公开(公告)号：US20050200029A1

公开(公告)日：2005-09-15

申请号：US11115205

申请日：2005-04-27

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H01L23/28

CPC classification number: H01L23/3107 ,  H01L23/3114 ,  H01L23/49816 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/02125 ,  H01L2224/0401 ,  H01L2224/051 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05548 ,  H01L2224/05552 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

Abstract: A semiconductor device comprising: a semiconductor element having a plurality of electrodes; a passivation film formed on the semiconductor element in a region avoiding at least a part of each of the electrodes; a conductive foil provided at a given spacing from the surface on which the passivation film is formed; an external electrodes formed on the conductive foil; intermediate layer formed between the passivation film and the conductive foil to support the conductive foil; and wires electrically connecting the electrodes to the conductive foil; wherein a depression tapered in a direction from the conductive foil to the passivation film if formed under a part of the conductive foil that includes the connection with the external electrodes.

Abstract translation: 一种半导体器件，包括：具有多个电极的半导体元件; 在避免每个电极的至少一部分的区域中形成在半导体元件上的钝化膜; 以与形成有钝化膜的表面成一定距离设置的导电箔; 形成在导电箔上的外部电极; 形成在钝化膜和导电箔之间的中间层以支撑导电箔; 以及将电极与导电箔电连接的导线; 如果形成在包括与外部电极的连接的导电箔的一部分下方，则在从导电箔到钝化膜的方向上渐缩的凹陷。

公开(公告)号：US20050190528A1

公开(公告)日：2005-09-01

申请号：US11019032

申请日：2004-12-20

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L23/52 ,  H01G4/228 ,  H01L21/3205 ,  H01L21/60 ,  H01L21/77 ,  H01L21/822 ,  H01L23/12 ,  H01L23/31 ,  H01L23/48 ,  H01L23/485 ,  H01L25/065 ,  H01L25/07 ,  H01L25/10 ,  H01L25/18 ,  H01L27/04

CPC classification number: H01L23/3114 ,  H01L23/481 ,  H01L24/13 ,  H01L24/17 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/02372 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05548 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: An electronic component includes a substrate; a functional part that is formed beneath at least one of a front face and a bottom face of the substrate and that performs a predetermined function; a plurality of terminals that is formed on the front face or the bottom face of the substrate and that is connected to the functional part; a plurality of outer electrodes formed on the front face and the bottom face of the substrate; and interconnection lines, formed on the front face and the bottom face of the substrate, for connecting the terminals on the front face or the bottom face of the substrate to the outer electrodes.

Abstract translation: 电子部件包括基板; 形成在所述基板的正面和底面中的至少一方的功能部件，并进行规定的功能; 多个端子，其形成在所述基板的正面或底面上并且连接到所述功能部件; 形成在基板的正面和底面上的多个外电极; 以及形成在基板的前表面和底面上的互连线，用于将基板的正面或底面上的端子连接到外电极。

公开(公告)号：US06897094B2

公开(公告)日：2005-05-24

申请号：US10365615

申请日：2003-02-12

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L23/12 ,  H01L21/56 ,  H01L23/31 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L23/3135 ,  H01L23/3121 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15311

Abstract: A semiconductor chip is adhered to a substrate by using an adhesive, and a sealant is provided around the semiconductor chip, on a surface of the substrate on which the semiconductor chip is mounted. The adhesive is provided to reach a side surface of the semiconductor chip. The sealant is provided in a manner to expose an upper surface of the semiconductor chip and a part of the adhesive.

公开(公告)号：US20050100630A1

公开(公告)日：2005-05-12

申请号：US10978377

申请日：2004-11-02

Applicant: Mitsushi Yoshioka ,  Nobuaki Hashimoto

Inventor： Mitsushi Yoshioka ,  Nobuaki Hashimoto

IPC: B29C45/17 ,  B29C45/84 ,  B29C45/18

CPC classification number: B29C45/1744 ,  B29C45/1775 ,  B29C45/1777 ,  B29C2045/1797

Abstract: A connecting member is formed by an upper plate portion and a side plate portion. One end of the upper plate portion is fixed to a fixed platen of an injection molding machine, and a lower end of the side plate portion is fixed to a base frame to which the fixed platen is fixed. This connecting member prevents the fixed platen from being tilted when a nozzle touch force is applied from an injection apparatus.

Abstract translation: 连接构件由上板部分和侧板部分形成。 上板部的一端固定在注塑机的固定台板上，侧板部的下端固定在固定台板固定的基座上。 当从注射装置施加喷嘴接触力时，该连接构件防止固定压板倾斜。

公开(公告)号：US06867496B1

公开(公告)日：2005-03-15

申请号：US09856627

申请日：2000-09-29

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L23/498 ,  H01L23/538 ,  H01L23/544 ,  H05K1/14 ,  H05K1/18 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/49816 ,  H01L23/5387 ,  H01L23/544 ,  H01L2223/54473 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H05K1/141 ,  H05K1/189 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A semiconductor device including a substrate (10). An interconnect pattern (12) is formed over the substrate (10), and the substrate (10) has a first portion (14) and a second portion (16) to be superposed on the first portion (14). The first portion (14) has edges (22), (24), (26) and (28) as positioning references. The second portion (16) has a shape to be superposed over the first portion (14) except the edges (22), (24), (26) and (28).

