Mask blank, phase-shift mask, and method for manufacturing the same

    公开(公告)号:US09625806B2

    公开(公告)日:2017-04-18

    申请号:US14760911

    申请日:2014-01-14

    CPC classification number: G03F1/32 G03F1/26 G03F1/54 G03F7/2006 H01L21/0275

    Abstract: Provided is a mask blank in which uniformity of the composition and optical characteristics of a phase-shift film in the in-plane direction and direction of film thickness is high, uniformity of the composition and optical characteristics of the phase-shift film between a plurality of substrates is also high, and defectivity is low even if a silicon-based material is applied to the material that forms the phase-shift film.A mask blank is provided in which a phase-shift film is provided on a transparent substrate, the phase-shift film having a function to transmit ArF exposure light therethrough at a predetermined transmittance and generate a predetermined amount of phase shift in the ArF exposure light that is transmitted therethrough, wherein the phase-shift film comprises a structure in which a low transmission layer and a high transmission layer are laminated, the low transmission layer and the high transmission layer are formed from a material consisting of silicon and nitrogen or a material consisting of silicon, nitrogen and one or more elements selected from semi-metallic elements, non-metallic elements and noble gases, and the low transmission layer has a relatively low nitrogen content in comparison with the high transmission layer.

    Method of manufacturing a transfer mask and method of manufacturing a semiconductor device
    35.
    发明授权
    Method of manufacturing a transfer mask and method of manufacturing a semiconductor device 有权
    制造转印掩模的方法和制造半导体器件的方法

    公开(公告)号:US09140980B2

    公开(公告)日:2015-09-22

    申请号:US13955831

    申请日:2013-07-31

    CPC classification number: G03F1/80 G03F1/50 G03F1/54 G03F1/58

    Abstract: In a mask blank for manufacturing a transfer mask, the mask blank has a light-shielding film on a transparent substrate. The light-shielding film is made of a material containing tantalum as a main metal component and includes a highly oxidized layer which has an oxygen content of 60 at % or more and which is formed as a surface layer of the light-shielding film. The highly oxidized layer is placed on a side opposite to a transparent substrate side.

    Abstract translation: 在用于制造转印掩模的掩模坯料中,掩模坯料在透明基板上具有遮光膜。 遮光膜由含有钽作为主要金属成分的材料制成,并且包含氧含量为60原子%以上且形成为遮光膜的表面层的高度氧化层。 高氧化层位于与透明基板侧相反的一侧。

    Reflective mask blank, reflective mask and method of manufacturing reflective mask
    36.
    发明授权
    Reflective mask blank, reflective mask and method of manufacturing reflective mask 有权
    反光罩,反光罩及反光罩制造方法

    公开(公告)号:US09075315B2

    公开(公告)日:2015-07-07

    申请号:US13628790

    申请日:2012-09-27

    CPC classification number: G03F1/24 G03F1/58 G03F1/80

    Abstract: The present invention is a reflective mask blank used to fabricate a reflective mask, which has a laminated structure of a multilayer reflective film, an absorber film and an etching mask film in this order on a substrate, wherein the etching mask film comprises a material containing chromium, the absorber film comprises a material containing tantalum, a highly oxidized layer is formed on the surface layer of the absorber film on the opposite side from the substrate, and a Ta 4f narrow spectrum of the highly oxidized layer when analyzed by X-ray photoelectron spectroscopy has a maximum peak at a binding energy of more than 23 eV.

    Abstract translation: 本发明是用于制造反射掩模的反射掩模坯料,其在基板上依次具有多层反射膜,吸收膜和蚀刻掩模膜的层叠结构,其中蚀刻掩模膜包括含有 铬,吸收膜包含含有钽的材料,在与基板相反的一侧的吸收膜的表面层上形成高度氧化层,并且通过X射线分析时形成高度氧化层的Ta 4f窄谱 光电子能谱具有超过23eV的结合能的最大峰值。

    Optically semitransmissive film, photomask blank and photomask, and method for designing optically semitransmissive film
    37.
    发明授权
    Optically semitransmissive film, photomask blank and photomask, and method for designing optically semitransmissive film 有权
    光学半透射膜,光掩模坯料和光掩模,以及用于设计光学半透射膜的方法

    公开(公告)号:US08580466B1

    公开(公告)日:2013-11-12

    申请号:US13917338

    申请日:2013-06-13

    CPC classification number: G03F1/26 G03F1/32 G03F1/34 G03F1/54

    Abstract: A photomask blank includes a transparent substrate and a film containing at lease two layers formed on the transparent substrate, the two layers being a first layer with a phase difference Δθ1 and a second layer with a phase difference Δθ2. The phase difference Δθ1 is a phase difference between a light transmitted through the first layer and a light transmitted through an air distance equal to a thickness of the first layer, and the phase difference Δθ2 is a phase difference between a light transmitted through the second layer and a light transmitted through an air distance equal to a thickness of the second layer. A phase difference of the film containing at least two layers is from −30° to +30°. The first layer contains a material not to be etched during etching of the transparent substrate.

    Abstract translation: 光掩模坯料包括透明基板和形成在透明基板上的至少两层的膜,两层是具有相位差Deltatheta1的第一层和具有相位差Deltatheta2的第二层。 相位差Deltatheta1是透过第一层的光和透过等于第一层的厚度的空气距离的光之间的相位差,相位差Deltatheta2是透过第二层的光之间的相位差 透过空气距离等于第二层厚度的光。 含有至少两层的膜的相位差为-30°〜+ 30°。 第一层包含在蚀刻透明衬底期间不被蚀刻的材料。

    Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device

    公开(公告)号:US11281089B2

    公开(公告)日:2022-03-22

    申请号:US16488901

    申请日:2018-01-24

    Abstract: A light shielding film made up of a material containing one or more elements selected from silicon and tantalum and a hard mask film made up of a material containing chromium, oxygen, and carbon are laminated on a transparent substrate. The hard mask film is a single layer film having a composition gradient portion with increased oxygen content on the surface and on the neighboring region. The maximum peak for N1s in a narrow spectrum obtained via X-ray photoelectron spectroscopy analysis is the lower limit of detection or less. The portions excluding the composition gradient portion of the hard mask film have a 50 atom % or more chromium content, and the maximum peak for Cr2p in a narrow spectrum obtained via X-ray photoelectron spectroscopy analysis has a binding energy of 574 eV or less.

    Mask blank, phase-shift mask, and method of manufacturing semiconductor device

    公开(公告)号:US10942442B2

    公开(公告)日:2021-03-09

    申请号:US16671065

    申请日:2019-10-31

    Abstract: A mask blank is provided in which a phase-shift film is provided on a transparent substrate, the phase-shift film having a predetermined transmittance to ArF exposure light and being configured to shift a phase of ArF exposure light transmitted therethrough, wherein the phase-shift film comprises a nitrogen-containing layer that is formed from a material containing silicon and nitrogen and does not contain a transition metal, and wherein a content of oxygen in the nitrogen-containing layer, when measured by X-ray photoemission spectroscopy, is below a detection limit.

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