公开(公告)号：US08228075B2

公开(公告)日：2012-07-24

申请号：US12388826

申请日：2009-02-19

Applicant: Yuya Dokai ,  Noboru Kato

Inventor： Yuya Dokai ,  Noboru Kato

IPC: G01R31/02

CPC classification number: G01R1/06788 ,  G01R1/06772 ,  G01R31/2822 ,  G06K19/0722

Abstract: A test system for a radio frequency IC device includes a radio frequency IC chip and a radiation strip. The characteristics of the radio frequency IC device are measured by bringing the tip of a probe of a test apparatus in direct contact with a portion of the radiation strip and thereby providing a radio frequency signal. The tip of the probe is made to be a flat plate so as to obtain closer and more stable contact with the radiation strip.

Abstract translation: 射频IC器件的测试系统包括射频IC芯片和辐射条。 通过使测试装置的探针的尖端与辐射带的一部分直接接触，从而提供射频信号来测量射频IC器件的特性。 将探针的尖端制成平板，以便与辐射带获得更接近和更稳定的接触。

公开(公告)号：US20120169553A1

公开(公告)日：2012-07-05

申请号：US13419454

申请日：2012-03-14

Applicant: Masato Nomura ,  Noboru Kato ,  Yuya Dokai

Inventor： Masato Nomura ,  Noboru Kato ,  Yuya Dokai

IPC: H01Q11/12

CPC classification number: H01Q7/00 ,  H01Q1/38 ,  H01Q5/371

Abstract: An antenna includes two feeding points, and includes a loop-shaped loop electrode and an auxiliary electrode electrically connected to the loop electrode and located at a position along the outer circumference of the loop electrode. The first end portion of the auxiliary electrode is electrically connected to the vicinity of one feeding point of the loop electrode. The second end portion of the auxiliary electrode is open. A resonant circuit is defined by the auxiliary electrode and the loop electrode to enhance the impedance of the antenna, compared with a case in which the antenna is configured using the simple loop electrode, and it is easy to achieve impedance matching with the wireless IC.

Abstract translation: 天线包括两个馈电点，并且包括环形环电极和辅助电极，其电连接到环形电极并位于沿着环形电极的外圆周的位置处。 辅助电极的第一端部电连接到环形电极的一个馈电点附近。 辅助电极的第二端部是开放的。 与使用简单环形电极配置天线的情况相比，辅助电极和环形电极限定了谐振电路，以增强天线的阻抗，并且容易实现与无线IC的阻抗匹配。

公开(公告)号：US08191791B2

公开(公告)日：2012-06-05

申请号：US13022695

申请日：2011-02-08

Applicant: Nobuo Ikemoto ,  Satoshi Ishino ,  Yuya Dokai ,  Noboru Kato ,  Takeshi Kataya ,  Ikuhei Kimura ,  Mikiko Tanaka

Inventor： Nobuo Ikemoto ,  Satoshi Ishino ,  Yuya Dokai ,  Noboru Kato ,  Takeshi Kataya ,  Ikuhei Kimura ,  Mikiko Tanaka

IPC: G06K19/06

CPC classification number: H01Q1/243 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1531 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/28 ,  H03H7/38 ,  H03H2007/386 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/141 ,  H05K1/165 ,  H05K2201/10098 ,  H01L2924/00012

Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.

Abstract translation: 小型化的无线IC器件允许无线IC的简单且低成本的安装，并且消除了由静电引起的对无线IC的损害的可能性，并且配备有无线IC器件的电子设备包括无线 处理发送和接收信号的IC芯片，以及包括具有电感元件的谐振电路的馈电电路基板。 馈电电极设置在馈电电路基板的表面上，并与谐振电路电磁耦合。 馈电电极并且电磁耦合到辐射板并提供给印刷线路板。 无线IC芯片由辐射板接收的信号激活，来自无线IC芯片的响应信号从辐射板向外辐射。

公开(公告)号：US07997501B2

公开(公告)日：2011-08-16

申请号：US12503188

申请日：2009-07-15

Applicant: Nobuo Ikemoto ,  Satoshi Ishino ,  Yuya Dokai ,  Noboru Kato ,  Takeshi Kataya ,  Ikuhei Kimura ,  Mikiko Tanaka

Inventor： Nobuo Ikemoto ,  Satoshi Ishino ,  Yuya Dokai ,  Noboru Kato ,  Takeshi Kataya ,  Ikuhei Kimura ,  Mikiko Tanaka

IPC: G06K19/06

CPC classification number: H01Q1/243 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1531 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/28 ,  H03H7/38 ,  H03H2007/386 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/141 ,  H05K1/165 ,  H05K2201/10098 ,  H01L2924/00012

Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.