Abstract translation: 一种包括衬底（10）的半导体器件。 在衬底（10）上方形成有互连图形（12），并且衬底（10）具有第一部分（14）和第二部分（16）以重叠在第一部分（14）上。 第一部分（14）具有作为定位参考的边缘（22），（24），（26）和（28）。 第二部分（16）具有除了边缘（22），（24），（26）和（28）之外的重叠在第一部分（14）上的形状。

公开(公告)号：US20050053686A1

公开(公告)日：2005-03-10

申请号：US10936655

申请日：2004-09-09

Applicant: Motohiro Nagaya ,  Tatsuya Kawasaki ,  Nobuaki Hashimoto

Inventor： Motohiro Nagaya ,  Tatsuya Kawasaki ,  Nobuaki Hashimoto

IPC: B29C45/20 ,  B29C45/07 ,  B29C45/17 ,  B29C45/76 ,  B29C45/77

CPC classification number: B29C45/1777

Abstract: A nozzle touch mechanism which does not allow an injection unit to move back by the force of inertia at the time of acceleration of injection and prevents leakage of the molten resin. A damper is arranged between the injection unit and a stationary platen secured to a base, so as to generate a strong braking force only at the time of high acceleration of the injection unit. A ball screw is rotated by driving an electric motor to move forward a nut member screwed onto the ball screw, whereby the injection unit is moved via a spring. When the injection unit is stopped by contacting a nozzle to a metal mold, the spring is contracted. When the amount of contraction of the spring reaches a predetermined value, the motor is stopped and locked such that the nozzle touch force corresponding to the amount of contraction of the spring is generated. Even though the injection unit undergoes the force working to move back the unit due to the inertia force at the time of acceleration of the injection, the injection unit is not moved back because the damper substantially prevents the movement back of the unit and the leakage of molten resin.

Abstract translation: 喷嘴接触机构，其不允许注射单元在加速注射时通过惯性力向后移动，并防止熔融树脂泄漏。 在注射单元和固定在基座上的固定的压板之间设置阻尼器，以便仅在注射单元的高加速度时产生强的制动力。 通过驱动电动机使滚珠丝杠旋转，使拧入滚珠丝杠的螺母部件向前移动，由此通过弹簧移动注射单元。 当注射单元通过使喷嘴与金属模具接触来停止时，弹簧收缩。 当弹簧的收缩量达到预定值时，马达停止并锁定，从而产生与弹簧的收缩量对应的喷嘴接触力。 即使注射单元由于注射加速时的惯性力而经受力作用以移动单元，所以注射单元不会向后移动，因为阻尼器基本上防止了单元的运动和泄漏 熔融树脂。

公开(公告)号：US20050053685A1

公开(公告)日：2005-03-10

申请号：US10936654

申请日：2004-09-09

Applicant: Motohiro Nagaya ,  Tatsuya Kawasaki ,  Nobuaki Hashimoto

Inventor： Motohiro Nagaya ,  Tatsuya Kawasaki ,  Nobuaki Hashimoto

IPC: B29C45/20 ,  B29C45/17 ,  B29C45/76 ,  B29C45/77

CPC classification number: B29C45/1777 ,  B29C45/76 ,  B29C2945/76006 ,  B29C2945/76083 ,  B29C2945/7611 ,  B29C2945/76113 ,  B29C2945/76187 ,  B29C2945/76307 ,  B29C2945/76381 ,  B29C2945/76498 ,  B29C2945/76505 ,  B29C2945/76511 ,  B29C2945/76525 ,  B29C2945/76568 ,  B29C2945/76595 ,  B29C2945/76695 ,  B29C2945/76785 ,  B29C2945/76933 ,  B29C2945/76939

Abstract: A system for controlling nozzle touch force, which is capable of maintaining the touch force relying upon a simple constitution. An electric motor moves the injection unit forward via a spring to bring a nozzle into contact with a metal mold. Further, the spring is compressed to impart a preset nozzle touch force. In the injection/pressure-maintaining step, the screw is driven, and a position/speed detector provided on a servo motor for injecting the resin detects the injection speed at regular intervals. A force produced by the force of inertia of the moving portions such as the injection screw and the pusher plate that move due to the injection operation, is found from the acceleration that is found from the injection speed. The amount of compression of the spring is controlled by varying the rotational position of the motor by an amount corresponding to the force that is found to maintain the nozzle touch force constant. Since the nozzle touch force is maintained constant, no resin leaks and an excess of nozzle touch force is not produced, either.

