公开(公告)号：US06297078B1

公开(公告)日：2001-10-02

申请号：US09001636

申请日：1997-12-31

Applicant: Michael Barrow

Inventor： Michael Barrow

IPC: H01L2144

CPC classification number: H01L24/06 ,  H01L21/565 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/06179 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49179 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An integrated circuit package which has an integrated circuit mounted to a substrate. The package includes a plurality of bond wires that couple bond pads of the integrated circuit to corresponding bond pads of the substrate. The bond wires may have an essentially uniform bond wire density about an entire outer perimeter of the integrated circuit including the corners of the circuit. The integrated circuit and bond wires are enclosed by an injected molded plastic housing. It is believed that the bond wires located at the corners impede the flow of the injected plastic and reduce the amount of wire sweep in the package from packages in the prior art. Additionally, the essentially uniform bond wire density may create a uniform fluidic resistance to the injected plastic. The uniform resistance also reduces the amount of wire sweep from packages in the prior art. The bond wires located at the corners may be dummy wires that are not electrically connected to the integrated circuit.

Abstract translation: 一种集成电路封装，其具有安装到基板的集成电路。 封装包括将集成电路的焊盘耦合到衬底的相应接合焊盘的多个接合线。 接合线可以围绕包括电路的拐角的集成电路的整个外周边具有基本均匀的接合线密度。 集成电路和接合线被注入的模制塑料外壳封闭。 据信，位于角落处的接合线阻止注入的塑料的流动并且减少了现有技术中的封装中的封装中的电线扫描量。 另外，基本上均匀的粘合线密度可以产生对注入的塑料的均匀的流体阻力。 均匀的电阻也减少了现有技术中的封装线的扫线量。 位于拐角处的接合线可以是不与集成电路电连接的虚拟线。

公开(公告)号：US06255135B1

公开(公告)日：2001-07-03

申请号：US09179014

申请日：1998-10-26

Applicant: Michael Barrow

Inventor： Michael Barrow

IPC: H01L2144

CPC classification number: H05K1/181 ,  H01L23/49568 ,  H01L25/105 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/181 ,  H05K1/0203 ,  H05K2201/10446 ,  H05K2201/10545 ,  H05K2201/10689 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A quad flat pack (QFP) integrated circuit package that is modified to include a tab that increases the thermal efficiency of the package. The package contains an integrated circuit that is mounted to a die paddle of a lead frame. A plurality of leads extend from a first side of the die paddle. Placing all of the leads on one side of the package minimizes the difference in signal length between the leads. The tab extends from a second side of the die paddle. Both the leads and the tab extend from a plastic housing which encapsulates the integrated circuit. The tab provides a large conductive area which increases the heat transfer rate from the integrated circuit to the ambient, or an external thermal element.

Abstract translation: 一种四平面封装（QFP）集成电路封装，经修改，包括一个提升封装热效率的接头。 该封装包含一个集成电路，该电路安装在引线框架的裸片上。 多个引线从芯片的第一侧延伸。 将封装的一侧放置所有引线可以最大限度地减少引线之间信号长度的差异。 突片从模片桨的第二侧延伸。 引线和突片均从封装集成电路的塑料外壳延伸。 该突片提供了大的导电区域，其增加了从集成电路到环境的热传递速率或外部热元件。

公开(公告)号：US5812379A

公开(公告)日：1998-09-22

申请号：US696058

申请日：1996-08-13

Applicant: Michael Barrow

Inventor： Michael Barrow

IPC: H01L21/60 ,  H01L23/538 ,  H01R12/04 ,  H05K1/11 ,  H05K3/34 ,  H01R9/09 ,  H05K7/06

CPC classification number: H01L24/81 ,  H01L23/5386 ,  H05K1/111 ,  H05K3/3436 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15173 ,  H05K2201/10734 ,  H05K2203/0465 ,  Y02P70/611 ,  Y02P70/613

Abstract: A solder joint interface which includes a plurality of solder balls that attach an integrated circuit package to corresponding pads of a printed circuit board. The solder pads are on a 0.05 inch pitch and have a diameter of 0.02 inches so that two 0.006 inch routing traces can be routed between adjacent pads of the circuit board. The additional routing traces allow the solder pads to be arranged in a pattern that has five rows of solder pads. The solder balls have pre-assembled diameters of 0.030 inches and a final height of 0.02 inches. The relatively tall solder joints function as structural beams that undergo both shear and moment stresses when an external load is applied to the joints. The moment component produces lower solder stresses and improves the structural integrity of the solder joints.

Abstract translation: 一种焊接界面，其包括将集成电路封装连接到印刷电路板的相应焊盘的多个焊球。 焊盘的间距为0.05英寸，直径为0.02英寸，因此可以在电路板的相邻焊盘之间布置两个0.006英寸的布线迹线。 附加布线迹线允许焊盘以具有五排焊盘的图案布置。 焊球的预组装直径为0.030英寸，最终高度为0.02英寸。 相对较高的焊接接头用作结构梁，当外部负载施加到接头时，其结合梁同时承受剪切力和力矩应力。 瞬间组件产生较低的焊料应力，并提高了焊点的结构完整性。