公开(公告)号：US20200159295A1

公开(公告)日：2020-05-21

申请号：US16658827

申请日：2019-10-21

Applicant: Intel Corporation

Inventor： Aleksander Magi ,  Mark J. Gallina ,  Catharina Biber ,  Xi Guo ,  Gabriele C. Garbarino

IPC: G06F1/20 ,  G06F1/16

Abstract: The present techniques are related a dock with a cooling solution. The performance dock includes a thermoelectric device, an alignment mechanism, and an air mover. The alignment mechanism is to align the computing device when docking the computing device, and the thermoelectric device is to cool the computing device when docked, and the air mover is to enable an airflow through the dock to cool the thermoelectric device when the computing device is docked.

公开(公告)号：US20190011962A1

公开(公告)日：2019-01-10

申请号：US15924796

申请日：2018-03-19

Applicant: Intel Corporation

Inventor： Aleksander Magi ,  Mark J. Gallina ,  Catharina Biber ,  Xi Guo ,  Gabriele C. Garbarino

IPC: G06F1/20 ,  G06F1/16

CPC classification number: G06F1/20 ,  G06F1/1632

Abstract: The present techniques are related a dock with a cooling solution. The performance dock includes a thermoelectric device, an alignment mechanism, and an air mover. The alignment mechanism is to align the computing device when docking the computing device, and the thermoelectric device is to cool the computing device when docked, and the air mover is to enable an airflow through the dock to cool the thermoelectric device when the computing device is docked.

公开(公告)号：US11073876B2

公开(公告)日：2021-07-27

申请号：US16658827

申请日：2019-10-21

Applicant: Intel Corporation

Inventor： Aleksander Magi ,  Mark J. Gallina ,  Catharina Biber ,  Xi Guo ,  Gabriele C. Garbarino

IPC: G06F1/20 ,  G06F1/16

Abstract: The present techniques are related a dock with a cooling solution. The performance dock includes a thermoelectric device, an alignment mechanism, and an air mover. The alignment mechanism is to align the computing device when docking the computing device, and the thermoelectric device is to cool the computing device when docked, and the air mover is to enable an airflow through the dock to cool the thermoelectric device when the computing device is docked.

公开(公告)号：US20170185112A1

公开(公告)日：2017-06-29

申请号：US14998063

申请日：2015-12-24

Applicant: INTEL CORPORATION

Inventor： Aleksander Magi ,  Mark J. Gallina ,  Catharina Biber ,  Xi Guo ,  Gabriele C. Garbarino

IPC: G06F1/20 ,  G06F1/16

CPC classification number: G06F1/20 ,  G06F1/1632

Abstract: The present techniques are related a dock with a cooling solution. The performance dock includes a thermoelectric device, an alignment mechanism, and an air mover. The alignment mechanism is to align the computing device when docking the computing device, and the thermoelectric device is to cool the computing device when docked, and the air mover is to enable an airflow through the dock to cool the thermoelectric device when the computing device is docked.

公开(公告)号：US11587844B2

公开(公告)日：2023-02-21

申请号：US16306884

申请日：2016-07-02

Applicant: Intel Corporation

Inventor： Eng Huat Goh ,  Jiun Hann Sir ,  Min Suet Lim ,  Xi Guo

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/498 ,  H01L25/065

Abstract: Electronic device package on package (POP) technology is disclosed. A POP can comprise a first electronic device package including a heat source. The POP can also comprise a second electronic device package disposed on the first electronic device package. The second electronic device package can include a substrate having a heat transfer portion proximate the heat source that facilitates heat transfer from the heat source through a thickness of the substrate. The substrate can also have an electronic component portion at least partially about the heat transfer portion that facilitates electrical communication. In addition, the POP can comprise an electronic component operably coupled to the electronic component portion.

公开(公告)号：US20210035880A1

公开(公告)日：2021-02-04

申请号：US16306884

申请日：2016-07-02

Applicant: Intel Corporation

Inventor： Eng Huat Goh ,  Jiun Hann Sir ,  Min Suet Lim ,  Xi Guo

IPC: H01L23/367 ,  H01L23/498 ,  H01L25/065 ,  H01L21/48

Abstract: Electronic device package on package (POP) technology is disclosed. A POP can comprise a first electronic device package including a heat source. The POP can also comprise a second electronic device package disposed on the first electronic device package. The second electronic device package can include a substrate having a heat transfer portion proximate the heat source that facilitates heat transfer from the heat source through a thickness of the substrate. The substrate can also have an electronic component portion at least partially about the heat transfer portion that facilitates electrical communication. In addition, the POP can comprise an electronic component operably coupled to the electronic component portion.

公开(公告)号：US10452108B2

公开(公告)日：2019-10-22

申请号：US15924796

申请日：2018-03-19

Applicant: Intel Corporation

Inventor： Aleksander Magi ,  Mark J. Gallina ,  Catharina Biber ,  Xi Guo ,  Gabriele C. Garbarino

IPC: G06F1/20 ,  G06F1/16

Abstract: The present techniques are related a dock with a cooling solution. The performance dock includes a thermoelectric device, an alignment mechanism, and an air mover. The alignment mechanism is to align the computing device when docking the computing device, and the thermoelectric device is to cool the computing device when docked, and the air mover is to enable an airflow through the dock to cool the thermoelectric device when the computing device is docked.

公开(公告)号：US09921618B2

公开(公告)日：2018-03-20

申请号：US14998063

申请日：2015-12-24

Applicant: INTEL CORPORATION

Inventor： Aleksander Magi ,  Mark J. Gallina ,  Catharina Biber ,  Xi Guo ,  Gabriele C. Garbarino

IPC: G06F1/20 ,  G06F1/16

CPC classification number: G06F1/20 ,  G06F1/1632

Abstract: The present techniques are related a dock with a cooling solution. The performance dock includes a thermoelectric device, an alignment mechanism, and an air mover. The alignment mechanism is to align the computing device when docking the computing device, and the thermoelectric device is to cool the computing device when docked, and the air mover is to enable an airflow through the dock to cool the thermoelectric device when the computing device is docked.

公开(公告)号：US09980412B2

公开(公告)日：2018-05-22

申请号：US15280746

申请日：2016-09-29

Applicant: Intel Corporation

Inventor： Bo Qiu ,  Xi Guo ,  James C. Raupp ,  Michael Ahrens ,  David Pidwerbecki ,  Steven J. Lofland ,  George H. Daskalakis ,  Stacy L. Yee ,  Mark MacDonald

IPC: H05K7/20 ,  G06F1/16 ,  H05K5/00 ,  H05K5/02 ,  G06F1/20 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K7/20509 ,  G06F1/1681 ,  G06F1/203 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/181 ,  H05K5/0017 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20963 ,  H05K2201/066

Abstract: Apparatuses, systems and methods associated with flexible heat spreader design are disclosed herein. In embodiments, an electronic device may include a component, a heat dissipation member, and a flexible member. The heat dissipation member may be coupled to the component via a flexible portion of the electronic device, the component located on a first side of the flexible portion and the heat dissipation member located on a second side of the flexible portion. The flexible member may be thermally coupled to the component and the heat dissipation member, wherein the flexible member extends along the flexible portion from the first side to the second side and is to transfer heat from the component to the heat dissipation member. Other embodiments may be described and/or claimed.