Abstract:
A sensor arrangement according to an embodiment includes a board with a plurality of conductive lines of a first type, and a plurality of conductive lines of a second type different from the conductive lines of the first type, and a recess. The sensor arrangement further includes a plurality of sensor devices mechanically accommodated on a main surface of the board and arranged around the recess, each sensor device being electrically coupled to the conductive lines of the first type and at least to one of the conductive lines of the second type, wherein each conductive line of the second type electrically couples a sensor device with at least one other item different from the sensor devices of the plurality of sensor devices. A projection of the conductive lines of the first and second types perpendicular to the main surface is crossing-free. Each conductive line of the first type electrically couples at least all of the plurality of sensor devices.
Abstract:
A magnetic field current sensor including a die having at least one magnetic field sensing element; a plurality of contacts disposed in a first plane and coupled to the die; a conductor comprising first and second contact portions, the first and second contacts electrically coupled and disposed in a second plane different from the first plane, and the conductor coupled to and electrically isolated from the die; and a mold body enclosing the die, the plurality of contacts, and the first and second contact portions.
Abstract:
Embodiments relate to magnetic field angle sensors that utilize axial and perpendicular sensors collectively to infer a rotational angle. In embodiments, a sensor system comprises at least one axial sensor unit and at least one perpendicular sensor unit arranged in a single sensor package or on a single substrate. The axial and perpendicular sensor data both representative of the rotational position can be used to improve output angle accuracy by, e.g., calibrating the sensor system.
Abstract:
Embodiments relate to stress sensors and methods of sensing stress. In an embodiment, a stress sensor comprises a vertical resistor. The vertical resistor can comprise, for example, an n-type resistor and can have various operating modes. The various operating modes can depend on a coupling configuration of terminals of the resistor and can provide varying piezo-coefficients with very similar temperature coefficients of resistances. Comparisons of resistances and piezo-coefficients in differing operating modes can provide a measure of mechanical stresses acting on the device.
Abstract:
A resistive element includes a resistive region in a semiconductor substrate, a first contact structure and a second contact structure. The semiconductor substrate includes a first main surface area. The resistive region extends in a lateral direction parallel to the main surface area and in a vertical direction perpendicular to the main surface area, and includes a first piezo-resistive coefficient for a current flow in the lateral direction and a second piezo-resistive coefficient for a current flow in the vertical direction. The first contact structure contacts a portion of a first face of the resistive region and the second contact structure contacts a portion of a second face of the resistive region. The resistive element generates a current flow distribution within the resistive region having a lateral component and a vertical component that results in a piezo-resistive coefficient of the resistive element.
Abstract:
One embodiment of the present invention relates to a vertical Hall-effect device. The device includes at least two supply terminals arranged to supply electrical energy to the first Hall-effect region; and at least one Hall signal terminal arranged to provide a first Hall signal from the first Hall-effect region. The first Hall signal is indicative of a magnetic field which is parallel to the surface of the semiconductor substrate and which acts on the first Hall-effect region. One or more of the at least two supply terminals or one or more of the at least one Hall signal terminal comprises a force contact and a sense contact.
Abstract:
Embodiments relate to magnetic field angle sensing systems and methods. In an embodiment, a magnetic field angle sensing system configured to determine a rotational position of a magnetic field source around an axis, comprises N sensor devices arranged in a circle concentric to an axis, wherein N>1 and the sensor devices are spaced apart from one another by about (360/N) degrees along the circle, each sensor device comprising a magnetic field sensing device having a sensitivity plane comprising at least one reference direction of the magnetic field sensing device, wherein the magnetic field sensing device is sensitive to a magnetic field component in the sensitivity plane and configured to provide a signal related to a (co)sine of an angle between the reference direction and the magnetic field in the sensitivity plane; and circuitry coupled to the N sensor devices and configured to provide a signal indicative of a rotational position of a magnetic field source around the axis determined by combining the signals from the magnetic field sensing devices of the N sensor devices.
Abstract:
A vertical Hall effect sensor having three Hall effect regions interconnected in a ring can be operated in a spinning scheme. Each Hall effect region has three contacts: the first Hall effect region includes first, second, and third contacts; the second Hall effect region has fourth, fifth, and sixth contacts, and the third Hall effect region has seventh, eighth, and ninth contacts. Interconnections between the Hall effect regions are provided such that a first terminal is connected to a third contact, a second interconnection is arranged between the second and fourth contacts, a third terminal is connected to the sixth contact, a fourth interconnection is arranged between the fifth and seventh contacts, a fifth terminal is connected to the ninth contact, and a sixth interconnection is arranged between the first and eighth contacts.
Abstract:
Embodiments relate to systems and methods for reducing errors in sensor devices and systems. In embodiments, the sensor devices comprise magnetic field sensor devices, such as ordinary or vertical Hall sensor devices, and the error to be reduced is a residual offset error, though in other embodiments other sensor devices can be used and/or other types of errors can be targeted for reduction or elimination. In one embodiment, at least two such sensor devices not electrically coupled with one another are sequentially operated in a spinning current-type mode such that an individual output signal from each of the at least two sensor devices is obtained. A total output signal can then be calculated, such as by averaging or otherwise combining the individual output signals from each sensor device.
Abstract:
Vertical Hall device with highly conductive node for electrically connecting first and second Hall effect regions. A vertical Hall device comprises a first Hall effect region and a different second Hall effect region, both in a common semiconductor body. The first and second Hall effect regions have a main face and an opposite face, respectively. A highly conductive opposite face node is in ohmic contact to the opposite face of the first Hall effect region and the opposite face of the second Hall effect region in the semiconductor body. The vertical Hall device also comprises a first pair of contacts in or at the main face of the first Hall effect region and a second pair of contacts in or at the main face of the second Hall effect region. A convex circumscribing contour of the second pair of contacts is disjoint from a convex circumscribing contour of the first pair of contacts. Alternative embodiments comprise a pair of contacts and an opposite face node contact.