed on the at least one piezoelectric layer. Adjacent piezoelectric elements are configured to be isolated acoustically from each other. The device is utilized to measure flow or flow along with imaging anatomy.