Abstract translation: 小型化的无线IC器件允许无线IC的简单且低成本的安装，并且消除了由静电引起的对无线IC的损害的可能性，并且配备有无线IC器件的电子设备包括无线 处理发送和接收信号的IC芯片，以及包括具有电感元件的谐振电路的馈电电路基板。 馈电电极设置在馈电电路基板的表面上，并与谐振电路电磁耦合。 馈电电极并且电磁耦合到辐射板并提供给印刷线路板。 无线IC芯片由辐射板接收的信号激活，来自无线IC芯片的响应信号从辐射板向外辐射。

公开(公告)号：US07931206B2

公开(公告)日：2011-04-26

申请号：US12469896

申请日：2009-05-21

Applicant: Noboru Kato ,  Yuya Dokai ,  Nobuo Ikemoto

Inventor： Noboru Kato ,  Yuya Dokai ,  Nobuo Ikemoto

IPC: G06K19/06

CPC classification number: H01Q7/00 ,  G06K19/07749 ,  G06K19/07756 ,  H01Q1/2208

Abstract: A wireless IC device includes a radiation plate, a feeding circuit substrate on which a feeding circuit including a resonant circuit including an inductance element is provided, the feeding circuit being electromagnetically coupled to the radiation plate, and a wireless IC chip including a connection electrode, the wireless IC chip being disposed on the feeding circuit substrate. A mounting electrode is provided on the feeding circuit substrate. The frequency of signals sent and received using the radiation plate substantially corresponds to the resonant frequency of the resonant circuit. The wireless IC chip is electromagnetically coupled to the mounting electrode.

Abstract translation: 无线IC器件包括辐射板，馈电电路基板，其上设有包括电感元件的谐振电路的馈电电路，馈电电路与放射板电磁耦合;以及无线IC芯片，包括连接电极， 无线IC芯片设置在馈电电路基板上。 馈电电路基板上设有安装电极。 使用辐射板发送和接收的信号的频率基本上对应于谐振电路的谐振频率。 无线IC芯片电磁耦合到安装电极。

公开(公告)号：US07905421B2

公开(公告)日：2011-03-15

申请号：US12503188

申请日：2009-07-15

Applicant: Nobuo Ikemoto ,  Satoshi Ishino ,  Yuya Dokai ,  Noboru Kato ,  Takeshi Kataya ,  Ikuhei Kimura ,  Mikiko Tanaka

Inventor： Nobuo Ikemoto ,  Satoshi Ishino ,  Yuya Dokai ,  Noboru Kato ,  Takeshi Kataya ,  Ikuhei Kimura ,  Mikiko Tanaka

IPC: G06K19/06

Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.

公开(公告)号：US07764928B2

公开(公告)日：2010-07-27

申请号：US11930818

申请日：2007-10-31

Applicant: Yuya Dokai ,  Noboru Kato ,  Satoshi Ishino

Inventor： Yuya Dokai ,  Noboru Kato ,  Satoshi Ishino

IPC: H04B7/00 ,  H04B1/16

CPC classification number: H05K1/0243 ,  G06K19/07749 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/645 ,  H01L23/66 ,  H01L2223/665 ,  H01L2223/6677 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K1/0239 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/10098 ,  H05K2201/10727 ,  Y02D70/10

Abstract: A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.

