公开(公告)号：US20190145896A1

公开(公告)日：2019-05-16

申请号：US16097922

申请日：2016-07-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Devin A. Mourey

IPC: G01N21/65 ,  G01N21/64 ,  G01J3/44

Abstract: An apparatus may include a frame layer having a recess, a substrate secured to the frame layer at least partially across the recess and a surface enhanced luminescence (SEL) stage supported by the substrate within the recess.

公开(公告)号：US20190118540A1

公开(公告)日：2019-04-25

申请号：US16092547

申请日：2016-04-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Devin Alexander Mourey

IPC: B41J2/175 ,  G01F23/24 ,  G01F23/26

Abstract: A fluid level sensing device includes a substrate (210) and a sensing die (216) cantilevered at one end from the substrate. A number of sensing components (218), preferably thermal or impedance sensing components, are disposed on the sensing die and detect a fluid level in a fluid reservoir. A protective member (208) is also cantilevered at one end from the substrate alongside the sensing die. Electrical interconnects (212) output data collected from the number of sensing components. A number of sensing dies may be provided to lengthen the sensing device, in which case the protective cover extends alongside and parallel to the number of sensing dies.

公开(公告)号：US10220620B2

公开(公告)日：2019-03-05

申请号：US15850174

申请日：2017-12-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/16 ,  B41J2/14

Abstract: In one example, a printhead structure includes multiple printhead dies and a printed circuit board embedded in a single monolithic molding with fully encapsulated wire bonds that electrically connect the dies to conductive routing in the printed circuit board. Fluid may pass through a slot in the molding directly to the dies.

公开(公告)号：US10195851B2

公开(公告)日：2019-02-05

申请号：US15632224

申请日：2017-06-23

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Silam J. Choy

IPC: B41J2/14 ,  B41J2/155 ,  B41J2/16 ,  B41J2/145 ,  B41J25/34

Abstract: A print bar may include a mounting structure and a printhead mounted to the mounting structure. The printed may include multiple printhead dies molded into a monolithic body and arranged parallel to one another in the body. The body may have multiple channels therein through which printing fluid may pass directly to the dies.

公开(公告)号：US20180333956A1

公开(公告)日：2018-11-22

申请号：US16050912

申请日：2018-07-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Arun K. Agarwal

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/155 ,  H05K3/32 ,  H05K3/28 ,  H05K1/18 ,  B29C69/00 ,  H05K3/40

CPC classification number: B41J2/1632 ,  B29C69/001 ,  B41J2/14016 ,  B41J2/1404 ,  B41J2/14145 ,  B41J2/14201 ,  B41J2/1433 ,  B41J2/155 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1637 ,  B41J2/1645 ,  B41J2002/14419 ,  B41J2002/14491 ,  B41J2202/19 ,  B41J2202/20 ,  H05K1/186 ,  H05K3/284 ,  H05K3/32 ,  H05K3/4007 ,  H05K2203/0228 ,  H05K2203/1316

Abstract: In an embodiment, a fluid flow structure includes a micro device embedded in a molding. A fluid feed hole is formed through the micro device, and a saw defined fluid channel is cut through the molding to fluidically couple the fluid feed hole with the channel.

公开(公告)号：US20180319655A1

公开(公告)日：2018-11-08

申请号：US15772377

申请日：2016-02-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Garrett E. Clark ,  Michael W. Cumbie ,  Chien-Hua Chen

IPC: B81B7/00 ,  B81B1/00 ,  B81C1/00 ,  B01L3/00 ,  B41J2/14

CPC classification number: B81B7/0083 ,  B01L3/5027 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502784 ,  B01L2300/0867 ,  B01L2300/087 ,  B01L2300/088 ,  B01L2300/1827 ,  B01L2300/1894 ,  B01L2400/0442 ,  B01L2400/046 ,  B41J2/1433 ,  B81B1/006 ,  B81B2203/0338 ,  B81C1/00119 ,  F04B19/006 ,  F04B43/046

Abstract: A fluid propelling apparatus, including a plastic compound, a MEMS at least partially surrounded by the compound, and a heat sink next to the MEMS, to transfer heat away from the MEMS, wherein the heat sink is at least partly surrounded by the compound.

公开(公告)号：US10081186B2

公开(公告)日：2018-09-25

申请号：US15646163

申请日：2017-07-11

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/045

CPC classification number: B41J2/1601 ,  B41J2/04523 ,  B41J2/14145 ,  B41J2/1607 ,  B41J2/1628 ,  B41J2/1632 ,  B41J2/1637 ,  B41J2/1639 ,  B41J2/1645 ,  B41J2202/19 ,  B41J2202/20

Abstract: In an example implementation, a printhead includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding and flush with the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.

公开(公告)号：US20180154636A1

公开(公告)日：2018-06-07

申请号：US15890058

申请日：2018-02-06

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/155 ,  B41J2/16 ,  B41J2/14

CPC classification number: B41J2/155 ,  B41J2/14 ,  B41J2/1404 ,  B41J2/14129 ,  B41J2/14145 ,  B41J2/14201 ,  B41J2/1433 ,  B41J2/145 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/1637 ,  B41J25/34 ,  B41J2002/14419 ,  B41J2202/20

Abstract: In an example, a fluid ejection apparatus includes a printhead die embedded in a printed circuit board. Fluid may flow to the printhead die through a plunge-cut fluid feed slot in the printed circuit board and into the printhead die.

公开(公告)号：US20180154576A1

公开(公告)日：2018-06-07

申请号：US15558633

申请日：2015-08-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Qin Liu ,  Hua Tan ,  Zhizhang Chen

IPC: B29C64/277 ,  B29C64/112 ,  B29C64/209 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B41J2/14 ,  B41J11/00

CPC classification number: B29C64/277 ,  B29C35/0805 ,  B29C64/112 ,  B29C64/20 ,  B29C64/209 ,  B29C64/393 ,  B29C2035/0822 ,  B29C2035/0827 ,  B29C2035/0833 ,  B29K2105/0094 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02 ,  B41J2/14016 ,  B41J2/14201 ,  B41J2/155 ,  B41J2/44 ,  B41J11/002

Abstract: Examples include a printhead comprising a plurality of nozzles for ejecting printing material drops. Examples include at least one emission device positioned proximate the printhead, where the at least one emission device is to emit energy to thereby expose ejected printing material drops to emitted energy to change at least one material property of ejected printing material drops in-flight.

公开(公告)号：US09895889B2

公开(公告)日：2018-02-20

申请号：US15307310

申请日：2014-06-23

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Jeremy Harlan Donaldson ,  Teressa L. Roth ,  Bradley B Branham

IPC: B41J2/14 ,  B41J2/165 ,  B41J2/155

CPC classification number: B41J2/1433 ,  B41J2/14072 ,  B41J2/155 ,  B41J2/165 ,  B41J2/16538 ,  B41J2/16585 ,  B41J2/1714 ,  B41J2002/14491 ,  B41J2002/16502

Abstract: Examples of a printhead assembly are disclosed herein. An example of the printhead assembly includes a die to print, a base member, and at least one electrode. The electrode may be used to provide a charge to attract and collect particles that would normally otherwise interfere with operation of the die.