公开(公告)号：US20090078577A1

公开(公告)日：2009-03-26

申请号：US12226889

申请日：2007-08-17

Applicant: Kentaro Suzuki ,  Kei Yuki ,  Fumio Aoki

Inventor： Kentaro Suzuki ,  Kei Yuki ,  Fumio Aoki

IPC: C25D21/22 ,  C25B15/08

CPC classification number: C25D17/00 ,  C25D3/20 ,  C25D7/0614 ,  C25D21/18 ,  C25D21/22

Abstract: A plating solution recovery apparatus for electroplating, the apparatus comprises a circulation tank; a sludge removing device; a concentrating device; an iron compound crystallizing device; an iron compound separating device; an iron compound redissolving device; an iron ion removing device; pipelines sequentially connecting the circulation tank, the sludge removing device, the concentrating device, the iron compound crystallizing device, the iron compound separating device, the iron compound redissolving device, and then the iron ion removing device in a downstream direction from a base point coincident with the circulation tank; a pipeline connecting from the iron ion removing device to the circulation tank; a pipeline connecting from the iron compound separating device to the circulation tank; and a flow path changing device connecting to the circulation tank and provided in at least one portion selected from a group of portions, respectively, between the sludge removing device and the concentrating device, between the concentrating device and iron compound crystallizing device, and between the iron compound crystallizing device and the iron compound separating device. With the apparatus being used, the plating solution can be recovered in the manner that sludge and iron are removed from the plating solution used for electroplating of a steel strip. Further, with the apparatus being used, even when stopping the operation of a device(s) related to iron removal, a continuous electroplating operation can be maintained without reducing the operation rate of the sludge removing device.

Abstract translation: 一种用于电镀的电镀液回收装置，该装置包括循环罐; 污泥去除装置; 集中装置; 铁化合物结晶装置; 铁化合物分离装置; 铁化合物再溶解装置; 铁离子去除装置; 管道依次连接循环罐，污泥去除装置，浓缩装置，铁化合物结晶装置，铁化合物分离装置，铁化合物再溶解装置，然后从基点重合的下游方向的铁离子去除装置 与循环罐; 从铁离子去除装置连接到循环罐的管道; 从铁化合物分离装置连接到循环罐的管道; 以及流路切换装置，其连接到所述循环罐，并且设置在所述浓缩装置与所述铁化合物结晶装置之间的所述污泥除去装置和所述浓缩装置之间的至少一部分中，所述至少一部分选自所述浓缩装置和所述浓缩装置之间， 铁化合物结晶装置和铁化合物分离装置。 在使用该设备的情况下，可以以从用于电镀钢板的电镀液中除去污泥和铁的方式来回收电镀液。 此外，使用该装置，即使停止与除铁有关的装置的操作，也可以维持连续的电镀操作，而不会降低污泥去除装置的操作速度。

公开(公告)号：US20060057916A1

公开(公告)日：2006-03-16

申请号：US11253599

申请日：2005-10-20

Applicant: Hideki Ozawa ,  Fumio Aoki

Inventor： Hideki Ozawa ,  Fumio Aoki

IPC: B32B5/02 ,  B32B27/34 ,  D06N1/00

CPC classification number: C08J5/18 ,  C08G73/10 ,  C08G73/1003 ,  C08J2379/08 ,  D04H1/587 ,  H05K1/0346 ,  Y10T428/31674 ,  Y10T442/184 ,  Y10T442/20 ,  Y10T442/2811

Abstract: A water-soluble polyimide precursor, which can be suitably applied for aromatic polyimides and exhibits a low reduction in heat resistance and mechanical properties, an aqueous solution of the polyimide precursor and a polyimide obtained from the precursor. A heat-resistant fiber impregnated material and an impregnated sheet-like material are prepared by using the precursor and a laminate is prepared by employing the precursor.

公开(公告)号：US06319597B1

公开(公告)日：2001-11-20

申请号：US09309222

申请日：1999-05-10

Applicant: Hiroaki Yamaguchi ,  Fumio Aoki ,  Shuichi Hirano

Inventor： Hiroaki Yamaguchi ,  Fumio Aoki ,  Shuichi Hirano

IPC: B32B702

CPC classification number: B32B15/08 ,  B32B2311/12 ,  B32B2379/08 ,  H05K1/0346 ,  Y10T428/24967 ,  Y10T428/24975 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: A polyimide composite film favorably employable for preparing a heat-resistant metal foil/polyimide film composite is composed of a polyimide substrate showing a thermal expansion coefficient of 1×10−5 to 2×10−5 cm/° C. in a temperature range of 50 to 200° C. and a polyimide film which is bonded to the substrate and which is made of polyimide composed of 30-100 molar % of the recurring unit (A) and 70-0 molar % of the recurring unit (B): [each of R and R′ is a tetravalent aromatic or aliphatic group].

Abstract translation: 可用于制备耐热金属箔/聚酰亚胺膜复合材料的聚酰亚胺复合膜由聚酰亚胺基板组成，其在50至200的温度范围内显示出1×10-5至2×10-5cm /℃的热膨胀系数 （A）和70〜70摩尔％的重复单元（B）组成的聚酰亚胺构成的聚酰亚胺膜：[ R和R'是四价芳族或脂族基]。

公开(公告)号：US6081998A

公开(公告)日：2000-07-04

申请号：US57660

申请日：1998-04-09

Applicant: Hideaki Terauchi ,  Fumio Aoki ,  Kazuhiko Ota ,  Yasuhiro Teshima

Inventor： Hideaki Terauchi ,  Fumio Aoki ,  Kazuhiko Ota ,  Yasuhiro Teshima

IPC: H01R12/55 ,  H01R13/60 ,  H05K3/30 ,  H05K7/12 ,  A01R9/00

CPC classification number: H01R12/7058 ,  H01R12/7023 ,  H01R12/707 ,  H05K3/303 ,  H05K7/12 ,  H01R12/7047 ,  H01R12/716 ,  H05K2201/0308 ,  H05K2201/10189 ,  H05K2201/10598 ,  H05K3/306 ,  Y02P70/613 ,  Y10S439/943 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49153

Abstract: There is disclosed a method of surface mounting a connector which enables a connector to be automatically mounted while preserving reliability of soldered portions and without additionally providing a special apparatus. The connector is formed to be thick at a portion and thin at another portion with respect to an axis C.sub.1. In surface mounting the connector on the printed circuit board, a hook member is inserted into a through hole formed in advance through the printed circuit board. Then, the reflow process is carried out on the printed circuit board whereby terminals of the chips including the lead pins are soldered. The printed circuit board is reroved from a reflow furnace, and cooled, whereupon the hook member is bent toward a hooking portion side. This brings the hooking portion into engagement with the underside of the printed circuit board, whereby the connector is firmly fixed to the printed circuit board.

Abstract translation: 公开了一种表面安装连接器的方法，其能够使连接器自动安装，同时保持焊接部分的可靠性，而不需要额外提供专用设备。 连接器形成为在一部分处较厚并且在相对于轴线C1的另一部分处薄。 将连接器表面安装在印刷电路板上时，将钩构件插入到通过印刷电路板预先形成的通孔中。 然后，在印刷电路板上进行回流处理，由此焊接包括引线引脚的芯片的端子。 将印刷电路板从回流炉中取出并冷却，由此钩构件向钩部侧弯曲。 这使得钩挂部分与印刷电路板的下侧接合，由此连接器牢固地固定到印刷电路板上。