公开(公告)号：US20240357746A1

公开(公告)日：2024-10-24

申请号：US18326031

申请日：2023-05-31

Applicant: INNODISK CORPORATION

Inventor： CHIH-CHIEH KAO

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10628

Abstract: A high capacitance module for electrically connecting to a second circuit board comprises a first circuit board provided with a plurality of metal contacts and at least one capacitor core arranged on the first circuit board. The capacitor cores have connection pins that are electrically connected to the metal contacts through conductive glue. An adhesive layer covers the capacitor cores. The capacitor cores are electrically connected to a memory module arranged on the second circuit board.

公开(公告)号：US20240292581A1

公开(公告)日：2024-08-29

申请号：US18044687

申请日：2022-08-22

Applicant: Honor Device Co., Ltd.

Inventor： Jianqiang Guo ,  Wenjun Luo ,  Jun Li

IPC: H05K9/00 ,  H05K1/14 ,  H05K1/18

CPC classification number: H05K9/0032 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/10371 ,  H05K2201/10545

Abstract: Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes: a first circuit board and a second circuit board stacked with the first circuit board, where the first circuit board is provided with a first shielding frame on a surface facing toward the second circuit board, the second circuit board is provided with a second shielding frame on a surface facing toward the first circuit board, and opposite end portions of the first shielding frame and the second shielding frame are connected to a shared shielding cover, so that the shared shielding cover, the first shielding frame, and the second shielding frame enclose a shielding cavity.

公开(公告)号：US20240260193A1

公开(公告)日：2024-08-01

申请号：US18102394

申请日：2023-01-27

Applicant: Intel Corporation

Inventor： Herh Nan Chen ,  Kean Huat Leong ,  Sze Lin Mak ,  Muhammad Danial Asyraf Abd Rahman

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/14 ,  H05K3/34

CPC classification number: H05K1/181 ,  H05K1/115 ,  H05K1/144 ,  H05K1/145 ,  H05K3/3415 ,  H05K3/3431 ,  H05K2201/042 ,  H05K2201/096 ,  H05K2201/10015 ,  H05K2201/10545 ,  H05K2201/10636

Abstract: Microelectronic devices and systems include a decoupling capacitor module having any number of capacitors attached to a surface of a substrate such as a cored or coreless microelectronics board. The decoupling capacitor module is attached, by an opposing surface of the substrate, to a number of capacitors that are, in turn, mounted on a board such as a motherboard. Substrate mounted capacitors are vertically aligned with corresponding board mounted capacitors to provide vertically stacked capacitors.

公开(公告)号：US12035460B2

公开(公告)日：2024-07-09

申请号：US18056187

申请日：2022-11-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tarou Higuchi ,  Yoshihiro Imanishi ,  Hiroyuki Honda ,  Akiko Sakane

IPC: H05K1/02

CPC classification number: H05K1/0233 ,  H05K2201/093 ,  H05K2201/09427 ,  H05K2201/1003 ,  H05K2201/10545

Abstract: A mounting structure for mounting inductors to suppress cross talk and a stub effect due to a mounting land, and reduce deterioration of signal transmission characteristics. A first Bias-T inductor is mounted on a circuit board with one electrode terminal connected to a first mounting land with an axial direction of the first Bias-T inductor oriented perpendicular to the first mounting land and the one electrode terminal extends along the first mounting land. A second Bias-T inductor is mounted on the circuit board in the vicinity of the first Bias-T inductor with one electrode terminal connected to a second mounting land with an axial direction of the second Bias-T inductor inclined by 90° with respect to the axial direction of the first Bias-T inductor and the second Bias-T inductor is oriented perpendicular to the second mounting land and the one electrode terminal extends along the second mounting land.

公开(公告)号：US12022619B2

公开(公告)日：2024-06-25

申请号：US18309413

申请日：2023-04-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong-Hyun Seok ,  Gyu Chae Lee ,  Jeong Hyeon Cho

IPC: H05K1/18 ,  H01L25/18 ,  H05K1/11

CPC classification number: H05K1/181 ,  H01L25/18 ,  H05K1/117 ,  H05K2201/09227 ,  H05K2201/09509 ,  H05K2201/10159 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10734

Abstract: A semiconductor chip module includes a PCB including first and second faces; a buffer on the first face; a first chip on the first face, and including a first connection terminal and a second connection terminal, a first signal being provided to the first connection terminal, and a second signal being provided to the second connection terminal; a second chip on the second face, and including a third connection terminal to which the first signal is provided, and a fourth connection terminal to which the second signal is provided. The first connection terminal and the third connection terminal receive the first signal from the buffer at the same time. The first connection terminal is closer to the buffer as compared with the second connection terminal. The third connection terminal is closer to the buffer as compared with the fourth connection terminal.

