公开(公告)号：US10271468B2

公开(公告)日：2019-04-23

申请号：US15782349

申请日：2017-10-12

Applicant: IBIDEN CO., LTD.

Inventor： Toshiki Furutani ,  Takema Adachi ,  Hidetoshi Noguchi ,  Shota Tachibana

IPC: H05K9/00 ,  H01L23/60 ,  H05K3/46 ,  H01L23/552

Abstract: A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The side wall and ceiling portions are forming accommodation space to accommodate electronic component, the ceiling portion has a first surface facing the space and a second surface on the opposite side, the side wall portion has a third surface facing the ceiling portion, a fourth surface on the opposite side, a fifth surface facing the space, and a sixth surface on the opposite side, and the side wall portion is formed such that the sixth surface has a first inclined portion increasing distance to the space from the third toward fourth surfaces and a second inclined portion increasing distance to the space from the fourth toward third surfaces.

公开(公告)号：US10231336B2

公开(公告)日：2019-03-12

申请号：US15920594

申请日：2018-03-14

Applicant: IBIDEN CO., LTD.

Inventor： Toshiki Furutani ,  Takema Adachi ,  Toshihide Makino ,  Hidetoshi Noguchi

IPC: H05K1/11 ,  H05K3/42 ,  H05K3/46 ,  H05K3/18 ,  H05K3/06 ,  H05K3/24 ,  H05K1/02 ,  H05K1/03 ,  H05K3/14

Abstract: A printed wiring board includes a first conductor layer forming an inner conductor layer, a second conductor layer forming a first outemiost conductor layer, a third conductor layer forming a second outermost conductor layer, insulating layers including first and second insulating layers, first via conductors connecting the first and second conductor layers, and second via conductors connecting the first and third conductor layers. The first conductor layer has thickness greater than thicknesses of the second and third conductor layers, the second conductor layer includes component mounting pads positioned to mount an electronic component on the second conductor layer and extending outside component mounting region corresponding to projection region of the component, and the first via conductors include a first set of the first via conductors formed directly underneath the component mounting region and a second set of the first via conductors formed on outer side of the component mounting region.

公开(公告)号：US10221497B2

公开(公告)日：2019-03-05

申请号：US14663559

申请日：2015-03-20

Applicant: IBIDEN CO., LTD.

Inventor： Kota Noda ,  Takema Adachi ,  Wataru Nakamura

IPC: C25D5/02 ,  C25D7/12 ,  C25D7/00 ,  C23C18/16 ,  H05K3/40 ,  C25D5/10 ,  C25D5/12 ,  C23C18/38 ,  H05K3/10 ,  H05K3/24 ,  H05K3/46

Abstract: A method for manufacturing a wiring board having conductive posts includes preparing a wiring board including electronic circuit and a solder resist layer covering the electronic circuit and having first openings and second openings surrounding the first openings such that the first openings are exposing pad portions of the electronic circuit and that the second openings are exposing post connecting portions of the electronic circuit surrounding the pad portions, applying surface treatment to the pad portions, forming a plating resist layer on the wiring board after the surface treatment of the pad portions such that the plating resist layer has resist openings exposing the post connecting portions, applying electrolytic plating on the post connecting portions such that conductive posts rising from the post connecting portions are formed in the resist openings, and removing the plating resist layer from the wiring board after forming the conductive posts in the resist openings.

公开(公告)号：US10219383B2

公开(公告)日：2019-02-26

申请号：US15924412

申请日：2018-03-19

Applicant: IBIDEN CO., LTD.

Inventor： Katsutoshi Kitagawa ,  Takema Adachi

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/46 ,  H05K3/42 ,  H01L27/146

Abstract: A printed wiring board includes a laminate including resin insulating layers and conductor layers such that the resin insulating layers and the conductor layers are laminated alternately and that the laminate has a through hole opening to a first surface of the laminate and a component accommodating cavity that accommodates an electronic component and having an opening part formed on a second surface of the laminate on the opposite side with respect to the first surface. The through hole is formed through the laminate such that the through hole is extending to the component accommodating cavity, and the laminate has a resin coating formed on an inner wall surface of the through hole.

公开(公告)号：US10070523B2

公开(公告)日：2018-09-04

申请号：US15084992

申请日：2016-03-30

Applicant: IBIDEN CO., LTD.

Inventor： Shunsuke Sakai ,  Toshiki Furutani ,  Kosuke Ikeda ,  Takema Adachi ,  Takayuki Katsuno

IPC: H05K1/11 ,  H05K3/40 ,  H01L21/48 ,  H01L23/498 ,  H01L23/14 ,  H01L23/12 ,  H05K3/36 ,  H05K3/20 ,  H05K3/38

Abstract: A printed wiring board includes a resin insulating layer, a wiring conductor layer embedded in the insulating layer such that the wiring layer has first surface exposed from the insulating layer, and a conductor post formed in the insulating layer and on second surface of the wiring layer on the opposite side with respect to the first surface of the wiring layer such that the conductor post has side surface covered by the insulating layer and end surface exposed from the insulating layer on the opposite side with respect to the wiring layer. The conductor post is formed such that the side surface of the conductor post is a roughened side surface having surface roughness of first roughness R1, the end surface of the conductor post is a roughened end surface having surface roughness of second roughness R2, and the first and second roughnesses R1, R2 satisfy R1>R2.

公开(公告)号：US20160242285A1

公开(公告)日：2016-08-18

申请号：US15044380

申请日：2016-02-16

Applicant: IBIDEN CO., LTD.

Inventor： Takayuki Katsuno ,  Yuki Ito ,  Takeshi Furusawa ,  Takema Adachi

IPC: H05K1/11 ,  H05K1/09

CPC classification number: H05K1/0271 ,  H05K3/007 ,  H05K3/025 ,  H05K3/188 ,  H05K3/244 ,  H05K2201/0338 ,  H05K2201/0344 ,  H05K2201/098 ,  H05K2203/1184

Abstract: A printed wiring board includes a resin insulating layer having recess portions formed on first surface, a first conductor layer formed in the recess portions and including pads positioned to mount an electronic component, conductive pillars formed on the pads, respectively, and formed to mount the electronic component onto the resin insulating layer, a second conductor layer formed on second surface of the resin insulating layer on the opposite side with respect to the first surface, and a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer and connecting the first and second conductor layers. The pillars is formed such that each of the pads has an exposed surface exposed from a respective one of the conductive pillars, and the pads are formed such that the exposed surface is recessed from the first surface of the resin insulating layer.

Abstract translation: 印刷电路板包括具有形成在第一表面上的凹部的树脂绝缘层，形成在凹部中的第一导体层，并且包括分别安装电子部件的焊盘，形成在焊盘上的导电柱，并形成为安装 电子部件到树脂绝缘层上，在相对于第一表面的相对侧的树脂绝缘层的第二表面上形成的第二导体层和形成在树脂绝缘层中的通孔导体，使得通孔导体穿透 树脂绝缘层并连接第一和第二导体层。 柱形成为使得每个焊盘具有从相应的一个导电柱露出的暴露表面，并且焊盘被形成为使得暴露的表面从树脂绝缘层的第一表面凹陷。