Abstract translation: 一种用于控制喷嘴接触力的系统，其能够依靠简单的构造保持接触力。 电动机通过弹簧向前移动注射单元，使喷嘴与金属模具接触。 此外，弹簧被压缩以赋予预设的喷嘴接触力。 在注射/保压步骤中，螺杆被驱动，设置在用于注射树脂的伺服电动机上的位置/速度检测器以规律的间隔检测注射速度。 根据从注射速度发现的加速度，发现由注射操作而移动的诸如注射螺杆和推动板的移动部分的惯性力产生的力。 弹簧的压缩量通过将电动机的旋转位置改变为与发现保持喷嘴接触力恒定的力相对应的量来控制。 由于喷嘴接触力保持恒定，所以也不会产生树脂泄漏，也不会产生过度的喷嘴接触力。

公开(公告)号：US20050023652A1

公开(公告)日：2005-02-03

申请号：US10918449

申请日：2004-08-16

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L23/522 ,  H01L25/065 ,  H01L25/18 ,  H01L23/495

CPC classification number: H01L25/0657 ,  H01L23/3114 ,  H01L23/49575 ,  H01L23/525 ,  H01L23/562 ,  H01L25/0652 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83101 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/00012

Abstract: An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (10) having a semiconductor chip (12) with electrodes (16), a stress-relieving layer (14) prepared on the semiconductor chip (12), a wire (18) formed across the electrodes (16) and the stress-relieving layer (14), and solder balls (19) formed on the wire (18) over the stress-relieving layer (14); and a bare chip (20) as a second semiconductor device to be electrically connected to the first semiconductor device (10).

Abstract translation: 一种集成型半导体器件，其能够降低成本或提高将半导体芯片连接在一起或将芯片连接到电路板的可靠性。 这种集成型半导体器件的一个实施例包括具有电极（16）的半导体芯片（12）和在半导体芯片（12）上制备的应力消除层（14）的第一半导体器件（10） 18）形成在电极（16）和应力消除层（14）之间，以及形成在线（18）上的应力消除层（14）上的焊球（19）; 以及作为与第一半导体器件（10）电连接的第二半导体器件的裸芯片（20）。

公开(公告)号：US06815815B2

公开(公告)日：2004-11-09

申请号：US09991931

申请日：2001-11-26

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L2304

CPC classification number: H01L24/10 ,  H01L21/486 ,  H01L21/563 ,  H01L23/13 ,  H01L23/16 ,  H01L23/24 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15183 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/112 ,  H05K3/3457 ,  H05K3/386 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/0394 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05647 ,  H01L2224/05099 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: The semiconductor device comprises an insulating film in which penetrating holes are formed, a semiconductor chip having electrodes, a wiring pattern adhered by an adhesive over a region including penetrating holes on one side of the insulating film and electrically connected to the electrodes of the semiconductor chip, and external electrodes provided on the wiring pattern through the penetrating holes and projecting from the surface opposite to the surface of the substrate on which the wiring pattern is formed. Part of the adhesive is drawn in to be interposed between the penetrating holes and external electrodes.

Abstract translation: 半导体器件包括其中形成有穿透孔的绝缘膜，具有电极的半导体芯片，通过粘合剂粘附在包括在绝缘膜的一侧上的穿透孔的区域上的电连接到半导体芯片的电极的布线图案 以及通过贯通孔设置在布线图案上并从与形成布线图案的基板的表面相反的表面突出的外部电极。 粘合剂的一部分被拉入以插入在穿透孔和外部电极之间。

公开(公告)号：US06798058B1

公开(公告)日：2004-09-28

申请号：US09673208

申请日：2000-10-13

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L2348

CPC classification number: H01L24/86 ,  H01L21/563 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0393 ,  H05K1/112 ,  H05K3/242 ,  H05K3/243 ,  H05K3/323 ,  H05K3/422 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2201/0394 ,  H05K2203/049 ,  H05K2203/072 ,  H05K2203/0733 ,  H05K2203/1476 ,  H05K2203/1545 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671

Abstract: There is provided a semiconductor device comprising: a first plating layer formed on one surface of an interconnect pattern; a second plating layer formed within through holes in the interconnect pattern; a semiconductor chip electrically connected to the first plating layer; an anisotropic conductive material provided on the first plating layer; and a conductive material provided on the second plating layer, wherein the first plating layer has appropriate adhesion properties with the anisotropic conductive material, and the second plating layer has appropriate adhesion properties with the conductive material.

Abstract translation: 提供了一种半导体器件，包括：形成在互连图案的一个表面上的第一镀层; 形成在所述互连图案中的通孔内的第二镀层; 电连接到第一镀层的半导体芯片; 设置在第一镀层上的各向异性导电材料; 以及设置在所述第二镀层上的导电材料，其中所述第一镀层与所述各向异性导电材料具有适当的粘合性，并且所述第二镀层与所述导电材料具有适当的粘合性能。