Abstract translation: 无线IC器件包括无线IC芯片，安装有无线IC芯片的电源电路板，并且其中设置有电源电路，电源电路包括具有预定谐振频率的谐振电路，以及 辐射图案，其粘附到电源电路板的下侧，用于辐射从电源电路提供的传输信号，并且用于接收接收信号以将其提供给电源电路。 谐振电路是包括电感器件和电容器件的LC谐振电路。 电源电路板是多层刚性板或单层刚性板，无线IC芯片和辐射图之间通过直流连接，磁耦合或电容耦合连接。

公开(公告)号：US20090277967A1

公开(公告)日：2009-11-12

申请号：US12510347

申请日：2009-07-28

Applicant: Noboru Kato ,  Yuya Dokai ,  Nobuo Ikemoto

Inventor： Noboru Kato ,  Yuya Dokai ,  Nobuo Ikemoto

IPC: G06K19/06

CPC classification number: G06K19/07749 ,  G06K19/07758 ,  G06K19/07786

Abstract: A wireless IC device includes a radiating plate, a wireless IC chip, and a feeder circuit board, on which the wireless IC chip is mounted. The feeder circuit board includes a resonant circuit with an inductance element, and the resonant circuit is electromagnetically coupled with the radiating plate. The wireless IC chip is interposed between the radiating plate and the feeder circuit board.

Abstract translation: 无线IC器件包括安装无线IC芯片的辐射板，无线IC芯片和馈电电路板。 馈电电路板包括具有电感元件的谐振电路，并且谐振电路与辐射板电磁耦合。 无线IC芯片插在散热板和馈电电路板之间。

公开(公告)号：US08905316B2

公开(公告)日：2014-12-09

申请号：US13099392

申请日：2011-05-03

Applicant: Yuya Dokai ,  Nihei Kaishita ,  Hiroshi Nonogaki ,  Ryohei Goto ,  Takahiro Yamaguchi ,  Kazuyuki Ikeda

Inventor： Yuya Dokai ,  Nihei Kaishita ,  Hiroshi Nonogaki ,  Ryohei Goto ,  Takahiro Yamaguchi ,  Kazuyuki Ikeda

IPC: G06K19/06 ,  H01Q1/22 ,  G06K19/077 ,  H01Q1/38

CPC classification number: H01Q1/2283 ,  G06K19/07749 ,  H01Q1/38

Abstract: A wireless IC device includes a dielectric body, a metal pattern that is provided on a surface of the dielectric body and that defines a radiator, and a wireless IC element coupled to feeding portions of the metal pattern. A plurality of slits are provided on at least one surface of the dielectric body so as to provide flexibility for the dielectric body.

Abstract translation: 无线IC器件包括介电体，设置在电介质体的表面上并限定散热器的金属图案，以及耦合到金属图案的馈电部分的无线IC元件。 在电介质体的至少一个表面上设置多个狭缝，以提供电介质体的柔性。

公开(公告)号：US09123996B2

公开(公告)日：2015-09-01

申请号：US13088480

申请日：2011-04-18

Applicant: Yuya Dokai ,  Nihei Kaishita ,  Hiroshi Nonogaki ,  Ryohei Goto ,  Takahiro Yamaguchi ,  Kazuyuki Ikeda

Inventor： Yuya Dokai ,  Nihei Kaishita ,  Hiroshi Nonogaki ,  Ryohei Goto ,  Takahiro Yamaguchi ,  Kazuyuki Ikeda

IPC: H01Q1/38 ,  H01Q1/22 ,  H01Q7/00

CPC classification number: H01Q1/38 ,  H01Q1/2225 ,  H01Q7/00

Abstract: A wireless IC device includes a substantially rectangular parallelepiped dielectric body, a metal pattern that is provided on the surface of the dielectric body via a film and functions as a radiator, and a wireless IC element coupled to feeding portions of the metal pattern. The dielectric body has a laminated structure including a folded flexible dielectric layer. Surfaces of the dielectric layer which face each other after the dielectric layer has been folded are non-bonded surfaces.

Abstract translation: 无线IC器件包括基本上为长方体的电介体，金属图案，其通过膜设置在电介质体的表面上并用作散热器，以及耦合到金属图案的馈电部分的无线IC元件。 电介质体具有包括折叠的柔性介电层的叠层结构。 在电介质层折叠之后彼此面对的电介质层的表面是非接合表面。