公开(公告)号：US20240080972A1

公开(公告)日：2024-03-07

申请号：US18460327

申请日：2023-09-01

Applicant: CANON KABUSHIKI KAISHA

Inventor： YASUHIRO KOZUKA

IPC: H05K1/02 ,  H01L23/538 ,  H01L25/16

CPC classification number: H05K1/0295 ,  H01L23/5386 ,  H01L25/16 ,  H02M3/155 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2201/10545

Abstract: A circuit board on which a first set or a second set is exclusively mounted includes an IC attachment part, first and second attachment parts, and first, second, and third conductor patterns. The first set includes a first integrated circuit and a first electric element, and the second set including a second integrated circuit and a second electric element. The first attachment part includes first and second pads, and the second attachment part includes third and fourth pads. In a case where the first electric element is not mounted, the first pad and the second pad of the first attachment part are opened so as not to be electrically conductive with each other. In a case where the second electric element is not mounted, the third pad of the second attachment part and the second pad are opened so as not to be electrically conductive with each other.

公开(公告)号：US20240030096A1

公开(公告)日：2024-01-25

申请号：US18183702

申请日：2023-03-14

Applicant: Qorvo US, Inc.

Inventor： Ke Zhu

IPC: H01L23/40 ,  H01L25/11 ,  H05K1/18 ,  H05K7/20 ,  H02M3/158

CPC classification number: H01L23/4012 ,  H01L25/112 ,  H05K1/18 ,  H05K7/209 ,  H02M3/158 ,  H01L2023/4031 ,  H01L2023/4068 ,  H01L2023/4087 ,  H05K2201/10272 ,  H05K2201/10166 ,  H05K2201/09063 ,  H05K2201/10393 ,  H05K2201/10545

Abstract: This disclosure relates to a cooling apparatus and a method for cooling semiconductor devices, wherein the cooling apparatus is disposed over a top surface and a bottom surface of a printed circuit board. The disclosed cooling apparatus comprises a printed circuit board, a first semiconductor device comprising a first thermal pad and mounted on a top surface of the printed circuit, a second semiconductor device comprising a second thermal pad and mounted on a bottom surface of the printed circuit, a first heat sink, a first thermal interface structure thermally coupled between the first thermal pad and the first heat sink, a second heat sink, and a second thermal interface structure thermally coupled between the second thermal pad and the second heat sink.

公开(公告)号：US11825603B2

公开(公告)日：2023-11-21

申请号：US17339595

申请日：2021-06-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tomomi Yasuda

IPC: H05K1/11 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00 ,  H01L25/18 ,  H05K1/18

CPC classification number: H05K1/119 ,  H01L23/13 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/17 ,  H01L25/18 ,  H05K1/181 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/17135 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10545

Abstract: A high-frequency module (1) includes a substrate (10), a first electronic component (30) and a second electronic component (40) mounted on a main surface (10a) of the substrate (10). The substrate (10) has a protruding portion (20) projecting from the main surface (10a), the first electronic component (30) is mounted in a region of the main surface (10a) different from a region in which the protruding portion (20) is provided, and the second electronic component (40) is mounted on the protruding portion (20).

公开(公告)号：US11792917B2

公开(公告)日：2023-10-17

申请号：US17694070

申请日：2022-03-14

Applicant: CANON KABUSHIKI KAISHA

Inventor： Takuya Kondo ,  Takashi Numagi ,  Nobuaki Yamashita

IPC: H05K1/02 ,  H01L25/16 ,  H05K1/14

CPC classification number: H05K1/0231 ,  H01L25/162 ,  H05K1/0225 ,  H05K1/148 ,  H05K2201/09227 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10015 ,  H05K2201/10378 ,  H05K2201/10545

Abstract: An electronic module includes a first semiconductor device disposed on a first main surface of an insulating board of a printed wiring board, a first capacitor disposed on a second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in a direction perpendicular to the first main surface, and a second capacitor disposed on the second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in the direction perpendicular to the first main surface. A second electrode of the first capacitor is electrically connected to a ground pattern via a first ground via of the printed wiring board. A fourth electrode of the second capacitor is electrically connected to the ground pattern via a second ground via of the printed wiring board.

公开(公告)号：US11766563B2

公开(公告)日：2023-09-26

申请号：US17881589

申请日：2022-08-04

Applicant: Pulse Biosciences, Inc.

Inventor： Chaofeng Huang ,  Gregory P. Schaadt ,  Kenneth R. Krieg

IPC: H01F27/28 ,  A61N1/36 ,  A61N1/04 ,  H01F27/24 ,  H03K3/353 ,  H05K1/18

CPC classification number: A61N1/36034 ,  A61N1/0472 ,  H01F27/24 ,  H01F27/2823 ,  H03K3/353 ,  H05K1/181 ,  H01F2027/2833 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10545

Abstract: Described herein are apparatuses and methods for applying high voltage, sub-microsecond (e.g., nanosecond range) pulsed output to a biological material, e.g., tissues, cells, etc., using a high voltage (e.g., MOSFET) gate driver circuit having a high voltage isolation and a low inductance. In particular, described herein are multi-core pulse transformers comprising independent transformer cores arranged in parallel on opposite sides of a substrate. The transformer cores may have coaxial primary and secondary windings. Also describe are pulse generators including multi-core pulse transformers arranged in parallel (e.g., on opposite sides of a PCB) to reduce MOSFET driver gate inductance.