公开(公告)号：US10418291B2

公开(公告)日：2019-09-17

申请号：US15720499

申请日：2017-09-29

Applicant: Intel Corporation

Inventor： Jerrod Peterson ,  David Pidwerbecki

IPC: H01L21/66 ,  H01L23/34 ,  H01L21/02 ,  H01L23/36 ,  H01L23/42 ,  H01L23/433

Abstract: Particular embodiments described herein provide for a silicon layer, where the silicon layer includes a profile and a thermal conductor coupled to the silicon layer, where the thermal conductor includes one or more residual stresses. The thermal conductor is modified based on the one or more residual stress such that when pressure is applied to the thermal conductor, a profile of the thermal conductor at least approximately matches the profile of the silicon layer. In an example, the thermal conductor is modified by removing material from one or more areas of the thermal conductor and the thermal conductor is coupled to the silicon layer by one or more pressure inducing mechanisms.

公开(公告)号：US20190040554A1

公开(公告)日：2019-02-07

申请号：US15860553

申请日：2018-01-02

Applicant: Intel Corporation

Inventor： David Pidwerbecki ,  Mark MacDonald

IPC: D03D1/00

Abstract: Heat spreading cloths, associated devices, systems, and methods can include a plurality of attached polymeric fibers that are thermally conductive and electrically insulative. The heat spreading cloth can be configured to couple an electronic component thereto in a heat spreading relationship.

公开(公告)号：US09980412B2

公开(公告)日：2018-05-22

申请号：US15280746

申请日：2016-09-29

Applicant: Intel Corporation

Inventor： Bo Qiu ,  Xi Guo ,  James C. Raupp ,  Michael Ahrens ,  David Pidwerbecki ,  Steven J. Lofland ,  George H. Daskalakis ,  Stacy L. Yee ,  Mark MacDonald

IPC: H05K7/20 ,  G06F1/16 ,  H05K5/00 ,  H05K5/02 ,  G06F1/20 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K7/20509 ,  G06F1/1681 ,  G06F1/203 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/181 ,  H05K5/0017 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20963 ,  H05K2201/066

Abstract: Apparatuses, systems and methods associated with flexible heat spreader design are disclosed herein. In embodiments, an electronic device may include a component, a heat dissipation member, and a flexible member. The heat dissipation member may be coupled to the component via a flexible portion of the electronic device, the component located on a first side of the flexible portion and the heat dissipation member located on a second side of the flexible portion. The flexible member may be thermally coupled to the component and the heat dissipation member, wherein the flexible member extends along the flexible portion from the first side to the second side and is to transfer heat from the component to the heat dissipation member. Other embodiments may be described and/or claimed.

公开(公告)号：US09971382B2

公开(公告)日：2018-05-15

申请号：US15201097

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Michael Ahrens ,  George H. Daskalakis ,  Steven J. Lofland ,  David Pidwerbecki ,  Bo Qiu ,  James C. Raupp ,  Stacy L. Yee

IPC: G06F1/16 ,  E05D3/02 ,  H05K5/02 ,  H04M1/02

CPC classification number: G06F1/1652 ,  E05D3/022 ,  E05Y2900/606 ,  G06F1/1616 ,  G06F1/1641 ,  G06F1/1681 ,  H04M1/0214 ,  H04M1/0247 ,  H04M1/0268 ,  H04M2250/16 ,  H05K5/0226

Abstract: Systems, methods and apparatuses may provide for a flexible display assembly including a flexible display and a backplane coupled to the flexible display, wherein at least a portion of the backplane comprises a super elastic sheet. In one example, the backplane includes a first rigid sheet metal portion and a second rigid sheet metal portion, wherein the super-elastic sheet is joined between the first and second rigid sheet metal portions.

公开(公告)号：USD810031S1

公开(公告)日：2018-02-13

申请号：US29503589

申请日：2014-09-26

Applicant: INTEL CORPORATION

Designer： Mark Sprenger ,  Russell Aoki ,  David Pidwerbecki

公开(公告)号：US20170025828A1

公开(公告)日：2017-01-26

申请号：US15144069

申请日：2016-05-02

Applicant: Intel Corporation

Inventor： Johan Ploeg ,  David Pidwerbecki

IPC: H01T23/00 ,  H05K7/20 ,  G06F1/20

CPC classification number: H01T23/00 ,  G06F1/203 ,  H05K7/20 ,  H05K7/20136

Abstract: In one embodiment an ionic airflow system comprises an anode, a cathode platform having an elongated surface, and a first ultrasonic transducer to direct ultrasonic waves into the cathode platform. Other embodiments may be described.

Abstract translation: 在一个实施例中，离子气流系统包括阳极，具有细长表面的阴极平台和用于将超声波引导到阴极平台中的第一超声换能器。 可以描述其他实施例。

公开(公告)号：US09451716B1

公开(公告)日：2016-09-20

申请号：US14752927

申请日：2015-06-27

Applicant: Intel Corporation

Inventor： Mark E. Sprenger ,  Ralph V. Miele ,  David Pidwerbecki ,  Kenan Huseyin Arik

IPC: G06F1/16 ,  H05K5/02 ,  H05K5/00 ,  H05K5/03

CPC classification number: H05K5/0221 ,  G06F1/1656 ,  H05K5/0004

Abstract: Particular embodiments described herein provide for a serviceable chassis. The serviceable chassis can include a first housing and a second housing. The first housing includes a locking arm. The second housing can include a locking cam and a cord. The cord is attached to the locking cam and can rotate the locking cam to engage and disengage the locking arm to couple and uncouple the first housing to the second housing.

Abstract translation: 本文所描述的特定实施例提供了可服务的底盘。 可使用的底盘可以包括第一壳体和第二壳体。 第一壳体包括锁定臂。 第二壳体可以包括锁定凸轮和绳索。 绳索连接到锁定凸轮并且可以旋转锁定凸轮以接合和解除锁定臂以将第一壳体联接和分离到第二壳体。